JP2009164176A - 半導体発光装置 - Google Patents

半導体発光装置 Download PDF

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Publication number
JP2009164176A
JP2009164176A JP2007339330A JP2007339330A JP2009164176A JP 2009164176 A JP2009164176 A JP 2009164176A JP 2007339330 A JP2007339330 A JP 2007339330A JP 2007339330 A JP2007339330 A JP 2007339330A JP 2009164176 A JP2009164176 A JP 2009164176A
Authority
JP
Japan
Prior art keywords
circuit board
electrode
light emitting
semiconductor light
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007339330A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009164176A5 (enExample
Inventor
Masaki Odawara
正樹 小田原
Masaru Aoki
大 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2007339330A priority Critical patent/JP2009164176A/ja
Priority to KR1020080129294A priority patent/KR20090072969A/ko
Priority to CN200810185048.9A priority patent/CN101471415B/zh
Publication of JP2009164176A publication Critical patent/JP2009164176A/ja
Publication of JP2009164176A5 publication Critical patent/JP2009164176A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Led Device Packages (AREA)
JP2007339330A 2007-12-28 2007-12-28 半導体発光装置 Pending JP2009164176A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007339330A JP2009164176A (ja) 2007-12-28 2007-12-28 半導体発光装置
KR1020080129294A KR20090072969A (ko) 2007-12-28 2008-12-18 반도체 발광장치
CN200810185048.9A CN101471415B (zh) 2007-12-28 2008-12-26 半导体发光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007339330A JP2009164176A (ja) 2007-12-28 2007-12-28 半導体発光装置

Publications (2)

Publication Number Publication Date
JP2009164176A true JP2009164176A (ja) 2009-07-23
JP2009164176A5 JP2009164176A5 (enExample) 2012-02-02

Family

ID=40828655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007339330A Pending JP2009164176A (ja) 2007-12-28 2007-12-28 半導体発光装置

Country Status (3)

Country Link
JP (1) JP2009164176A (enExample)
KR (1) KR20090072969A (enExample)
CN (1) CN101471415B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013254937A (ja) * 2012-05-09 2013-12-19 Rohm Co Ltd 半導体発光装置
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置
USD930857S1 (en) 2017-04-28 2021-09-14 Nichia Corporation Light-emitting unit
CN118507605A (zh) * 2024-05-14 2024-08-16 东莞市欧思科光电科技有限公司 Led灯珠、制备方法及电子设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101974354B1 (ko) 2013-02-14 2019-05-02 삼성전자주식회사 발광소자 패키지 및 그 제조 방법
KR101971436B1 (ko) * 2017-12-22 2019-04-23 주식회사 에이유이 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08242019A (ja) * 1995-03-06 1996-09-17 Shichizun Denshi:Kk チップ型発光ダイオード
JPH10242526A (ja) * 1997-02-21 1998-09-11 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2000036621A (ja) * 1998-07-16 2000-02-02 Shichizun Denshi:Kk 側面型電子部品の電極構造
JP2001111116A (ja) * 1999-10-13 2001-04-20 Rohm Co Ltd チップ型半導体発光装置
JP2003188424A (ja) * 2001-12-18 2003-07-04 Sharp Corp 表面実装型発光ダイオード

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1377045A (zh) * 2001-03-27 2002-10-30 佳邦科技股份有限公司 表面粘着型可复式过电流保护元件端电极结构及其制法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08242019A (ja) * 1995-03-06 1996-09-17 Shichizun Denshi:Kk チップ型発光ダイオード
JPH10242526A (ja) * 1997-02-21 1998-09-11 Citizen Electron Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2000036621A (ja) * 1998-07-16 2000-02-02 Shichizun Denshi:Kk 側面型電子部品の電極構造
JP2001111116A (ja) * 1999-10-13 2001-04-20 Rohm Co Ltd チップ型半導体発光装置
JP2003188424A (ja) * 2001-12-18 2003-07-04 Sharp Corp 表面実装型発光ダイオード

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013254937A (ja) * 2012-05-09 2013-12-19 Rohm Co Ltd 半導体発光装置
US9831403B2 (en) 2012-05-09 2017-11-28 Rohm Co., Ltd. Semiconductor light-emitting device
US10305005B2 (en) 2012-05-09 2019-05-28 Rohm Co., Ltd. Semiconductor light-emitting device
JP2017076809A (ja) * 2016-12-05 2017-04-20 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置
USD930857S1 (en) 2017-04-28 2021-09-14 Nichia Corporation Light-emitting unit
US11264542B2 (en) 2017-04-28 2022-03-01 Nichia Corporation Light-emitting device
US11411144B2 (en) 2017-04-28 2022-08-09 Nichia Corporation Light-emitting device
US11652192B2 (en) 2017-04-28 2023-05-16 Nichia Corporation Light-emitting device
CN118507605A (zh) * 2024-05-14 2024-08-16 东莞市欧思科光电科技有限公司 Led灯珠、制备方法及电子设备

Also Published As

Publication number Publication date
CN101471415B (zh) 2013-09-11
CN101471415A (zh) 2009-07-01
KR20090072969A (ko) 2009-07-02

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