JP2005176185A - Camera module mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module mounting structure in which the camera module itself and a lens position within the camera module are not displaced even if external forces such as impact strength or the like act thereon. <P>SOLUTION: The camera module 8 includes a contact portion 13 connected electrically with an image sensor 50 and a DSP 51 on a base board 9. A printed-circuit board 1 includes a module fixing rib 15 in a sidewall for fixing the camera module 8, a mold 4 comprising a sidewall installed nearly cylindrically in a standing manner and a bottom arranged with an elastic member, and besides a socket connecter 2 where the contact portion 6 are provided that is connected electrically with the printed-circuit board 1. Further, when the socket connecter 2 is inserted into the camera module 8, the contact portions 13, 6 conduct to each other and at the same time the camera module 8 is held by the module fixing rib 15 with the camera module 8 spring-driven and energized away from the printed-circuit board 1 by a spring terminal 29. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a structure for attaching a camera module to a printed circuit board, and in particular, even if an external force is applied to the camera module, the electrical connection between the camera module and the printed circuit board is impaired, or the camera module body or its lens is The present invention relates to a camera module mounting structure in which a mounting position is not displaced.

  In recent years, information terminal devices have become highly functional, and in the case of mobile phone terminals, those equipped with a digital camera function (camera function) have become mainstream.

  When an information terminal device has a camera function, a mounting method is adopted in which a camera to be imaged is made into a small module, the camera module is mounted on an FPC board, and then connected to a printed board through a connector or the like. .

FIG. 20 shows a conventional camera module mounting structure. FIGS. 21 and 22 show a state in which a conventional camera module is mounted on an FPC (flexible printed circuit board).
In the case of the structure shown in FIG. 21, the stacking connector 21 is mounted on the FPC 20 by reflowing (the solder is melted and mounted by heating the entire component with hot air), and then a method that does not affect the lens 12 ′ (for example, The camera module 8 ′ was mounted on the FPC 20 by pulse heat). Similarly, in the case of the structure shown in FIG. 22, the camera module 8 ″ is mounted on the FPC 20, but a terminal 25 for connecting to the FPC connector is formed at the tip of the FPC 20.

  A conventional camera module mounting method will be described with reference to FIG. Conventionally, the camera module 8 ′ is inserted into a camera module housing portion 24 provided in an LCD or a camera-dedicated frame 23, and the connector 21 and the connector 22 are fitted together so that the camera module 8 ′ is printed on a printed circuit board. Connected to 1 '.

However, when the camera module and the printed circuit board are connected by the above method, the following problems occur.
First, since the electronic components are mounted on the printed circuit board with high density in order to realize higher functionality of the information terminal device, the camera module is connected to the printed circuit board through the connector as shown in FIG. In such a case, a connector having a small size and a narrow pitch has to be applied. For this reason, the connection work between the camera module and the printed circuit board is inferior in workability and may damage the connector.
This problem becomes more prominent as the portable information device becomes smaller.

Second, as shown in FIG. 22, when the camera module is connected to the printed circuit board via a terminal provided at one end of the FPC, not only the wiring in the FPC may be disconnected, but also the FPC that has been routed. The electromagnetic wave leaked from the camera may become noise, which may deteriorate the wireless characteristics during camera operation, or conversely, the captured image. Therefore, it is necessary to take noise countermeasures such as providing an electromagnetic wave absorbing sheet in order to prevent leakage of electromagnetic waves from the FPC.
As the number of pixels of the camera module increases, the operation clock becomes higher. Therefore, the above-described noise problem becomes more prominent as the number of pixels of the camera module increases.

  Third, since FPC boards with different circuit patterns must be used for each model, the circuit pattern of the FPC board must be newly redesigned every time a new model is developed, which takes time to design. .

  Fourth, since the camera module is connected to the printed circuit board through the FPC drawn out from the camera module, if a tension is applied to the FPC, the position of the camera module is shifted and the image becomes oblique. Image quality.

  In general, screw grooves are formed on the outer side of the lens part and the inner side of the lens barrel part of the camera module. A fixing method is generally adopted in which the lens unit is attached to the lens barrel by screwing it into the thread groove of the lens barrel while rotating the lens, and then the adhesive is poured into the gap between the screws and fixed. Because.

  However, in the above general fixing method, the amount of adhesive that can penetrate into the gap between the lens portion and the lens barrel portion is small. Therefore, when the external impact is applied to the portable information device, the camera module itself is displaced. Even if the lens does not occur, there is a possibility that the lens portion fixed to the lens barrel rotates by a small angle and the lens is displaced in the lens barrel.

  If the lens is displaced within the lens barrel, the image pickup device of the camera module cannot be focused and the captured image becomes blurred.

  For this reason, it is necessary not only to prevent the displacement of the camera module itself but also to prevent the displacement of the lens portion.

As a conventional technique for preventing the positional deviation of the camera module, there is a “camera for portable device” disclosed in Patent Document 1.
In the invention disclosed in Patent Document 1, a circuit board for a camera is formed by cutting a wiring board having a through hole filled with a conductive member along the through hole, and the conductive member exposed on the side surface of the camera circuit board is formed. By using it as a conduction contact, even if an impact force acts on the portable device, the conduction between the portable device board and the camera circuit board is not impaired.
JP 2002-314856 A

  However, Patent Document 1 does not show any specific configuration of the socket portion, which is a conduction portion between the mobile device circuit board and the camera circuit board. In addition, the structure shown in Patent Document 1 is provided with a member for preventing the camera circuit board from falling off the portable device circuit board, so that an impact force acts on the optical device unit. In some cases, the camera circuit board itself may fall off from the socket. Further, since no measures are taken to alleviate the impact force applied to the optical device unit, there is a possibility that the lens is displaced in the lens barrel.

  Thus, conventionally, there has not been provided a camera module mounting structure in which the camera module itself and the lens in the camera module are not displaced even when an external force such as an impact force is applied.

  The present invention has been made in view of such a problem, and provides a camera module mounting structure in which the camera module itself and a lens in the camera module do not cause a positional shift even when an external force such as an impact force is applied. With the goal.

  In order to achieve the above object, the present invention comprises, on a base substrate, a photoelectric element that converts light into an electrical signal, and image data generation means that generates image data based on the electrical signal output from the photoelectric element. The camera module mounting structure for mounting the camera module on the printed circuit board, the camera module having a contact portion electrically connected to the photoelectric element and the image data generating means on the base substrate, The mold includes a side wall provided with a locking portion for fixing the camera module on the side wall and a substantially cylindrical side wall, and a bottom surface on which an elastic member is disposed, and is electrically connected to the printed circuit board. When the camera module is inserted into the socket connector, the contact portion and the electrode terminal are electrically connected, and the socket connector is provided with the electrode connector. La module, while being resiliently urging away from the printed circuit board by an elastic member, there is provided a camera module mounting structure, characterized in that it is held by the locking unit.

  In the above configuration, the contact portion is preferably provided on the side surface of the base substrate, and the electrode terminal is preferably provided on the inner wall surface of the side wall portion. Moreover, it is preferable that a contact part is provided in the bottom face of a base substrate, and an electrode terminal is provided in a bottom face part.

  In any of the above configurations, the base substrate is preferably formed of ceramic. Alternatively, the base substrate is preferably formed by integrally molding a conductive metal plate with a heat resistant resin. Alternatively, the base substrate is preferably formed of a glass epoxy resin.

  In any of the above-described configurations, the camera module has a substantially box-shaped holder portion that accommodates the photoelectric element and the image data generation means on the upper portion of the base substrate, and the camera module is formed with a ridge line of the holder portion. It is preferable that the concave portion and the locking portion protruding from the side wall portion are fitted to each other to be fixed to the printed board.

  In any of the above configurations, at least a part of the camera module is covered with a cover connected to the ground wiring of the printed circuit board, and the cover is fixed by a convex portion formed on the outer wall side of the side wall portion of the socket connector. It is preferable.

[Action]
In the present invention, since the camera module is directly mounted on the printed circuit board without using the FPC, the work of connecting the printed circuit board and the FPC is not required. Further, since the camera module can be mounted on the printed circuit board simply by inserting the camera module into the socket connector arranged on the printed circuit board, the attachment work is easy.
Furthermore, since the socket connector includes an elastic member for absorbing external force applied to the camera module, even if an impact force or the like is applied to the camera module, the camera module itself or the internal lens is not displaced thereby. .

  According to the present invention, it is possible to provide a camera module mounting structure in which the camera module itself and the lens in the camera module are not displaced even when an external force such as an impact force is applied.

[First Embodiment]
A first embodiment in which the present invention is suitably implemented will be described. FIG. 1 shows a camera module mounting structure according to the present embodiment. The camera module mounting structure according to the present embodiment is a structure in which the camera module 8 is connected to the printed circuit board 1 by fitting the camera module 8 into the socket connector 2.
FIG. 2 shows an external perspective view of the camera module 8. FIG. 3 shows an external perspective view of the socket connector 6. FIG. 4 shows a state where the camera module 8 is inserted into the socket connector 2. FIG. 5 shows a cross-sectional view of the camera module 8 inserted into the socket connector 2.

  The camera module 8 includes a lens barrel 11 and a lens 12, and is mounted on the base substrate 9 via a holder 10. A contact portion 13 is formed on the side surface of the base substrate 9. The base substrate 9 may be a circuit board for the camera module 8 such as a ceramic substrate or a heat-resistant resin integrally formed with a conductive metal plate. A module fixing recess 14 for fixing the camera module 8 to the socket connector 2 is provided on the side surface of the holder 10.

  The socket connector 2 has a structure in which a bottom surface and side surfaces are surrounded by a mold 4 in a substantially rectangular parallelepiped box shape, and an opening 3 for inserting the camera module 8 is formed on the top surface. A contact portion 6 that is electrically connected to the printed circuit board 1 via a soldering terminal portion 5 is formed inside the side wall portion of the mold 4. Further, a module fixing rib 15 for preventing the camera module 8 from falling off is formed inside the vicinity of the tip of the side wall portion of the mold 4. Further, a spring terminal 29 is formed on the rising portion of the side surface of the mold 4.

  Since the orientation of the captured image varies depending on the direction in which the camera module 8 is mounted, it is necessary to prevent the camera module 8 from being mounted in a direction other than a predetermined direction. Therefore, a cutout 26 is formed in the base substrate 9 and the lens barrel 10, and a C-cut 27 is formed in the mold 4 at a position corresponding to the cutout 26. The module 8 cannot be inserted into the socket connector 2.

  When the camera module 8 is inserted into the socket connector 2 through the opening 3, the contact portion 6 of the socket connector 2 comes into contact with the contact portion 13 on the camera module 8 side, and the camera module 8 is connected to the wiring pattern of the printed circuit board 1. Electrically connected. Further, the camera module 8 whose bottom surface is in contact with the spring member 29 is elastically biased in a direction away from the printed circuit board 1 and is formed on the side surface of the holder 10 and the module fixing rib 15 formed on the inner surface of the side wall of the mold 4. The module fixing recess 14 is fixed in contact with the module.

  FIG. 6 shows an electrical configuration of the camera module 8. The camera module 8 converts the light incident from the lens 12 into an electrical signal by the image sensor 50, and processes this as image data in the DSP 51. Since the DSP 51 is electrically connected to the contact portion 13, when the camera module 8 is inserted into the socket connector 2 and the contact portion 6 contacts the contact portion 13, the DSP 51 is electrically connected to the host IC 52 mounted on the printed circuit board 1. Connected.

  When an external force (impact force or the like) acts on the camera module 8 fitted with the socket connector 2 from above (direction in which the camera module 8 is inserted), the spring member 29 is elastically deformed as shown in FIG. External force is absorbed.

The camera module mounting structure according to the present embodiment does not require an FPC because the camera module is held by a socket connector. For this reason, there is no possibility that the wiring in the FPC is disconnected or the camera module is displaced due to the tension applied to the FPC.
In addition, since the wiring pattern between the camera module and the host-side IC can be shortened, the generation of noise can be reduced.

  Further, since the camera module is held by the socket connector, the mounting area required for connecting the camera module to the printed circuit board can be minimized.

  Further, since the bottom surface of the camera module is held by a spring terminal provided on the bottom surface of the socket connector, even if an impact force or the like acts on the camera module, the force is absorbed. Therefore, the electrical connection between the camera module and the printed board is not impaired, and the lens position of the camera module is not shifted.

  Furthermore, the work of fitting the camera module with the socket connector is easy to work because the worker can visually confirm it. For this reason, a camera module and a socket connector can be reliably fitted, and the stability of the electrical connection of a camera module and a printed circuit board can be ensured. Furthermore, since it is not necessary to heat the camera module when mounting the camera module, the optical characteristics of the lens do not deteriorate due to the influence of heat.

[Second Embodiment]
A second embodiment in which the present invention is suitably implemented will be described. FIG. 8 shows a camera module mounting structure according to the present embodiment. The camera module mounting structure according to this embodiment is a structure in which the camera module 8 is connected to the printed circuit board 1 by fitting the camera module 8 into the socket connector 2, as in the first embodiment.
FIG. 9 shows the socket connector 2 used for mounting the camera module 8 on the printed circuit board 1 in the present embodiment. FIG. 10 shows a state where the camera module 8 is inserted into the socket connector 2. Furthermore, FIG. 11 shows a cross-sectional view of the camera module 8 inserted into the socket connector 2.

  The socket connector 2 in the present embodiment has substantially the same structure as the socket connector 2 in the first embodiment. However, in the present embodiment, the shield case fixing convex portion 7 is formed on the outer surface of each side wall portion of the mold 4. Further, reinforcing terminals 16 are arranged at the corners of the four corners of the mold 4 and are exposed at the upper portions of the four corners. The reinforcing terminal 16 is connected to the ground wiring of the printed circuit board 1.

  In the present embodiment, as shown in FIG. 11, after the camera module 8 is inserted into the socket connector 2, a shield case 17 formed of a conductive member is attached to the socket connector 2 so as to cover the camera module 8. . The shield case 17 is a substantially box-shaped member having no bottom surface, and a shield fixing portion 18 having a hole of a size and shape into which the shield case fixing convex portion 7 is fitted is formed in the vicinity of the lower end portion of each side surface. Yes. In addition, an opening having a shape exposing the lens 12 is formed on the top surface of the shield case 17.

  When the shield case 17 is attached to the socket connector 2, the shield case fixing convex portion 7 provided on the outer peripheral side of the side wall portion of the mold 4 is fitted into the shield fixing portion 18, so that the shield case 17 is connected to the socket connector. 2 is fixed. The shield case 17 fixed to the socket connector 2 contacts the reinforcing terminals 16 arranged at the four corners of the mold 4.

Since the camera module mounting structure according to this embodiment covers the camera module with a grounded shield case, noise leakage from the camera module can be reduced.
Since the lens portion of the camera module has low heat resistance, if such a shield is to be provided in the conventional configuration, soldering must be performed manually. However, in this embodiment, since the shield case can be connected to the socket connector by fitting, the workability of attaching the shield case is improved as compared with the conventional structure.

  Even if the socket connector is provided with a shield fixing convex portion, it is not always necessary to cover the shield case if noise countermeasures are not required.

[Third Embodiment]
A third embodiment in which the present invention is preferably implemented will be described. FIG. 12 shows the structure of the bottom surface of the camera module 8 according to this embodiment. In the present embodiment, a contact portion 28 is formed on the bottom surface of the base substrate 9.

  FIG. 13 shows a state where the camera module 8 is attached to the socket connector 2. FIG. 14 shows a cross section in a state where the camera module 8 and the socket connector 2 are fitted.

  The socket connector 2 in the present embodiment has substantially the same structure as the socket connector 2 in the second embodiment. However, in the present embodiment, the contact portion 19 protrudes from the bottom surface of the mold 4, and can protrude and retract from the bottom surface of the mold 4 by elastic force. Note that the contact portion 19 is electrically connected to the wiring pattern of the printed circuit board 1.

  In the camera module mounting structure according to the present embodiment, when the camera module 8 is inserted into the socket connector 2, the contact portion 28 on the bottom surface of the camera module 8 and the contact portion 19 on the bottom surface of the socket connector 2 come into contact.

  As a result, even if an external force (such as an impact) acts on the camera module 8, the force is absorbed by the contact portion 19, so that the electrical connection between the camera module 8 and the socket connector 2 is unlikely to be impaired.

  Also in this embodiment, since the lower part of the socket connector 2 is fixed to the printed circuit board 1 by soldering, the mounting area for connecting the camera module 8 to the printed circuit board 1 can be minimized.

  As shown in FIG. 15, a part of the lens 12 may be covered with the shield case 17 as long as it does not fall within the angle of view of the camera module 8. In this way, the effect of shielding noise can be further enhanced.

[Fourth Embodiment]
A fourth embodiment in which the present invention is preferably implemented will be described. FIG. 16 shows a cross section in a state in which the camera module 8 is inserted into the socket connector 2.
The camera module 8 in the present embodiment is the same as the camera module 8 in the first embodiment. The socket connector 2 is substantially the same as the socket connector 2 of the first embodiment, but includes a coil spring 30 instead of the spring terminal 29. The coil spring 30 is a member having elasticity according to its own shape (in other words, a member having shape elasticity), and is installed on the bottom surface of the socket connector 2.

  When the camera module 8 is inserted into the socket connector 2 through the opening 3, the contact portion 6 of the socket connector 2 comes into contact with the contact portion 13 on the camera module 8 side, and the camera module 8 is connected to the wiring pattern of the printed circuit board 1. Electrically connected. The camera module 8 whose bottom surface is in contact with the coil spring 30 is elastically biased in a direction away from the printed circuit board 1 and is formed on the side surface of the holder 10 and the module fixing rib 15 formed on the inner surface of the side wall of the mold 4. The module is fixed in contact with the module fixing recess 14.

  As described above, if the coil spring 30 is arranged on the bottom surface of the socket connector 2, even if an external force (impact etc.) acts on the camera module 8, the coil spring 30 is elastically deformed as shown in FIG. Absorb. Therefore, it is possible to prevent the electrical connection between the camera module 8 and the socket connector 2 from being damaged by the external force acting on the camera module 8.

[Fifth Embodiment]
A fifth embodiment in which the present invention is preferably implemented will be described. FIG. 18 shows a cross section in a state where the camera module 8 is inserted into the socket connector 2. The camera module 8 in the present embodiment is the same as the camera module 8 in the first embodiment. The socket connector 2 is substantially the same as the socket connector 2 of the first embodiment, but includes a cushion 31 instead of the spring terminal 29. The coil spring 30 is installed on the bottom surface of the socket connector 2. The cushion 30 is a member formed of an elastic material (in other words, a member having volume elasticity), and is formed on the bottom surface of the socket connector 2.

  When the camera module 8 is inserted into the socket connector 2 through the opening 3, the contact portion 6 of the socket connector 2 comes into contact with the contact portion 13 on the camera module 8 side, and the camera module 8 is connected to the wiring pattern of the printed circuit board 1. Electrically connected. The camera module 8 whose bottom surface is in contact with the cushion 31 is elastically biased in a direction away from the printed circuit board 1 and is formed on the side surface of the holder 10 and the module fixing rib 15 formed on the inner surface of the side wall of the mold 4. The module is fixed in contact with the module fixing recess 14.

  As described above, if the coil spring 30 is disposed on the bottom surface of the socket connector 2, even if an external force (such as an impact) acts on the camera module 8, the force is applied by the elastic deformation of the cushion 31 as shown in FIG. Absorb. Therefore, it is possible to prevent the electrical connection between the camera module 8 and the socket connector 2 from being damaged by the external force acting on the camera module 8.

Each of the above embodiments is an example of a preferred embodiment of the present invention, and the present invention is not limited to this. For example, in each of the above-described embodiments, the case where the camera module 8 and the socket connector 2 have a substantially rectangular parallelepiped shape has been described as an example, but these may have a cylindrical shape or a polygonal column shape.
As described above, the present invention can be variously modified.

It is a figure which shows the camera module mounting structure concerning 1st Embodiment which implemented this invention suitably. It is a figure which shows the structure of the camera module applied to the camera module mounting structure concerning 1st Embodiment. It is a figure which shows the structure of the socket connector applied to the camera module mounting structure concerning 1st Embodiment. It is a figure which shows the state which inserted the camera module in the socket connector. It is sectional drawing in the state which inserted the camera module in the socket connector. It is a figure which shows the electrical connection of a camera module and a printed circuit board. It is a figure which shows the state by which the external force which acted on the camera module was absorbed by the elastic force of a spring terminal part. It is a figure which shows the camera module mounting structure concerning 2nd Embodiment which implemented this invention suitably. It is a figure which shows the structure of the socket connector applied to the camera module mounting structure concerning 2nd Embodiment. It is a figure which shows the state which inserted the camera module in the socket connector. It is sectional drawing in the state which inserted the camera module in the socket connector and attached the shield case. It is a figure which shows the base substrate bottom face of the camera module applied to the camera module mounting structure concerning 3rd Embodiment which implemented this invention suitably. It is a figure which shows the state which inserted the camera module in the socket connector and attached the shield case. It is sectional drawing in the state which inserted the camera module in the socket connector and attached the shield case. It is sectional drawing in the state which inserted the camera module in the socket connector and attached the shield case of another shape. It is sectional drawing of the camera module mounting structure concerning 4th Embodiment which implemented this invention suitably. It is a figure which shows the state by which the external force which acted on the camera module was absorbed by the coil spring in the camera module mounting structure concerning 4th Embodiment. It is sectional drawing of the camera module mounting structure concerning 5th Embodiment which implemented this invention suitably. In the camera module mounting structure concerning 5th Embodiment, it is a figure which shows the state by which the external force which acted on the camera module was absorbed by the cushion. It is a figure which shows the conventional camera module mounting structure. It is a figure which shows the state which mounted the camera module on FPC. It is a figure which shows the state which mounted the camera module on FPC.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Socket connector 3 Opening part 4 Mold 5 Soldering terminal 6, 13, 13 ', 13'', 19, 28 Contact part 7 Shield fixing convex part 8, 8', 8 '' Camera module 9, 9 ', 9''base substrate 10, 10', 10 '' holder 11, 11 ', 11''lens barrel 12 lens 14 module fixing recess 15 module fixing rib 16 reinforcing terminal 17 shield case 18 shield fixing part 20, 20 '' FPC
21, 22 Connector 23 Frame 24 Camera module housing part 25 Terminal 26 Notch part 27 C cut 29 Spring terminal 30 Coil spring 31 Cushion 50 Image sensor 51 DSP
52 Host side IC

Claims (8)

A camera module having a photoelectric conversion element that converts light into an electrical signal and an image data generation unit that generates image data based on the electrical signal output from the photoelectric element on a base board. A camera module mounting structure,
The camera module has a contact portion electrically connected to the photoelectric element and the image data generation means on the base substrate,
The printed circuit board includes a mold including a side wall portion provided with a locking portion for fixing the camera module on the side wall portion and provided in a substantially cylindrical shape, and a bottom surface portion on which an elastic member is disposed. Having a socket connector provided with electrode terminals electrically connected to the printed circuit board;
When the camera module is inserted into the socket connector, the contact portion and the electrode terminal are electrically connected, and the camera module is elastically biased in a direction away from the printed board by the elastic member. The camera module mounting structure is held by the locking portion. The contact portion is provided on a side surface of the base substrate;
The camera module mounting structure according to claim 1, wherein the electrode terminal is provided on an inner wall surface of the side wall portion. The contact portion is provided on a bottom surface of the base substrate;
The camera module mounting structure according to claim 1, wherein the electrode terminal is provided on the bottom surface portion.   The camera module mounting structure according to any one of claims 1 to 3, wherein the base substrate is made of ceramic.   4. The camera module mounting structure according to claim 1, wherein the base substrate is formed by integrally molding a conductive metal plate with a heat resistant resin. 5.   The camera module mounting structure according to any one of claims 1 to 3, wherein the base substrate is formed of a glass epoxy resin. The camera module has a substantially box-shaped holder portion for accommodating the photoelectric element and the image data generating means on the base substrate,
7. The camera module is fixed to the printed circuit board by fitting a concave portion formed with a ridge line of the holder portion and the locking portion protruding from the side wall portion. The camera module mounting structure according to claim 1.   The cover connected to the ground wiring of the printed circuit board covers at least a part of the camera module, and the cover is fixed by a convex portion formed on the outer wall side of the side wall of the socket connector. The camera module mounting structure according to any one of 1 to 7.

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