JPH01124774U - - Google Patents
Info
- Publication number
- JPH01124774U JPH01124774U JP1988020459U JP2045988U JPH01124774U JP H01124774 U JPH01124774 U JP H01124774U JP 1988020459 U JP1988020459 U JP 1988020459U JP 2045988 U JP2045988 U JP 2045988U JP H01124774 U JPH01124774 U JP H01124774U
- Authority
- JP
- Japan
- Prior art keywords
- package
- solid
- storage section
- bracket
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第1図乃至第3図は本考案の一実施例に係り、
第1図は側断面図、第2図は分解斜視図、第3図
は固体撮像素子の特性図である。または第4図は
従来例を示す図である。
11……固体撮像素子、10……パツケージ、
15……ブラケツト、15a……収納部、15b
,15c……支持部、22……回路基板、13…
…弾性体、19……基準面板。
1 to 3 relate to an embodiment of the present invention,
FIG. 1 is a side sectional view, FIG. 2 is an exploded perspective view, and FIG. 3 is a characteristic diagram of the solid-state image sensor. Alternatively, FIG. 4 is a diagram showing a conventional example. 11...Solid-state image sensor, 10...Package,
15... Bracket, 15a... Storage section, 15b
, 15c... support part, 22... circuit board, 13...
...Elastic body, 19...Reference face plate.
Claims (1)
記パツケージの前記収納部での固定状態において
、前記パツケージの後面側の突出量に比べ突出量
の大きな支持部を前記収納部の周囲の一部に形成
した絶縁性のブラケツトを備え、 回路基板に前記支持部を当接せしめて、前記パ
ツケージ後面と前記回路基板とを離間せしめた状
態で、前記ブラケツトを前記取付基板に固定する
ことを特徴とする固体撮像素子の取付機構。 (2) 固体撮像素子を密閉したパツケージと、 該パツケージを収納する収納部を有する絶縁性
のブラケツトと、 前記パツケージの前面と前記収納部間に介在す
る弾性部材と、 前記パツケージの後面と当接し、前記パツケー
ジ及び前記弾性部材を挾持して前記ブラケツトに
固定される基準面板、 とを備えることを特徴とする固体撮像素子の取
付機構。[Claims for Utility Model Registration] (1) A package in which a solid-state image sensor is sealed, a storage section for storing and fixing the package, and a rear surface of the package when the package is fixed in the storage section. An insulating bracket is provided, in which a support portion with a larger protrusion amount than the protrusion amount is formed in a part of the periphery of the storage portion, and the support portion is brought into contact with the circuit board to connect the rear surface of the package and the circuit board. A mounting mechanism for a solid-state image sensor, characterized in that the bracket is fixed to the mounting substrate in a spaced apart state. (2) a package in which a solid-state imaging device is sealed; an insulating bracket having a storage section for storing the package; an elastic member interposed between the front surface of the package and the storage section; and an elastic member that abuts the rear surface of the package. 1. A mounting mechanism for a solid-state image sensor, comprising: a reference face plate that clamps the package and the elastic member and is fixed to the bracket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988020459U JPH01124774U (en) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988020459U JPH01124774U (en) | 1988-02-18 | 1988-02-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01124774U true JPH01124774U (en) | 1989-08-24 |
Family
ID=31236845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988020459U Pending JPH01124774U (en) | 1988-02-18 | 1988-02-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01124774U (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60166A (en) * | 1983-06-15 | 1985-01-05 | Mitsubishi Electric Corp | Image pickup device |
JPS6017963U (en) * | 1983-07-15 | 1985-02-06 | 松下電器産業株式会社 | driver device |
JPS60212070A (en) * | 1984-04-05 | 1985-10-24 | Sony Corp | Solid-state image pickup device |
JPS6225926B2 (en) * | 1979-07-30 | 1987-06-05 | Babcock Hitachi Kk | |
JPS6331278A (en) * | 1986-07-24 | 1988-02-09 | Matsushita Electric Ind Co Ltd | Solid-state image pickup device |
-
1988
- 1988-02-18 JP JP1988020459U patent/JPH01124774U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6225926B2 (en) * | 1979-07-30 | 1987-06-05 | Babcock Hitachi Kk | |
JPS60166A (en) * | 1983-06-15 | 1985-01-05 | Mitsubishi Electric Corp | Image pickup device |
JPS6017963U (en) * | 1983-07-15 | 1985-02-06 | 松下電器産業株式会社 | driver device |
JPS60212070A (en) * | 1984-04-05 | 1985-10-24 | Sony Corp | Solid-state image pickup device |
JPS6331278A (en) * | 1986-07-24 | 1988-02-09 | Matsushita Electric Ind Co Ltd | Solid-state image pickup device |
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