JP2009170719A5 - - Google Patents

Download PDF

Info

Publication number
JP2009170719A5
JP2009170719A5 JP2008008301A JP2008008301A JP2009170719A5 JP 2009170719 A5 JP2009170719 A5 JP 2009170719A5 JP 2008008301 A JP2008008301 A JP 2008008301A JP 2008008301 A JP2008008301 A JP 2008008301A JP 2009170719 A5 JP2009170719 A5 JP 2009170719A5
Authority
JP
Japan
Prior art keywords
insulating film
film
silicon nitride
gate insulating
charge storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008008301A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009170719A (ja
JP5132330B2 (ja
Filing date
Publication date
Priority claimed from JP2008008301A external-priority patent/JP5132330B2/ja
Priority to JP2008008301A priority Critical patent/JP5132330B2/ja
Application filed filed Critical
Priority to US12/333,983 priority patent/US8008707B2/en
Publication of JP2009170719A publication Critical patent/JP2009170719A/ja
Publication of JP2009170719A5 publication Critical patent/JP2009170719A5/ja
Priority to US13/207,149 priority patent/US8742487B2/en
Publication of JP5132330B2 publication Critical patent/JP5132330B2/ja
Application granted granted Critical
Priority to US14/273,162 priority patent/US9142685B2/en
Priority to US14/697,121 priority patent/US9450108B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008008301A 2007-12-14 2008-01-17 不揮発性半導体記憶装置およびその製造方法 Active JP5132330B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008008301A JP5132330B2 (ja) 2008-01-17 2008-01-17 不揮発性半導体記憶装置およびその製造方法
US12/333,983 US8008707B2 (en) 2007-12-14 2008-12-12 Nonvolatile semiconductor memory device provided with charge storage layer in memory cell
US13/207,149 US8742487B2 (en) 2007-12-14 2011-08-10 Nonvolatile semiconductor memory device provided with charge storage layer in memory cell
US14/273,162 US9142685B2 (en) 2007-12-14 2014-05-08 Nonvolatile semiconductor memory device provided with charge storage layer in memory cell
US14/697,121 US9450108B2 (en) 2007-12-14 2015-04-27 Nonvolatile semiconductor memory device provided with charge storage layer in memory cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008008301A JP5132330B2 (ja) 2008-01-17 2008-01-17 不揮発性半導体記憶装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2009170719A JP2009170719A (ja) 2009-07-30
JP2009170719A5 true JP2009170719A5 (enExample) 2010-04-08
JP5132330B2 JP5132330B2 (ja) 2013-01-30

Family

ID=40971562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008008301A Active JP5132330B2 (ja) 2007-12-14 2008-01-17 不揮発性半導体記憶装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP5132330B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013197191A (ja) 2012-03-16 2013-09-30 Toshiba Corp 不揮発性半導体記憶装置
JP5865214B2 (ja) 2012-09-06 2016-02-17 株式会社東芝 半導体装置及びその製造方法
US9224874B2 (en) 2014-01-10 2015-12-29 Kabushiki Kaisha Toshiba Semiconductor storage device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4851740B2 (ja) * 2005-06-30 2012-01-11 株式会社東芝 半導体装置およびその製造方法
KR100648860B1 (ko) * 2005-09-08 2006-11-24 주식회사 하이닉스반도체 유전막 및 그 형성방법과, 상기 유전막을 구비한 반도체메모리 소자 및 그 제조방법

Similar Documents

Publication Publication Date Title
JP2008078317A5 (enExample)
JP2009267366A5 (enExample)
JP2013179122A5 (enExample)
JP2010153828A5 (ja) 半導体装置
JP2009158936A5 (enExample)
JP2011086927A5 (ja) 半導体装置
JP2011135067A5 (enExample)
JP2014099595A5 (enExample)
JP2009033141A5 (enExample)
JP2011049540A5 (enExample)
JP2013093546A5 (enExample)
JP2006041354A5 (enExample)
JP2010186994A5 (ja) 半導体装置
JP2008504679A5 (enExample)
JP2017005282A5 (enExample)
JP2010056546A5 (ja) 半導体装置
JP2013214732A5 (enExample)
JP2006313906A5 (enExample)
JP2010283338A5 (enExample)
JP2012068627A5 (ja) 半導体装置の作製方法
JP2007300098A5 (enExample)
JP2012256822A5 (ja) 半導体装置
JP2010135777A5 (ja) 半導体装置
JP2010135778A5 (ja) 半導体装置
JP2007027726A5 (enExample)