JP2009170827A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP2009170827A JP2009170827A JP2008009996A JP2008009996A JP2009170827A JP 2009170827 A JP2009170827 A JP 2009170827A JP 2008009996 A JP2008009996 A JP 2008009996A JP 2008009996 A JP2008009996 A JP 2008009996A JP 2009170827 A JP2009170827 A JP 2009170827A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 142
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 8
- 230000006641 stabilisation Effects 0.000 claims description 6
- 238000011105 stabilization Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 abstract description 13
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Abstract
【解決手段】 基板54を載置した基板支持具30を反応炉40内に挿入後、反応炉40内を真空排気する前に、基板温度および基板支持具30の温度を安定させるステップを導入することにより、反応炉40内の真空排気時における基板54と基板支持具30の擦れによるダスト発生を抑制する。
【選択図】 図1
Description
Claims (1)
- 基板を支持具に装填するステップと、
前記基板を前記支持具に装填した状態で処理室内に搬入するステップと、
前記処理室内に搬入した前記基板および前記支持具の温度を安定させるステップと、
前記基板および前記支持具の温度安定後に前記処理室内を真空排気するステップと、
前記処理室内で前記基板を処理するステップと、
処理後の前記基板を前記処理室内から搬出するステップと、
を有することを特徴とする半導体装置の製造方法。
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JP2008009996A JP5281796B2 (ja) | 2008-01-21 | 2008-01-21 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
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JP2008009996A JP5281796B2 (ja) | 2008-01-21 | 2008-01-21 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
Publications (2)
Publication Number | Publication Date |
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JP2009170827A true JP2009170827A (ja) | 2009-07-30 |
JP5281796B2 JP5281796B2 (ja) | 2013-09-04 |
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JP2008009996A Active JP5281796B2 (ja) | 2008-01-21 | 2008-01-21 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
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JP (1) | JP5281796B2 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0689863A (ja) * | 1992-09-09 | 1994-03-29 | Matsushita Electron Corp | 薄膜形成方法 |
JP2003151909A (ja) * | 2001-11-13 | 2003-05-23 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及び基板処理装置 |
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- 2008-01-21 JP JP2008009996A patent/JP5281796B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0689863A (ja) * | 1992-09-09 | 1994-03-29 | Matsushita Electron Corp | 薄膜形成方法 |
JP2003151909A (ja) * | 2001-11-13 | 2003-05-23 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及び基板処理装置 |
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