JPS631259A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To reduce the variance of a photodiode of a solid-state image pickup element by setting this pickup element and its drive circuit separately from each other to avoid their mutual opposite distribution. CONSTITUTION:A solid-state image pickup element 2 is set separately from a printed board 3 containing a drive circuit for element 2 so that they are not set opposite to each other. The board 3 generates heat but this heat is not radiated the element 2 since the board 3 and the element 2 are set separately from each other and not opposite to each other. In addition, heat conductivity is improved since the element 2 and its drive circuit are not set on the same, board.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a solid-state imaging device that can be used in video cameras and the like.

Conventional technology In recent years, with the spread of home video tape recorders (hereinafter referred to as VTRs), expectations have increased for their uses from recording TV programs to 8mm camera-like functions, and as VTRs have become smaller. There is a strong demand for a video camera-shaped V'TR that is lightweight, has low power consumption, and is easy to maintain.

Hereinafter, a solid-state imaging device mounted on the above-described conventional video camera-body type VTR will be described with reference to the drawings. FIG. 2 is a block diagram of main parts showing the structure of a conventional example.

In FIG. 2, reference numeral 1 denotes a lens that optically focuses the image on the solid-state image sensor. 2 is the present solid-state image sensor. 3 is a printed circuit board containing a solid-state image sensor and a circuit for driving the solid-state image sensor. 4 is a shield case that prevents high frequency interference from affecting other parts.

Reference numeral 7 denotes an optical component storage frame which is a frame for storing an optical filter located between the solid-state image sensor 2 and the lens 1.

Problems to be Solved by the Invention In general, the pulses that drive a solid-state image sensor are fast, and the circuit that generates the pulse timing and the circuit that drives the device consumes a small amount of power and generates a large amount of heat.

In the above configuration, in order to reduce the size and weight, the solid-state image sensor and the circuit that drives the solid-state image sensor are on the same printed circuit board, so the heat generated in the solid-state image sensor drive circuit is conducted and the temperature of the solid-state image sensor increases. rises. Furthermore, heat convection is reduced by the shield case to prevent high frequency interference, and therefore, when the energized diameter passes for a long time, the temperature of the solid-state image sensor increases, causing 7-otodiode unevenness in the solid-state image sensor, which causes distortion in the video signal output. . In addition, dotted scratches appear on the entire surface when the image is dark, and this significantly degrades the image quality.

In view of the above-mentioned problems, the present invention provides a solid-state imaging device that reduces the photodiode unevenness of a solid-state imaging device by changing the configuration around the solid-state imaging device without losing its compact and lightweight features. .

Means for Solving the Problems In order to solve the above problems, the solid-state imaging device of the present invention includes a solid-state imaging device and a circuit for driving the solid-state imaging device, and drives the solid-state imaging device and the solid-state imaging device. The solid-state image sensing device is mounted separately so that the circuits do not face each other.

Operation The present invention suppresses the rise in surface temperature of the solid-state image sensor due to conduction and radiation due to heat generated by the high-speed pulse timing generation circuit and drive circuit that drive the solid-state image sensor with the above-described configuration. Furthermore, by separating the solid-state image sensor and the circuit that drives the solid-state image sensor, the video camera can be made more compact.

EXAMPLE Hereinafter, a solid-state imaging device of the present invention will be described with reference to the drawings. In FIG. 1, reference numeral 1 denotes a lens that forms an image of a subject on a solid-state image sensor.

2 is a solid-state image sensor that converts optical information into electrical signals. 3 is a printed circuit board including a timing generation circuit and a drive circuit for generating pulses for driving the solid-state image sensor. 4 is a shielding case that prevents high frequency interference from going outside. 5 is a flexible printed circuit board for connecting the solid-state image sensor and the solid-state image sensor drive circuit. 6 is a printed circuit board for mounting the solid-state image sensor. 7 is an optical component storage frame interposed between the solid-state image sensor and the lens.

Next, the advantages of adopting the above configuration will be explained.

Heat is generated by the printed circuit board 3 that includes the solid-state image sensor driving circuit, but since this printed circuit board 3 does not face the solid-state image sensor 2, heat is generated from the printed circuit board 3 to the solid-state image sensor 2.
can prevent heat radiation to. Furthermore, since the solid-state image sensor 2 and the solid-state image sensor drive circuit are not located on the same substrate, it is advantageous in terms of heat conduction. Furthermore, since the drive circuit section on the solid-state image sensor is separated, the drive circuit section can be placed anywhere, which is advantageous in terms of small size and light weight, which are the main features of home video cameras.

Effects of the Invention As described above, according to the present invention, the solid-state image sensor and the driving circuit for the solid-state image sensor are separated and arranged so that they do not face each other, so the solid-state image sensor has the advantage of being smaller and lighter than conventional devices. It is possible to suppress the occurrence of 7 otodiode unevenness in the solid-state image sensor without losing the image quality, and to prevent deterioration of image quality when the energized diameter passes for a long time.

[Brief explanation of drawings]

FIG. 1 is a side view showing the structure around a solid-state image sensor according to an embodiment of the present invention, and FIG. 2 is a side view showing the structure around the solid-state image sensor of a conventional example. 1. --- Lens, 2 --- Solid-state image sensor, 3
,5゜6...-Printed circuit board, 4...Shield case, 7...Optical component storage frame.

Claims (1)

[Claims] A solid-state comprising a solid-state image sensor and a circuit for driving the solid-state image sensor, and the solid-state image sensor is mounted separately so that the solid-state image sensor and the circuit for driving the solid-state image sensor do not face each other. Imaging device.