JPS6331278A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To contrive the attaiment of a compact and light device by emitting heat generated from a printed board having a driving circuit means for driving a solid-state image pickup element by the thermal conduction and the thermal radiation of a screen plate and suppressing the rise in temperature on the surface of the solid state image pickup element. CONSTITUTION:When a solid-state image pickup device is operated, the temperature in all the printed board 1 is elevated by the thermal element of the solid- state image pickup element driving circuit mounted on the printed board 1. The energy of this heat source is passed to the screen plate 2 through an endothermic plate 6 and passed to the direction of a frame good in thermal conductivity such as aluminium. Accordingly, the heat generated from the printed board 1 is emitted by the thermal conduction and the thermal radiation and the surface temperature of the solid-state image pickup element 4 is hardly elevated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a solid-state imaging device that can be used in video cameras and the like.

Conventional Technology In recent years, with the spread of home video tape recorders (hereinafter referred to as VTRs), expectations have increased for their uses ranging from recording television programs to 8mm camera-like functions. , VTRs have become smaller and lighter.

There is a strong demand for a VTR with an integrated video camera that consumes low power and is easy to maintain.

Hereinafter, a solid-state imaging device that can be installed in the conventional video camera integrated VTR described above will be described with reference to the drawings. FIG. 3 is a sectional view of a main part showing a conventional configuration.

In Fig. 3, 1 is a printed circuit board containing a circuit for driving the solid-state imaging device, 3 is a frame for fixing the printed circuit board 1, 4 is a solid-state imaging device that converts optical information into electrical signals, and 5 is an automatic This is the inner frame of the lens that houses the bimorph for focusing. 7 is a rolled case that prevents high frequency interference generated by the solid-state image sensor drive circuit;
9 is a lens that forms an image of the subject on a solid-state image sensor;
10 is a connector that electrically connects the first printed circuit board and the second printed circuit board.

Problems to be Solved by the Invention The circuit that drives the solid-state image sensor 4 is required to operate at high speed due to the increase in the number of pixels of the solid-state image sensor 3 vane 4, and the circuit that generates the pulse timing and the drive circuit have low power consumption. It's large. Therefore, some semiconductor elements generate considerable heat.

However, in the configuration shown in FIG. 3, the solid-state image sensor 4 and the circuit that drives the solid-state image sensor are located on the same printed circuit board 1 in order to reduce the size and weight. This causes the temperature of the solid-state image sensor 4 to rise. Furthermore, heat convection is reduced by the shield case 7 installed to remove high frequency interference. Therefore, when a long period of time has passed after the printed circuit board 1 is energized, the temperature of the solid-state image sensor 4 causes characteristic unevenness in the photodiode of the solid-state image sensor, which appears in the video signal output. That is, when the image is dark, dot-like scratches appear on the entire surface, and the image quality deteriorates significantly.

In view of the above-mentioned problems, the present invention aims to prevent the deterioration of the characteristics of the photodiode of the solid-state image sensor by changing the configuration around the solid-state image sensor without losing the small and lightweight features of the solid-state color camera. The present invention provides a solid-state imaging device that can be used for a variety of purposes.

Means for Solving the Problems In order to solve the above problems, the solid-state imaging device of the present invention includes a solid-state imaging device, a printed circuit board having drive circuit means for driving the solid-state imaging device, and the printed circuit board and the above-mentioned components. A shielding plate is provided between the solid-state image sensors, and the solid-state image sensors and the printed circuit board are electrically connected.

Effect: With the above-described configuration, the present invention can suppress the rise in surface temperature of the solid-state image sensor through heat conduction and radiation of the heat completely shielding plate generated from the printed circuit board having the drive circuit means for driving the solid-state image sensor. . Furthermore, since it can be implemented in a narrow space, it can be used in small and lightweight video cameras.

Embodiment 5 Beno Hereinafter, a solid-state imaging device of the present invention will be described with reference to all the drawings. In FIGS. 1 and 2, 1 is a printed circuit board containing a circuit for driving a solid-state imaging device.

Reference numeral 2 denotes a shielding plate made of a material with high thermal conductivity that separates the printed circuit board 1 and the solid-state image sensor. 3 is a frame for fixing the printed circuit board 1. 4 is a solid-state image sensor that converts optical information into electrical signals. 6 is a frame that houses the autofocus bimorph.

Reference numeral 6 denotes a heat absorbing plate which is bonded to the shielding plate 2 and also contacts the printed circuit board 1 to serve as insulation between the printed circuit board 1 and the shielding plate 2. 7 is a shield case that prevents high frequency interference generated by the solid-state image pickup device drive circuit. 8 is a flexible printed board that electrically connects the solid-state image sensor and the drive circuit. Further, 9 is a lens for forming an image of a subject on a solid-state image sensor, and 10 is a connector for electrically connecting the two printed circuit boards 1.

Next, the operation of the solid-state imaging device configured as above will be explained.

When the six-vane solid-state imaging device operates, the temperature of the entire printed circuit board 1 rises due to the heating element of the solid-state imaging device drive circuit mounted on the printed circuit board 1.

The energy of this heat source flows through the heat absorbing plate 6 to the shielding plate 2, and then to the frame 3, which is made of aluminum or the like and has good thermal conductivity. Therefore, the heat generated from the printed circuit board 1 is dissipated by thermal conduction and radiation of the shielding plate 2, and the surface temperature of the solid-state image sensor 4 does not rise.

Furthermore, the main features of home video cameras, such as small size and light weight, can be easily achieved with a simple configuration within a limited space.

Effects of the Invention As described in "2," according to the present invention, the deterioration of the characteristics of the photodiode of a solid-state image sensor is suppressed by the heat generation of the printed circuit board, without losing the feature of being smaller and lighter than the conventional one, and the image quality is improved. deterioration can be prevented.

[Brief explanation of drawings]

7 base/゛Figure 1 is a sectional view of essential parts of a solid-state imaging device according to an embodiment of the present invention, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 3 is a conventional solid-state imaging device. It is a sectional view of the main part. 1... Printed circuit board, 2... Shielding plate,
4... Solid-state image sensor, 8... Flexible printed board. Name of agent: Patent attorney Toshio Nakao and 1 other person1-
-- Buri 4 station ζ also (J 2nd bacterium

Claims (2)

[Claims] (1) comprising a solid-state image sensor, a printed circuit board having drive circuit means for driving the solid-state image sensor, and a shielding plate disposed between the printed circuit board and the solid-state image sensor,
A solid-state imaging device, characterized in that the solid-state imaging device and the printed circuit board are electrically connected. (2) The solid-state imaging device according to claim 1, wherein the shielding plate is made of a material with high thermal conductivity.