JP2009170643A - Separation device and inspecting apparatus of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a separation device which can carry out a plurality of substrates supported in the state of lamination while separating them surely one by one from a support, and can prevent occurrence of dirt or flaw on the surface of the substrate, and a defect such as cracking, chipping or breakage of the substrate, and to provide an inspection apparatus of a substrate equipped with the separation device. <P>SOLUTION: A separation device 10 for carrying out a plurality of substrates W supported in the state of lamination while separating the substrates W one by one from a support 20 includes: a suction head 30 movable relatively to the support 20 in the direction of lamination of substrates W and holding the substrate W by sucking the central part of the surface of the substrate W; an air separation mechanism 40 for separating a substrate W by blowing out air toward a laminated substrate W and floating a portion thereof; and a guide portion 45 located on the outer circumferential side of the suction head 30 and guiding the position of a substrate W suction held by the suction head 30. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a separation apparatus that separates and carries out substrates one by one from a support that supports a plurality of substrates in a stacked state, and a substrate inspection apparatus using the same.

In general, a silicon substrate or the like used as a solar cell is manufactured by thinly slicing (slicing) a silicon ingot, and the cut substrate is conveyed by being supported by a support such as a storage cassette in a stacked state. ing.
Such a silicon substrate is required to be inspected for cracks, claw tracks, hooks, cracks, edge chips, pinholes, dirt, saw marks, and the like according to JIS H 0613.

  Conventionally, such an inspection is performed by visual inspection of an operator, and requires a lot of labor and time. Therefore, an inspection apparatus capable of automatically performing these inspections is required. In order to perform inspection automatically, it is necessary to carry out the laminated substrates (thin plates) one by one from the support. By the way, the above-mentioned silicon substrates and the like have a relatively smooth surface, so that the stacked substrates are in close contact with each other, and it is difficult to carry out the substrates one by one even if the substrate on the outermost surface is simply held. It was.

Therefore, for example, those disclosed in Patent Documents 1 to 3 have been proposed as separation apparatuses that separate and carry out stacked substrates one by one.
The separation device disclosed in Patent Document 1 has an adsorbing portion that is curved toward the opposite substrate side, and presses the central portion of the substrate surface to bend the substrate and adhere to the back surface of the substrate. The substrate is separated, and an end portion of the substrate is sucked and carried out.
In addition, the separation device disclosed in Patent Document 2 has a suction pad that sucks at the four corners of the substrate, and also presses the center of the substrate surface to bend the substrate and adhere to the back surface of the substrate. The other substrate is separated, and the corner portion of the substrate is sucked and carried out.

Further, the separation device disclosed in Patent Document 3 has a suction pad provided with a number of suction holes, and sucks and holds the substrate with the suction pad, and blows out air from the air knife portion to The other substrate that is in close contact with the back surface is separated.
Japanese Patent Laid-Open No. 02-095633 JP 2001-114434 A JP-A-2005-179032

By the way, in the separation apparatus described in Patent Documents 1 to 3, in order to hold the substrate securely, a large area of the substrate is sucked and held. In particular, in Patent Document 3, in order to enable high-speed movement, a suction pad having approximately the same size as the substrate is used.
However, when a large area of the substrate is sucked and held in this way, there is a possibility that the surface of the substrate may be soiled or scratched. In addition, for example, a silicon substrate for a solar cell is very thin with a thickness of about 150 to 400 μm and is a brittle material. Therefore, when a plurality of portions of the substrate are adsorbed and held, bending stress acts on the substrate. As a result, defects such as cracks, chips and cracks may occur.
On the other hand, if the holding force of the suction pad is suppressed, there is a problem that the substrate being moved out of position is displaced or dropped.

  The present invention has been made in view of the circumstances described above, and is capable of reliably separating and carrying out substrates one by one from a support body in which a plurality of substrates are supported in a stacked state, and the substrate surface An object of the present invention is to provide a separation apparatus capable of preventing the occurrence of defects such as dirt, scratches, cracks, chips and cracks on the substrate, and a substrate inspection apparatus equipped with the separation apparatus.

  In order to solve the above-described problems, a separation apparatus according to the present invention is a separation apparatus that separates and transports the substrates one by one from a support in which a plurality of substrates are supported in a stacked state, and the support The substrate can be relatively moved in the stacking direction of the substrate, and the suction head that holds the substrate by sucking it at the center of the surface of the substrate and jets air toward the stacked substrate An air separation mechanism that floats and separates a part of the stacked substrates, and a guide unit that is located on the outer peripheral side of the suction head and guides the position of the substrate that is sucked and held by the suction head. It is characterized by having.

In the separation apparatus having this configuration, the suction pad is configured to be attracted to the central portion of the surface of the substrate, so that bending stress can be prevented from acting on the substrate when attracted and held, and the substrate is cracked. It is possible to prevent the occurrence of defects such as chipping and cracking. In addition, since it is adsorbed to the central portion of the substrate surface, it is possible to reduce the adsorbed portion, and to suppress the occurrence of dirt and scratches on the surface of the substrate.
In addition, since a guide portion is provided on the outer peripheral side of the suction head to guide the position of the substrate held by the suction head, the substrate is not displaced when unloading the substrate, so that The substrate can be carried out.
Furthermore, since air is used to separate the stacked substrates, the substrates can be separated without excessive force acting on the substrates, and the substrates are reliably separated and transported one by one. be able to.

Here, the air separation mechanism is held by a separation mechanism holding member that is movable in the stacking direction of the substrate with respect to the support, and the guide portion is provided in the separation mechanism holding member. It is preferable.
In this case, since the air separation mechanism is held by the separation mechanism holding member that is movable in the stacking direction of the substrate with respect to the support, air is ejected to a predetermined position of the stacked substrates. The substrate can be separated. In addition, since the guide portion is provided on the separation mechanism holding member, the structure around the suction head can be simplified.
In addition, since the air separation mechanism is provided on the separation mechanism holding member that can be moved closer to and away from the support, the workability when replacing the support or accommodating the stacked substrates in the support is greatly increased. Can be improved.

Furthermore, it is preferable that the separation mechanism holding member and the suction head are configured to be driven independently.
In this case, the positions of the suction pad and the separation mechanism holding unit can be controlled according to the work content. For example, when the substrate is sucked by the suction pad, the separation mechanism holding member is arranged so that the air is directed to a predetermined position of the stacked substrates, and when the substrate is removed from the suction pad, the separation is performed. The mechanism holding member can be moved backward with respect to the suction pad so as not to interfere with surrounding members.

The suction head is preferably configured to hold the substrate in a non-contact state.
In this case, since the substrate and the suction head are not in contact with each other, it is possible to reliably prevent the substrate surface from being contaminated or scratched. Moreover, since the positional deviation of the substrate is prevented by the guide portion, the substrate can be reliably carried out even if it is not in contact.

The contact area between the suction head and the surface of the substrate is preferably 0.25% or less of the surface area of the substrate.
In this case, since the contact area between the substrate and the suction head is reduced, it is possible to suppress the occurrence of dirt and scratches on the substrate surface. Further, since the position of the substrate is prevented by the guide portion, the substrate can be reliably carried out even if the contact area is small.

  A substrate inspection apparatus according to the present invention includes the above-described separation device, and separates and unloads the substrates one by one from a support that supports a plurality of substrates in a stacked state. And an inspection unit for inspecting at least one of breakage, edge chip, pinhole, dirt, and saw mark.

  In the substrate inspection apparatus having this configuration, the substrates are separated and carried out from the support one by one by the above-described separation apparatus, so that the substrates can be inspected one by one. As a result, it is possible to automatically inspect a substrate defined in JIS H 0613, and the efficiency of inspection work can be dramatically improved.

  According to the present invention, a substrate can be reliably separated and transported one by one from a support in which a plurality of substrates are supported in a stacked state, and the surface of the substrate can be contaminated or scratched, the substrate can be cracked, chipped, and It is possible to provide a separation apparatus capable of preventing the occurrence of defects such as cracks and a substrate inspection apparatus including the separation apparatus.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
1 to 4 show schematic views of a separation apparatus according to a first embodiment of the present invention. FIG. 5 shows a substrate inspection apparatus provided with this separation apparatus.
The separation device 10 according to the first embodiment of the present invention separates and carries out silicon substrates W one by one from a cassette container 20 in which a plurality of silicon substrates W for solar cells are stacked.

  As shown in FIG. 1, the separation apparatus 10 according to the present embodiment can move in the stacking direction (vertical direction) of the silicon substrate W with respect to the cassette container 20 that stores the silicon substrates W in a stacked state and the cassette container 20. The suction head 30 positioned so as to face the silicon substrate W and the cassette container 20 can be moved in the stacking direction (vertical direction) of the silicon substrate W and the side of the silicon substrate W And an air nozzle 40 located in the section.

The cassette container 20 supports the stacked silicon substrates W, and includes a bottom portion 21 and four support walls 22 as shown in FIGS. 1 and 2. The four support walls 22 of the cassette container 20 are erected so as to extend vertically from the bottom portion 21, and a notch 23 that is recessed downward is formed at the center in the width direction of each support wall 22. Yes.
In addition, on the bottom portion 21 of the cassette container 20, a mounting table 25 having a driving unit 24 that moves the accommodated silicon substrate W up and down is disposed. It is comprised so that the board | substrate W can be sent out upwards. The loading table 25 is provided with a stock sensor 26 for detecting whether or not the silicon substrate W remains in the cassette container 20.

  The silicon substrate W accommodated in the cassette container 20 is manufactured by thinly cutting a silicon ingot. In this embodiment, the silicon substrate W is cut from a single crystal silicon rod. Here, as shown in FIGS. 1 and 2, the silicon substrate W has a substantially square plate shape with a 100 to 200 mm square and a thickness of 150 to 400 μm. In the present embodiment, a silicon substrate W having a 150 mm square and a thickness of 180 μm is targeted.

  Such silicon substrates W are accommodated in the cassette container 20 in a stacked state, the thickness in the stacked state is about 150 mm, and about 800 silicon substrates W are stacked. Here, since the thickness of the silicon substrate W varies, the exact number cannot be grasped at this time. Since the thickness is set to 180 μm, silicon substrates W having a thickness exceeding 300 μm are not mixed in the cassette container 20.

The suction head 30 is provided at the front end (lower end in FIG. 1) of the drive shaft portion 31 that can move up and down, and is disposed so as to face the center of the surface of the silicon substrate W accommodated in the cassette container 20. Yes. The suction head 30 is configured such that air is blown from the outer peripheral portion of the tip so that the central portion of the tip becomes a negative pressure, and the silicon substrate W is sucked and held using the negative pressure. is there. In the present embodiment, the silicon substrate W is configured to be held in a non-contact state with the suction head 30.
Further, a support plate 32 extending in a direction orthogonal to the drive shaft portion 31 is provided on the rear end side (upper end side in FIG. 1) of the suction head 30. A load sensor 33 corresponding to the load sensor 26 provided on the mounting table 25 is provided on the support plate 32.

The air nozzle 40 is fixed to a nozzle fixing portion 41 that is movable in the stacking direction (vertical direction) of the silicon substrate W with respect to the cassette container 20.
The nozzle fixing portion 41 includes a second drive shaft portion 42 disposed coaxially with the drive shaft portion 31 of the suction head 30, and can move up and down independently of the suction head 30 (drive shaft portion 31). It is made into the composition.

The nozzle fixing portion 41 includes a second support plate 43 extending in a direction orthogonal to the second drive shaft portion 42 and a direction orthogonal to the second drive shaft portion 42 from the second support plate 43. And four arm portions 44 extending.
A guide claw portion 45 that extends toward the cassette container 20 side (downward side) and is located on the outer peripheral side of the suction pad 30 is provided at the tip of the arm portion 44.

  The arm portion 44 extends so that the tip thereof is positioned above the support wall 22 of the cassette container 20, and a part of the guide claw portion 45 corresponds to the notch portion 23 of the support wall 22. Has been. That is, in this embodiment, the four guide claws 45 are provided so as to correspond to the four support walls 22 of the cassette container 20.

  At the tip of the guide claw portion 45, a position sensor 46 for detecting the position of the uppermost silicon substrate W among the silicon substrates W stacked on the cassette container 20 and an air nozzle 40 are disposed. The air nozzle 40 is provided with a spout so that air is spouted in a range of an angle of −30 ° to 30 ° with respect to the horizontal direction. The air is ejected toward an angle of -5 °.

The position sensor 46 detects the position of the uppermost silicon substrate W among the stacked silicon substrates W, and transmits the detection result to the ejection position control unit 11 that controls the operation of the second drive shaft unit 42. In the present embodiment, the surface position of the uppermost silicon substrate W among the stacked silicon substrates W, that is, the position of the uppermost surface of the stacked silicon substrates W is detected.
The position sensor 46 detects the position of the uppermost surface of the stacked silicon substrates W and the position of the uppermost surface of the new silicon substrate W after the silicon substrate W is unloaded by the suction head 30, and outputs this signal. This is transmitted to the unloading number detection unit 12.

  In this unloading number detection unit 12, the top surface position before holding the silicon substrate W by the suction head 30 detected by the position sensor 46 is compared with the top surface position of a new substrate after holding the substrate. Thus, the thickness of the silicon substrate W held by the suction head 30 is estimated, and when this thickness exceeds a predetermined value, it is determined that two or more silicon substrates W have been carried out.

A method for carrying out a substrate by the separation apparatus 10 according to the present embodiment having such a configuration will be described.
First, the mounting table 25 of the cassette container 20 is moved up and down so that the uppermost surface of the stacked silicon substrates W is adjusted to be positioned above the lower end of the notch 23 of the support wall 22.
Next, as shown in FIG. 3, the drive shaft portion 31 and the second drive shaft portion 42 are driven to move the suction head 30 and the nozzle fixing portion 41 downward, so that the suction head 30 is brought close to the silicon substrate W. The At this time, the position of the uppermost silicon substrate W among the stacked silicon substrates W is detected by the position sensor 46 disposed in the nozzle fixing unit 41, and the ejection position control unit 11 based on the detection result. The position of the nozzle fixing portion 41 is adjusted, and the ejection position of the air nozzle 40 is adjusted.

Then, air is ejected from the air nozzle 40 obliquely downward. As a result, a part of the stacked silicon substrates W is levitated. Further, air is also ejected from the outer peripheral portion of the suction head 30, the central portion of the tip of the suction head 30 is in a negative pressure state, and the uppermost silicon substrate W is sucked and held by the suction head 30.
At this time, the silicon substrate W is sucked in a non-contact state with the suction pad 30 and the horizontal position is guided by the guide claw portion 45 provided on the nozzle fixing portion 41 and positioned on the outer peripheral side of the suction pad 30. ing.

  Here, the silicon substrates W other than the silicon substrate W adsorbed by the adsorption head 30 are pressed downward by the air ejected from the air nozzle 40, and only one silicon substrate W is held by the adsorption head 30. Become. In this state, as shown in FIG. 4, the drive shaft portion 31 and the second drive shaft portion 42 move upward, and the silicon substrates W are unloaded one by one. And when all the silicon substrates W are carried out, the stock sensors 26 and 33 react, and the cassette container 20 is replaced.

Next, the inspection apparatus 50 for the silicon substrate W provided with the separation apparatus 10 will be described.
As shown in FIG. 5, the inspection apparatus 50 receives from the separation apparatus 10 described above, an inspection section 51 that inspects the silicon substrates W separated and carried out one by one by the separation apparatus 10, and the separation apparatus 10. Transporting means 52 for transporting the transferred silicon substrate W.
In the present embodiment, the inspection unit 51 includes a back surface inspection unit 53 that inspects the back surface of the silicon substrate W while being held by the suction head 30 of the separation apparatus 10, and the surface of the silicon substrate W that is transferred from the suction head 30. And a surface inspection unit 54 that inspects both sides of the silicon substrate W. The inspection unit 51 inspects at least one of cracks, claw tracks, hooks, breaks, edge chips, pinholes, dirt, and saw marks on the silicon substrate W.

According to the separation apparatus 10 of the present embodiment configured as described above, the suction pad 30 is configured to be sucked to the center of the surface of the silicon substrate W. It is possible to prevent the bending stress from acting on the substrate W and to prevent the silicon substrate W from being cracked, chipped or broken.
Further, since the guide claw portion 45 is provided on the outer peripheral side of the suction head 30 and guides the horizontal position of the silicon substrate W held by the suction head 30, the silicon substrate W is unloaded when the silicon substrate W is carried out. Therefore, the silicon substrate W can be reliably unloaded.

  Further, since the guide claw portion 45 is provided in the nozzle fixing portion 41 to which the air nozzle 40 is fixed, the structure around the suction head 30 can be simplified. Further, since the nozzle fixing portion 41 provided with the air nozzle 40 and the guide claw portion 45 is configured to be separated from the cassette container 20, the workability of the replacement operation of the cassette container 20 can be greatly improved. it can.

Further, since the nozzle fixing unit 41 and the suction head 30 are configured to be driven independently, the positions of the nozzle fixing unit 41 and the suction pad 30 can be controlled according to the work content.
When the silicon substrate W is sucked by the suction pad 30, the nozzle fixing portion 41 is arranged so that air is directed to a predetermined position of the stacked silicon substrates W, and when the silicon substrate W is removed from the suction pad 30. The nozzle fixing portion 41 can be moved backward with respect to the suction pad 30 so as not to interfere with surrounding members. When the suction pad 30 is carried out, the nozzle fixing portion 41 is arranged so that the guide claw portion 45 is positioned on the outer peripheral side of the silicon substrate W, and the horizontal displacement of the silicon substrate W is shifted by the guide claw portion 45. Can be prevented.

  Furthermore, since the silicon substrate W is configured to be held in a non-contact state with the suction pad 30, there is no possibility that the surface of the silicon substrate W is stained or scratched. At this time, since the horizontal position of the silicon substrate 45 is guided by the guide claw portion 45, the silicon substrate W can be reliably carried out of the cassette container 20 even if it is not in contact.

  In the present embodiment, the position sensor 46 that detects the position of the uppermost silicon substrate W among the silicon substrates W stacked in the cassette container 20, and the position of the silicon substrate W detected by the position sensor 46. The ejection position control unit 11 that adjusts the ejection position of the air nozzle 40 according to the above is provided, so that the silicon substrate W held by the suction head 30 and the other silicon substrate W in close contact with the back surface of the silicon substrate W The ejection position of the air nozzle 40 can be adjusted so as to separate, and the silicon substrates W can be reliably separated and carried out one by one.

In addition, since the air nozzle 40 and the position sensor 46 are disposed in the nozzle fixing portion 41 that moves in the vertical direction with respect to the cassette container 20, the air nozzle 40 has a position corresponding to the position of the silicon substrate W detected by the position sensor 46. It is possible to reliably adjust the ejection position.
Further, the position sensor 46 detects the top surface position of the stacked silicon substrates W and the top surface position of the new silicon substrate W after the silicon substrate W is unloaded by the suction head 30, and compares them. Since the unloading number detection unit 12 for detecting whether or not two or more silicon substrates W are unloaded is provided, the two or more silicon substrates W are not unloaded at the same time. It can be surely inspected.

  Further, the substrate inspection apparatus 50 according to the present embodiment separates and carries out the silicon substrates W one by one from the cassette container 20 by the above-described separating apparatus 10 and also inspects the back surface and the front surface of the silicon substrate W. It is possible to automatically inspect the silicon substrate W for cracks, claw tracks, hooks, breaks, edge chips, pinholes, dirt, saw marks, and the like. Thereby, the efficiency of the inspection work specified by JIS H 0613 can be dramatically improved.

Next, a second embodiment of the present invention will be described. 6 and 7 show a separation apparatus according to the second embodiment.
In the separation device 110 according to the present embodiment, a ring member 134 is disposed at the tip of the suction head 130. The ring member 134 is configured to come into contact with the surface of the silicon substrate W, and the contact area between the ring member 134 and the silicon substrate W is 0.25% or less of the surface area of the silicon substrate W, more preferably. Is 0.2% or less.

  In the present embodiment, the air nozzle 140 is fixed to a nozzle fixing portion 141 that is driven independently of the suction pad 130, as in the first embodiment. The nozzle fixing portion 141 includes four arm portions 144 and four guide claw portions 145, and the guide claw portion 145 is configured to be positioned on the outer peripheral side of the suction pad 130.

  Further, in the present embodiment, the position sensor 146 is provided in the cassette container 120. The separation device 110 is configured such that a signal from the position sensor 146 is transmitted to the driving unit 124 of the mounting table 125 so that the top surface position of the silicon substrate W is a predetermined position. After the uppermost surface position of the silicon substrate W is adjusted in this way, the drive shaft portion 131 and the second drive shaft portion 142 move downward, the silicon substrate W is floated and separated by the air nozzle 140, and the suction head 130 is also separated. As a result, the silicon substrate W is held. At this time, the silicon substrate W is adsorbed while being in contact with the ring member 134.

In the separation apparatus 110 according to the present embodiment, a ring member 134 that contacts the surface of the silicon substrate W is provided at the tip of the suction pad 130, and the contact area between the ring member 134 and the silicon substrate W is the silicon substrate. Since it is 0.25% or less of the surface area of W, it can suppress that the surface of the silicon substrate W produces a stain | pollution | contamination and a crack. Further, it is possible to suppress the occurrence of cracks by suppressing the bending deformation of the silicon substrate W due to the contact with the ring member 134 during the adsorption.
Furthermore, since the horizontal displacement of the silicon substrate W is prevented by the guide claw portion 145, the silicon substrate W can be reliably carried out even if the contact area is small.

In the present embodiment, since the position sensor 146 is provided in the cassette container 120, the position sensor 146 can be provided in a location close to the silicon substrate W, and the silicon substrate W stacked in the cassette container 120 can be provided. The top surface position can be detected with high accuracy.
Moreover, since the mounting table 125 is moved up and down to control the position of the uppermost surface of the silicon substrate W, the operations of the drive shaft 131 and the second drive shaft 142 can be simplified. Further, since the position sensor 146 is fixed to the support wall 122 of the cassette container 120 that is not driven, the position sensor 146 can be easily arranged.

As mentioned above, although embodiment of this invention was described, this invention is not limited to this, It can change suitably in the range which does not deviate from the technical idea of the invention.
For example, in the present embodiment, the silicon substrate made of single crystal silicon has been described as being carried out. However, the present invention is not limited to this, and a silicon substrate made of polycrystalline silicon or a substrate made of other materials may be used. Any material that is thin and can be handled in a laminated state may be used.

  In the present embodiment, the nozzle fixing portion has been described as including four arm portions and four guide claw portions. However, the present invention is not limited to this, and the number of arm portions and guide claw portions is four. It may be other than. However, it is preferable that there are three or more guide claws for guiding the horizontal position of the silicon substrate W.

  Furthermore, although the inspection apparatus is described as being configured to inspect the back surface of the silicon substrate while being held by the suction head, the configuration of the inspection unit is not particularly limited. It is only necessary that the surface inspection of the substrate can be performed.

It is the schematic of the separation apparatus which is the 1st Embodiment of this invention. It is a top view of the separation apparatus shown in FIG. It is explanatory drawing which shows the adsorption | suction operation | movement of the separation apparatus shown in FIG. It is explanatory drawing which shows the carrying-out operation | movement of the separation apparatus shown in FIG. It is a schematic explanatory drawing which shows the inspection apparatus of the board | substrate which is embodiment of this invention. It is the schematic of the separation apparatus which is the 2nd Embodiment of this invention. It is a top view of the cassette container periphery with which the separation apparatus shown in FIG. 6 is provided.

Explanation of symbols

10, 110 Separation device 20, 120 Cassette container (support)
30, 130 Suction head 40, 140 Air nozzle (air separation mechanism)
41, 141 Nozzle fixing part (separation mechanism holding member)
45, 145 Guide claw part (guide part)
50 Inspection equipment (Board inspection equipment)
51 Inspection Unit W Silicon Substrate (Substrate)

Claims (6)

A separation device that separates and carries out the substrates one by one from a support in which a plurality of substrates are supported in a stacked state,
A suction head that is movable relative to the support in the stacking direction of the substrate and that holds the substrate by sucking it to the center of the surface of the substrate;
An air separation mechanism for ejecting air toward the laminated substrate and floating and separating a part of the laminated substrate;
A guide portion that is located on the outer peripheral side of the suction head and guides the position of the substrate that is sucked and held by the suction head;
A separation device comprising: The air separation mechanism is held by a separation mechanism holding member that is movable in the stacking direction of the substrate with respect to the support.
The separation device according to claim 1, wherein the guide portion is provided on the separation mechanism holding member.   The separation apparatus according to claim 1, wherein the separation mechanism holding member and the suction head are configured to be driven independently of each other.   The separation apparatus according to claim 1, wherein the suction head holds the substrate in a non-contact state.   The contact area between the suction head and the surface of the substrate is set to 0.25% or less of the area of the surface of the substrate. Separation device. The separation apparatus according to any one of claims 1 to 5, wherein the substrates are separated one by one from a support body that supports a plurality of substrates in a stacked state, and unloaded,
An inspection apparatus for a substrate, comprising: an inspection unit that inspects at least one of cracks, claw tracks, hooks, breaks, edge chips, pinholes, dirt, and saw marks on the substrate.

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