JPH0574270B2 - - Google Patents
Info
- Publication number
- JPH0574270B2 JPH0574270B2 JP59068086A JP6808684A JPH0574270B2 JP H0574270 B2 JPH0574270 B2 JP H0574270B2 JP 59068086 A JP59068086 A JP 59068086A JP 6808684 A JP6808684 A JP 6808684A JP H0574270 B2 JPH0574270 B2 JP H0574270B2
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- holder
- optical
- solid
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 64
- 238000003384 imaging method Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 4
- 239000000428 dust Substances 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、固体撮像素子を使用した撮像装置
に関するものであり、特に、固体撮像素子、光学
フイルタ、撮像用レンズ等の機械的結合の構成に
関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an imaging device using a solid-state imaging device, and in particular, to a structure of mechanical coupling of a solid-state imaging device, an optical filter, an imaging lens, etc. It is related to.
一般的に、固体撮像装置では、シヤープでコン
トラスト良く、ケラレ、片ボケ等のない画像を得
るには、レンズで受けた光を位置精度良く、撮像
面に結像させる必要がある。第４図は、レンズ５
１に入射された光束５２が撮像面５３に結像され
る状態を示すものであり、５４は、レンズ有効像
円を示す。第４図において、αで示す光軸のズレ
がレンズ５１と撮像面５３との間にあるときに
は、撮像された画のケラレ、画のタオレが生じ
る。また、撮像された画の片ボケを防止するた
め、レンズ５１の光軸と撮像面５３の垂直精度を
合わせ、かつバツクフオーカスＺを合わせる必要
がある。したがつて、固体撮像装置では、光軸の
Ｘ及びＹ方向の調整、バツクフオーカスＺの調整
が必要であり、更に、アオリθx及びθyの調整が必
要であつた。また、固体撮像装置は、感度が良好
なため、撮像素子の前面のシールガラスや、光学
フイルタの光路系にゴミが付着すると、画に点と
なつて表れる。
Generally, in a solid-state imaging device, in order to obtain an image that is sharp, has good contrast, and is free from vignetting, blur, etc., it is necessary to form an image on the imaging surface using light received by a lens with good positional accuracy. Figure 4 shows lens 5.
1 shows a state in which a light beam 52 incident on 1 is imaged on an imaging surface 53, and 54 indicates a lens effective image circle. In FIG. 4, when there is a misalignment of the optical axis indicated by α between the lens 51 and the imaging surface 53, vignetting and blurring of the captured image occur. Furthermore, in order to prevent one-sided blurring of the captured image, it is necessary to match the vertical accuracy of the optical axis of the lens 51 and the imaging surface 53, and also to match the back focus Z. Therefore, in the solid-state imaging device, it is necessary to adjust the optical axis in the X and Y directions, to adjust the back focus Z, and also to adjust the tilt angles θ x and θ y . Furthermore, since solid-state imaging devices have good sensitivity, if dust adheres to the seal glass on the front surface of the imaging device or the optical path system of the optical filter, it will appear as dots on the image.
第５図Ａ及び第５図Ｂは、従来の固体撮像装置
の一例を示すもので、６１がレンズ、６２が固体
撮像素子、６３が光学フイルタ、６４がフレーム
である。固体撮像素子６２が基板６５に取り付け
られ、この基板６５がフレーム６４に複数本のビ
ス６６，６７，６８及び基板抑え６９などにより
取付けられ、フレーム６４の対面にレンズ６１が
取り付けられる。また、フレーム６４に基板６５
及び光学フイルタ６３を取付ける場合に、ゴムシ
ール７０及び７１が設けられている。 5A and 5B show an example of a conventional solid-state imaging device, in which 61 is a lens, 62 is a solid-state imaging device, 63 is an optical filter, and 64 is a frame. A solid-state image sensor 62 is attached to a substrate 65, and this substrate 65 is attached to a frame 64 with a plurality of screws 66, 67, 68 and a substrate retainer 69. A lens 61 is attached to the opposite side of the frame 64. Also, a board 65 is attached to the frame 64.
When installing the optical filter 63, rubber seals 70 and 71 are provided.
かかる従来の固体撮像装置は、固体撮像素子６
２を直接的に基板６５に取り付け、基板６５のフ
レーム６４についての取付位置をビスによつて補
正することにより、レンズ６１との位置関係を調
整しているため、前述のような光軸、アオリ、バ
ツクフオーカス等を調整する作業が絵出ししなが
ら行なうものとなり、大変面倒であつた。これと
共に、部品点数を多く必要とし、大形な装置とな
る欠点があつた。 Such a conventional solid-state imaging device includes a solid-state imaging device 6
2 is attached directly to the board 65, and the positional relationship with the lens 61 is adjusted by correcting the mounting position of the board 65 with respect to the frame 64 with screws, so the optical axis and tilt angle as described above are adjusted. , back focus, etc. had to be done while drawing the picture, which was very troublesome. Along with this, there was a drawback that a large number of parts were required and the device became large.
また、従来の固体撮像装置は、基板６５への固
体撮像素子６２の取付け、光学フイルタ６３の取
付けは、多数の機械部品を組立てる必要があるた
め、一般の作業環境の作業場で組立てるのが普通
である。従つて、微少なゴミの付着の防止が困難
となり、光路系のゴミの拭き取り作業が面倒であ
り、然も、信頼性の低下を招く問題点があつた。 In addition, in conventional solid-state imaging devices, mounting the solid-state imaging element 62 to the substrate 65 and mounting the optical filter 63 requires assembling many mechanical parts, so it is usually assembled in a workplace in a normal working environment. be. Therefore, it is difficult to prevent minute dust from adhering to the optical path system, and wiping off dust from the optical path system is troublesome, and there are also problems that lead to a decrease in reliability.
したがつて、この発明の目的は、組立工程時
に、レンズ、光学フイルタの光軸、アオリなどの
寸法精度を容易に出すことができる固体撮像装置
を提供することにある。
Therefore, an object of the present invention is to provide a solid-state imaging device that can easily achieve dimensional accuracy of lenses, optical axes of optical filters, tilt, etc. during the assembly process.
この発明の他の目的は、部品点数が少なくてす
み、小形、軽量な固体撮像装置を提供することに
ある。 Another object of the present invention is to provide a solid-state imaging device that has a small number of parts, is small in size, and is lightweight.
この発明の更に他の目的は、固体撮像素子の組
立と光学フイルタ、レンズなどを組立てる固体撮
像装置の組立とを半導体の組立用無塵室にて一貫
して行なうことができ、光路系のゴミの付着を容
易に防止できる固体撮像装置を提供することにあ
る。 Still another object of the present invention is that the assembly of a solid-state image sensor and the assembly of a solid-state image sensor, in which optical filters, lenses, etc. are assembled, can be carried out in a dust-free chamber for semiconductor assembly. An object of the present invention is to provide a solid-state imaging device that can easily prevent the adhesion of particles.
この発明は、固体撮像素子が取り付けられた撮
像素子パツケージと、撮像素子パツケージが所定
の位置に配される凹部を有する撮像素子ホルダ
と、撮像素子ホルダの前面に密着された状態で撮
像素子ホルダと固着される基部及び基部に垂直に
延長された円筒体を有する光学部ホルダと、円筒
体内に固定される光学フイルタと、円筒体内にレ
ンズ鏡筒が同軸的に嵌合されるレンズとを備えた
固体撮像装置である。
The present invention includes an image sensor package to which a solid-state image sensor is attached, an image sensor holder having a recess in which the image sensor package is arranged at a predetermined position, and an image sensor holder that is in close contact with the front surface of the image sensor holder. An optical unit holder having a base fixed to the base and a cylindrical body extending perpendicularly to the base, an optical filter fixed within the cylindrical body, and a lens having a lens barrel coaxially fitted within the cylindrical body. It is a solid-state imaging device.
以下、この発明の一実施例について第１図、第
２図及び第３図を参照して説明する。この実施例
は、固体撮像素子としてCCD撮像素子を用いた
ものである。
An embodiment of the present invention will be described below with reference to FIGS. 1, 2, and 3. This embodiment uses a CCD image sensor as the solid-state image sensor.
第１図において、１が光学部ホルダ、２がレン
ズ鏡筒であり、レンズ鏡筒２には、レンズ３Ａ及
び３Ｂが配設されている。レンズ部を除くこの一
実施例の分解斜視図を第２図に示す。第２図にお
いて、４が金属製のCCDホルダ、５がセラミツ
ク製のCCDパツケージ、６が防塵用のゴムパツ
キング、７が金属又は樹脂成型面で形成された光
学部ホルダの基部、８が光学フイルタ、９がフイ
ルタ抑えである。第１図に示すように、光学ホル
ダ１の円筒部１０内にレンズ鏡筒２が同軸的に嵌
合され、CCDパツケージ６とレンズ鏡筒２との
位置関係が規定される。レンズ鏡筒２は、ビス１
１によりバツクフオーカスが調整された位置にお
いて光学部ホルダ１と固定される。 In FIG. 1, 1 is an optical part holder, 2 is a lens barrel, and the lens barrel 2 is provided with lenses 3A and 3B. An exploded perspective view of this embodiment excluding the lens portion is shown in FIG. In FIG. 2, 4 is a metal CCD holder, 5 is a ceramic CCD package, 6 is a rubber packing for dustproofing, 7 is the base of the optical part holder formed of a metal or resin molded surface, 8 is an optical filter, 9 is the filter suppressor. As shown in FIG. 1, the lens barrel 2 is coaxially fitted into the cylindrical portion 10 of the optical holder 1, and the positional relationship between the CCD package 6 and the lens barrel 2 is defined. Lens barrel 2 is attached with screw 1
1, the optical part holder 1 is fixed at the position where the back focus is adjusted.
CCDパツケージ５は、位置精度を安定に高く
するために、セラミツクから成るもので、この
CCDパツケージ５の中央に形成された凹部底面
のメタライズ層に、CCDチツプ１２が銀ペース
トによりダイボンドされ、次にワイヤボンデイン
グされ、その上に色分解フイルタ１３が積層さ
れ、前面がシールガラス１４により覆われたもの
である。図示せずも、色分解フイルタ１３とシー
ルガラス１４との間にフレア防止板を設けても良
い。CCDパツケージ５からは、リード１５が導
出されている。このCCDパツケージ５には、左
右の辺部に対称にねじ穴１６及び位置決め穴１７
が穿設されている。 The CCD package 5 is made of ceramic to ensure stable and high positioning accuracy.
A CCD chip 12 is die-bonded with silver paste and then wire-bonded to the metallized layer on the bottom of the recess formed in the center of the CCD package 5. A color separation filter 13 is laminated thereon, and the front surface is covered with a sealing glass 14. It was given to me. Although not shown, a flare prevention plate may be provided between the color separation filter 13 and the seal glass 14. A lead 15 is led out from the CCD package 5. This CCD package cage 5 has screw holes 16 and positioning holes 17 symmetrically located on the left and right sides.
is drilled.
第２図に示される各部品の組立は、CCDパツ
ケージ５をCCDホルダ４に固着し、光学部ホル
ダ１の円筒体１０内に光学フイルタ８を取付け、
次に、CCDホルダ４と光学部ホルダ１の基部７
とをゴムパツキング６を介して固着することによ
つてなされる。CCDホルダ４は、CCDパツケー
ジ５が嵌合される凹部とリード１５を導出するス
リツトを有している。この凹部の底面には、左右
対称にねじ穴２１が穿設されていると共に、左右
対称に位置決めのためのピン２２が圧入により植
立されている。CCDホルダ４の凹部に、ピン２
２がCCDパツケージ５の位置決め穴１７内に挿
入されるように、CCDパツケージ５が挿入され
る。そして、一対のねじ２３がねじ穴１６及び２
１に螺合されることにより、CCDホルダ４に
CCDパツケージ５が固着される。 The assembly of each part shown in FIG. 2 involves fixing the CCD package 5 to the CCD holder 4, installing the optical filter 8 inside the cylindrical body 10 of the optical part holder 1, and
Next, the CCD holder 4 and the base 7 of the optical part holder 1
This is done by fixing them through rubber packing 6. The CCD holder 4 has a recess into which the CCD package 5 is fitted and a slit through which the leads 15 are led out. In the bottom of this recess, screw holes 21 are drilled symmetrically, and pins 22 for positioning are press-fitted symmetrically. Insert pin 2 into the recess of CCD holder 4.
The CCD package 5 is inserted so that the CCD package 2 is inserted into the positioning hole 17 of the CCD package 5. Then, a pair of screws 23 are inserted into the screw holes 16 and 2.
1 to the CCD holder 4.
The CCD package cage 5 is fixed.
CCDホルダ４の略々対角線方向の一方に、一
対のねじ穴２５が設けられ、他方の略々対角線方
向に一対のねじ穴２６が設けられ、このねじ穴２
６の近傍に一対の位置決め用のピン２７が圧入に
より植立されている。これらのねじ穴２５，２６
及びピン２７は、後述するように、CCDホルダ
４と光学部ホルダ１の合体のために使用される。 A pair of screw holes 25 are provided on one side of the CCD holder 4 in a diagonal direction, and a pair of screw holes 26 are provided on the other side of the CCD holder 4 in a diagonal direction.
A pair of positioning pins 27 are press-fitted near 6. These screw holes 25, 26
The pin 27 is used for combining the CCD holder 4 and the optical part holder 1, as will be described later.
光学部ホルダ１の円筒部１０の底面には、第３
図Ａに示すように、矩形の開口３１が形成され、
この開口３１の周辺に沿つて段部３２が設けられ
ている。円筒部１０内に挿入された光学フイルタ
８がこの段部３２に係合される。光学フイルタ８
は、赤外カツトフイルタと複数枚の水晶板からな
る光学的ローパスフイルタとが積層されたもの
で、第２図に示すように、円板状の一部が垂直に
切り落とされた形状とされている。この光学フイ
ルタ８の形状は、光学部ホルダ１の段部３２の形
状と一致し、光学フイルタ８を正しい光学軸の関
係でもつて取付けることが可能とされている。円
筒部１０内の段部３２に嵌合された状態で光学フ
イルタ８の前面からフイルタ抑え９がねじ込みに
より取付けられる。 The bottom surface of the cylindrical portion 10 of the optical part holder 1 has a third
As shown in Figure A, a rectangular opening 31 is formed,
A stepped portion 32 is provided along the periphery of this opening 31. The optical filter 8 inserted into the cylindrical portion 10 is engaged with this stepped portion 32 . optical filter 8
is a stack of an infrared cut filter and an optical low-pass filter made up of multiple crystal plates, and as shown in Figure 2, it is shaped like a disk with part of it cut off vertically. . The shape of this optical filter 8 matches the shape of the stepped portion 32 of the optical unit holder 1, so that the optical filter 8 can be mounted with the correct optical axis relationship. A filter retainer 9 is screwed onto the front surface of the optical filter 8 while being fitted into the stepped portion 32 within the cylindrical portion 10 .
更に、光学部ホルダ１の円筒部１０に同軸的に
レンズ鏡筒２が嵌合される。したがつて、光学部
ホルダ１の寸法精度即ち基部７と円筒部１０とに
よつて、レンズ３Ａ，３Ｂの光軸が基部７と垂直
に保持される。この基部７には、CCDパツケー
ジ５がCCDホルダ４を介して固着されているの
で、CCDチツプ１２がレンズ３Ａ，３Ｂの光軸
に対して垂直に保持されることになる。 Furthermore, the lens barrel 2 is coaxially fitted into the cylindrical portion 10 of the optical unit holder 1 . Therefore, the optical axes of the lenses 3A and 3B are held perpendicular to the base 7 due to the dimensional accuracy of the optical unit holder 1, that is, the base 7 and the cylindrical portion 10. Since the CCD package 5 is fixed to the base 7 via the CCD holder 4, the CCD chip 12 is held perpendicular to the optical axis of the lenses 3A and 3B.
光学部ホルダ１の背面には、開口３１を囲む形
状に溝３４が設けられ、この溝３４内にゴムパツ
キング６が挿入される。光学部ホルダ１には、第
３図Ａ及び第３図Ｂに示すように、その略々対角
線方向の一方に位置する一対のねじ穴２５が形成
され、略々対角線方向の他方に位置する一対のね
じ穴３６が形成され、ねじ穴３６の近傍に一対の
位置決め穴３７が穿設されている。CCDパツケ
ージ５が固着されたCCDホルダ４に対し、光学
フイルタ８が取り付けられた光学部ホルダ１がゴ
ムパツキング６を介して積層される。この場合、
ピン２７が位置決め穴３７内に挿入されるように
なされる。この状態で前面から一対のねじ３８が
ねじ穴３５，２５に螺合されると共に、背面から
一対のねじ２８がねじ穴２６，３６に螺合され
る。このようにして、CCD撮像装置が組立てら
れる。 A groove 34 is provided on the back surface of the optical part holder 1 in a shape surrounding the opening 31, and the rubber packing 6 is inserted into the groove 34. As shown in FIGS. 3A and 3B, the optical part holder 1 is formed with a pair of screw holes 25 located on one side of the diagonal, and a pair of screw holes 25 located on the other side of the diagonal. A screw hole 36 is formed, and a pair of positioning holes 37 are bored near the screw hole 36. An optical part holder 1 to which an optical filter 8 is attached is stacked on a CCD holder 4 to which a CCD package 5 is fixed, with a rubber packing 6 interposed therebetween. in this case,
The pin 27 is inserted into the positioning hole 37. In this state, a pair of screws 38 are screwed into the screw holes 35, 25 from the front, and a pair of screws 28 are screwed into the screw holes 26, 36 from the back. In this way, the CCD imaging device is assembled.
なお、この発明は、CCD撮像素子以外のMOS
撮像素子などの固定撮像素子についても同様に適
用することができる。また、レンズは、交換レン
ズを用いても良く、そのための係合手段を光学部
ホルダに設けるようにしても良い。 Note that this invention applies to MOS devices other than CCD image sensors.
The present invention can be similarly applied to a fixed image sensor such as an image sensor. Moreover, an interchangeable lens may be used as the lens, and an engagement means for this may be provided in the optical part holder.
この発明に依れば、CCDパツケージ５に予め
CCDチツプをダイポンドしておき、CCDホルダ
４に位置決め手段により所定の位置関係で取付
け、更に、光軸が一致するように、レンズ及び光
学フイルタ８が取付けられた光学部ホルダ１に位
置決め手段により所定の位置関係で結合できる。
したがつて、機構的な方法や、光学的測定による
方法によつて、光軸、アオリなどの精度を出すこ
とができ、調整作業を従来のものに比して簡単に
行ないうる。
According to this invention, the CCD package 5 has a
A CCD chip is die-bonded and mounted on the CCD holder 4 in a predetermined positional relationship using a positioning means.Furthermore, the CCD chip is mounted on the CCD holder 4 in a predetermined positional relationship using a positioning means. Can be combined using the positional relationship.
Therefore, the accuracy of the optical axis, tilt, etc. can be achieved by a mechanical method or a method using optical measurement, and adjustment work can be performed more easily than in the conventional method.
また、個々の部品を１個のフレームに順に取付
ける必要がなく、光学部ホルダ１が光学部と固体
撮像素子の両者を支持しているので、部品点数を
少なくでき、小型、軽量の固体撮像装置を実現で
きる。然も、組立は、数点の機械的部品及びビス
部により行なえば良いので、半導体用の無塵室に
て一貫して組立を行なうことができ、ゴミの付着
を確実に防止することが容易とできる。 In addition, since there is no need to sequentially attach individual parts to one frame, and the optical part holder 1 supports both the optical part and the solid-state image sensor, the number of parts can be reduced, resulting in a compact and lightweight solid-state imaging device. can be realized. However, since assembly only requires a few mechanical parts and screws, assembly can be done consistently in a dust-free room for semiconductors, making it easy to reliably prevent dust from adhering. It can be done.
第１図はこの発明の一実施例の断面図、第２図
はこの発明の一実施例のCCDユニツトの分解斜
視図、第３図はこの発明の一実施例における光学
部ホルダの平面図及び底面図、第４図は固体撮像
装置の説明に用いる略線図、第５図は従来の固体
撮像装置の説明に用いる断面図及び底面図であ
る。
１……光学部ホルダ、２……レンズ鏡筒、３
Ａ，３Ｂ……レンズ、４……CCDホルダ、５…
…CCDパツケージ、７……光学部ホルダの基部、
８……光学フイルタ、９……フイルタ抑え、１０
……光学部ホルダの円筒部、１２……CCDチツ
プ、１３……色分解フイルタ。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is an exploded perspective view of a CCD unit of an embodiment of the invention, and Fig. 3 is a plan view and a view of an optical part holder in an embodiment of the invention. 4 is a schematic diagram used to explain the solid-state imaging device, and FIG. 5 is a sectional view and a bottom view used to explain the conventional solid-state imaging device. 1...Optical unit holder, 2...Lens barrel, 3
A, 3B...lens, 4...CCD holder, 5...
...CCD package cage, 7...base of optical part holder,
8...Optical filter, 9...Filter suppressor, 10
... Cylindrical part of the optical part holder, 12 ... CCD chip, 13 ... Color separation filter.
Claims (1)
ケージと、 上記撮像素子パツケージが所定の位置に配され
る凹部を有する撮像素子ホルダと、 撮像素子の光軸中心、水平及び垂直方向の位
置、傾きの精度を保つように、上記撮像素子パツ
ケージと上記撮像素子ホルダとの位置関係を規制
する位置決めピン及び上記撮像素子パツケージと
光学ホルダとの位置関係を規制する位置決めピン
と、 上記撮像素子ホルダの前面に密着された状態で
上記撮像素子ホルダと固着される基部及びこの基
部に垂直に延長された円筒体を有する光学ホルダ
と、 上記撮像素子パツケージと上記光学ホルダとの
間に介装される弾性部材と、 上記円筒体内に固定される光学フイルタと、 上記円筒体内にレンズ鏡筒が同軸的に嵌合され
るレンズと を備えた固体撮像装置。 ２ 固体撮像素子が取り付けられた撮像素子パツ
ケージと、上記撮像素子パツケージが所定の位置
に配される凹部を有する撮像素子ホルダと、撮像
素子の光軸中心、水平及び垂直方向の位置、傾き
の精度を保つように、上記撮像素子パツケージと
上記撮像素子ホルダとの位置関係を規制する位置
決めピン及び上記撮像素子パツケージと光学ホル
ダとの位置関係を規制する位置決めピンと、上記
撮像素子ホルダの前面に密着された状態で上記撮
像素子ホルダと固着される基部及びこの基部に垂
直に延長された円筒体を有する光学ホルダと、上
記固体撮像素子パツケージと上記光学ホルダとの
間に介装される弾性部材と、上記円筒体内に固定
される光学フイルタとからなる撮像部を製造して
おき、 上記撮像部の上記円筒体内にレンズ鏡筒を同軸
的に嵌合してレンズを取り付けるようにした固体
撮像素子の生産方法。[Scope of Claims] 1. An image sensor package to which a solid-state image sensor is attached; an image sensor holder having a concave portion in which the image sensor package is arranged at a predetermined position; and a center of the optical axis of the image sensor in horizontal and vertical directions. a positioning pin for regulating the positional relationship between the image sensor package and the image sensor holder and a positioning pin for regulating the positional relationship between the image sensor package and the optical holder so as to maintain the accuracy of the position and inclination of the image sensor; an optical holder having a base fixed to the image sensor holder in close contact with the front surface of the holder and a cylindrical body extending perpendicularly to the base; and an optical holder interposed between the image sensor package and the optical holder. A solid-state imaging device comprising: an elastic member; an optical filter fixed within the cylindrical body; and a lens having a lens barrel coaxially fitted within the cylindrical body. 2. An image sensor package to which a solid-state image sensor is attached, an image sensor holder having a recess in which the image sensor package is placed in a predetermined position, and the accuracy of the optical axis center, horizontal and vertical positions, and tilt of the image sensor. A positioning pin for regulating the positional relationship between the image sensor package and the image sensor holder, and a positioning pin for regulating the positional relationship between the image sensor package and the optical holder, and a positioning pin that is in close contact with the front surface of the image sensor holder so as to maintain the position. an optical holder having a base fixed to the image pickup device holder in a state where the image pickup device holder is in a fixed state, and a cylindrical body extending perpendicularly to the base; an elastic member interposed between the solid-state image pickup device package and the optical holder; Production of a solid-state image sensor, in which an imaging section comprising an optical filter fixed in the cylindrical body is manufactured, and a lens is attached by coaxially fitting a lens barrel into the cylindrical body of the imaging section. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59068086A JPS60212070A (en) | 1984-04-05 | 1984-04-05 | Solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59068086A JPS60212070A (en) | 1984-04-05 | 1984-04-05 | Solid-state image pickup device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60212070A JPS60212070A (en) | 1985-10-24 |
| JPH0574270B2 true JPH0574270B2 (en) | 1993-10-18 |
Family
ID=13363573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59068086A Granted JPS60212070A (en) | 1984-04-05 | 1984-04-05 | Solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60212070A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576267U (en) * | 1992-03-26 | 1993-10-19 | ダイワ精工株式会社 | Battery used in electric reels for fishing, etc. |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0628394B2 (en) * | 1986-01-13 | 1994-04-13 | 株式会社日立製作所 | Solid-state image sensor mounting structure |
| JPS63155016A (en) * | 1986-12-18 | 1988-06-28 | Asahi Optical Co Ltd | Endoscope using solid-state image pickup element |
| JPS63224558A (en) * | 1987-03-13 | 1988-09-19 | Matsushita Electric Ind Co Ltd | Automatic focusing actuator |
| JPS63314978A (en) * | 1987-06-18 | 1988-12-22 | Sanyo Electric Co Ltd | Solid-state image pickup camera |
| JPS649413A (en) * | 1987-07-01 | 1989-01-12 | Matsushita Electric Ind Co Ltd | Crystal optical filter |
| JPH01124774U (en) * | 1988-02-18 | 1989-08-24 | ||
| JPH0721004Y2 (en) * | 1988-10-05 | 1995-05-15 | 京セラ株式会社 | Solid-state image sensor mounting mechanism |
| US6762796B1 (en) * | 1998-08-10 | 2004-07-13 | Olympus Optical Co., Ltd. | Image pickup module having integrated lens and semiconductor chip |
| DE102004009920A1 (en) * | 2004-02-20 | 2005-09-15 | Valeo Schalter Und Sensoren Gmbh | Camera system for use in systems for monitoring surroundings of vehicle comprises plate which contains imaging system, mounting for optics having lugs on either side which slide over plate at base of lens holder |
| JP5170991B2 (en) * | 2006-07-20 | 2013-03-27 | キヤノン株式会社 | Imaging device |
| JP2013120300A (en) * | 2011-12-08 | 2013-06-17 | Hitachi Ltd | Lens unit fitting structure for monitoring cameras |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5927663B2 (en) * | 1981-10-22 | 1984-07-07 | アルプス電気株式会社 | How to remove scrap during press processing |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5927663U (en) * | 1982-08-12 | 1984-02-21 | キヤノン株式会社 | image reading device |
-
1984
- 1984-04-05 JP JP59068086A patent/JPS60212070A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5927663B2 (en) * | 1981-10-22 | 1984-07-07 | アルプス電気株式会社 | How to remove scrap during press processing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0576267U (en) * | 1992-03-26 | 1993-10-19 | ダイワ精工株式会社 | Battery used in electric reels for fishing, etc. |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60212070A (en) | 1985-10-24 |
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| Date | Code | Title | Description |
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| EXPY | Cancellation because of completion of term |