JP2005252547A - Camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently dissipate the heat of an image pickup element in addition to the heat of an electronic component for driving the image pickup element. <P>SOLUTION: The camera has the image pickup element 3 for generating image data, which is mounted on one face of a substrate 6, the electronic component 4 for driving the image pickup element, which is mounted on the other face of the substrate 6, a heat conduction member which integrally has a first part 7A which is arranged to sandwich the electronic component 4 with the substrate 6 and a second part arranged to sandwich the substrate with the image pickup element on the other face of the substrate 6, and an appearance cover covering the image pickup element, the electronic component and the heat conduction member. The heat of the image pickup element and the electronic component is dissipated from the appearance cover through the heat conduction member. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a camera having an image sensor such as a digital still camera, and more particularly to a camera with a countermeasure against heat.

  Cameras having an image sensor such as a CCD include digital still cameras, video cameras, and television cameras. These cameras receive the transmitted light from the lens with the image sensor, and still or moving image data based on the photoelectric conversion output. Get. In recent years, as the number of pixels of the image sensor increases, the operation clock increases, and the amount of heat generated by the image sensor and its peripheral circuits tends to increase. The heat adversely affects the circuit operation in the camera and causes image quality deterioration due to so-called thermal noise. Therefore, the camera needs a heat dissipation structure. The camera described in Patent Document 1 improves the heat radiation effect by conducting heat generated from the CCD driving IC to the camera body by the heat radiation member.

No. 7-3673

  The method of Patent Document 1 captures only the IC for driving the image sensor as a heating element, and does not consider heat dissipation of the image sensor itself. However, as described above, with the increase in the number of pixels, the amount of heat generated by the image sensor itself is so large that it cannot be ignored, and the method of Patent Document 1 is insufficient in heat dissipation.

The present invention provides an image sensor for generating image data mounted on one surface of a substrate, an electronic component for driving an image sensor mounted on the other surface of the substrate, and a substrate on the other surface side of the substrate. A heat conduction member integrally including a first portion disposed so as to sandwich an electronic component between the first portion and a second portion disposed so as to sandwich a substrate between the imaging device, an imaging device, An external cover that covers the electronic component and the heat conducting member, and heat is dissipated from the external cover through the heat conducting member.
In particular, the invention of claim 2 has a heat dissipation mechanism that is interposed between the heat conducting member and the outer cover and guides heat from the heat conducting member to the outer cover.
According to a third aspect of the invention, the heat dissipation mechanism includes two or more metal members and a thermally conductive rubber member sandwiched between the two metal members.
According to a fourth aspect of the present invention, the metal member includes a housing of a monitor device for displaying images or information.

  According to the present invention, the first portion disposed so as to sandwich the electronic component for driving the imaging device between the substrate and the second portion disposed so as to sandwich the substrate between the imaging device. Since the heat of the image sensor and the electronic component is radiated from the outer cover through the heat conductive member, the heat of the image sensor and the driving electronic component can be reduced with a simple configuration. Heat can be efficiently radiated to the outside, preventing the effects of heat.

An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a plan sectional view showing the main part of a digital still camera according to this embodiment. Reference numeral 1 denotes a metal exterior cover that constitutes the camera casing. In a space surrounded by the exterior cover 1, a lens 2, an image sensor 3, a timing generator 4, a liquid crystal monitor 5, and the like are accommodated. The image pickup device 3 is composed of, for example, a CCD or a CMOS, receives a photographic light beam transmitted through the lens 2, and generates an electrical image signal corresponding to the received light amount. The image signal is converted into a digital signal by an A / D converter (not shown), subjected to various image processing, and then recorded on a memory card as image data. The timing generator 4 controls the operation timing of the image sensor 3 and the A / D converter. The liquid crystal monitor 5 is provided near the back of the camera, and displays a captured image and various information on the screen.

Next, the heat dissipation structure of the camera will be described.
The main heating elements are the image sensor 3 and the timing generator 4. The imaging device 3 is mounted on the front surface (lower surface in the drawing) of the imaging substrate 6, while the timing generator 4 is mounted on the rear surface (upper surface in the drawing) of the substrate 6 with a position shifted from the imaging device 3. Reference numeral 7 denotes a heat conductive rubber sheet provided behind the substrate 6. Although the rubber sheet 7 is composed of a single sheet, for convenience of explanation, the right side portion is represented by 7A, the central portion is represented by 7B, and the left side portion is represented by 7C. The right portion 7 </ b> A is disposed in contact with the upper surface of the timing generator 4 and sandwiches the timing generator 4 with the substrate 6. The other portions 7B and 7C are arranged close to the back surface of the substrate 6. In particular, the central portion 7B is located on the back surface of the image pickup device 3, and the substrate 6 is sandwiched between the image pickup device 3.

  An aluminum heat conductive plate 8 is disposed in contact with the back surface of the central portion 7B and the left portion 7C of the rubber sheet 7, and a heat conductive rubber 9 is disposed in contact with the upper surface thereof. The heat conductive rubber 9 is in a position where the heat conductive plate 8 is sandwiched between the left side portion 7C of the rubber sheet 7 and is shifted in the lateral direction from the image pickup device 3. Above the substrate 6, a liquid crystal monitor 5 is disposed via a stainless frame 10, and the lower surface of the frame 10 is in contact with the heat conductive rubber 9. The liquid crystal monitor 5 has a stainless steel casing, and is disposed so that the liquid crystal screen is exposed from the opening 1a of the outer cover 1. Between the peripheral edge of the opening and the upper surface of the monitor, heat conduction is performed so as to surround the opening 1a. The rubber 11 is interposed.

  In the above configuration, when imaging is performed with the camera, the image sensor 3 and the timing generator 4 generate heat. The timing generator 4 has a larger amount of heat generation than the image sensor 3. The heat generated from the timing generator 4 is transmitted from the right portion 7A of the rubber sheet 7 to the central portion 7B and the left portion 7C in this order, and further the aluminum heat conductive plate 8, the heat conductive rubber 9, the frame 10, and the housing of the liquid crystal monitor 5. (Stainless steel) is transmitted to the outer cover 1 through the heat conductive rubber 11 in this order, and is radiated from the outer cover 1 to the outside. Further, the heat generated from the imaging device 3 is transmitted from the central portion 7B of the rubber sheet 7 to the left portion 7C, and is radiated from the exterior cover 1 to the outside through the same path as described above.

  As described above, in the present embodiment, by arranging the single heat conductive rubber sheet 7 as described above, the heat of the timing generator 4 is made from the upper surface and the heat of the image sensor 3 is made from the rear surface side. Since heat is conducted from the outer cover 1 through the members 10, 5, and 11 in order through the members 10, 5, and 11, the heat of the two heating elements 3, 4 can be efficiently released with a simple configuration. In addition, since the liquid crystal monitor 5 and its frame 10 are used as the heat radiating member, the number of parts can be further reduced. Moreover, since heat conductive rubber is arrange | positioned between metal members, the adhesiveness of each member increases, a contact area can be enlarged and heat dissipation efficiency can be improved.

  Note that the present invention is not limited to a digital still camera and can be applied to a video camera and a television camera.

The figure which shows the thermal radiation structure of the digital still camera in one Embodiment of this invention.

Explanation of symbols

1 Appearance cover 2 Lens 2
DESCRIPTION OF SYMBOLS 3 Image pick-up element 4 Timing generator 5 Liquid crystal monitor 6 Imaging board 7 Thermal conductive rubber sheet 7A-7C Right side, center, left side part 8 Aluminum thermal conductive plate 9,11 Thermal conductive rubber 10 Stainless steel frame

Claims (4)

An image sensor for generating image data mounted on one surface of the substrate;
An electronic component for driving an image sensor mounted on the other surface of the substrate;
On the other surface side of the substrate, a second part is disposed so as to sandwich the substrate between the imaging element and a first portion disposed so as to sandwich the electronic component with the substrate. A heat conducting member integrally having a portion;
An external cover that covers the image sensor, the electronic component, and the heat conducting member, and is configured to dissipate heat from the external cover through the heat conductive member. .   The camera according to claim 1, further comprising a heat dissipating mechanism interposed between the heat conducting member and the outer cover and guiding heat from the heat conducting member to the outer cover.   The camera according to claim 2, wherein the heat dissipation mechanism includes two or more metal members and a heat conductive rubber member sandwiched between the two metal members.   The camera according to claim 3, wherein the metal member includes a housing of a monitor device for displaying images or information.

Images