JP2009154284A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009154284A5 JP2009154284A5 JP2008050474A JP2008050474A JP2009154284A5 JP 2009154284 A5 JP2009154284 A5 JP 2009154284A5 JP 2008050474 A JP2008050474 A JP 2008050474A JP 2008050474 A JP2008050474 A JP 2008050474A JP 2009154284 A5 JP2009154284 A5 JP 2009154284A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- tape
- release
- cutter
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive Effects 0.000 claims description 2
Description
この発明は、離型テープに貼着された粘着テープを所定長さに切断して基板の上面に貼着する粘着テープの貼着装置であって、
上記粘着テープに対して接離する方向に駆動され接近方向に駆動されたときに上記粘着テープを切断するカッタと、
このカッタによって所定の長さに切断された上記粘着テープを上記離型テープとともに上記基板に加圧して貼着する加圧ツールと、
上記離型テープの幅方向に対して軸線を相対的に所定の角度で傾斜させた状態で上記基板に貼着された粘着テープから上記離型テープを剥離する離型ローラと
を具備したことを特徴とする粘着テープの貼着装置にある。
This invention is a pressure-sensitive adhesive tape sticking device that cuts a pressure-sensitive adhesive tape stuck to a release tape into a predetermined length and sticks it to the upper surface of a substrate,
A cutter that cuts the adhesive tape when driven in the approaching direction to and away from the adhesive tape;
A pressure tool that presses and adheres the adhesive tape cut to a predetermined length by the cutter to the substrate together with the release tape;
A release roller for peeling the release tape from the adhesive tape attached to the substrate in a state where the axis is inclined at a predetermined angle relative to the width direction of the release tape;
It is in the adhesive tape sticking apparatus characterized by comprising.
この発明は、離型テープに貼着された粘着テープを所定長さに切断して基板の上面に貼着する粘着テープの貼着方法であって、This invention is a method of attaching an adhesive tape that is attached to the upper surface of a substrate by cutting the adhesive tape attached to a release tape into a predetermined length,
上記粘着テープを上記カッタによって切断する工程と、 Cutting the adhesive tape with the cutter;
上記カッタによって所定の長さに切断された上記粘着テープを上記離型テープとともに上記基板に加圧して貼着する工程と、 Applying the pressure-sensitive adhesive tape, cut to a predetermined length by the cutter, to the substrate together with the release tape;
上記離型テープの幅方向に対して軸線を相対的に所定の角度で傾斜させた状態の離型ローラによって上記基板に貼着された粘着テープから上記離型テープを剥離する工程と Peeling the release tape from the adhesive tape attached to the substrate by a release roller in a state where the axis is inclined at a predetermined angle relative to the width direction of the release tape;
を具備したことを特徴とする粘着テープの貼着方法にある。 It is in the adhesive tape sticking method characterized by comprising.
この発明は、離型テープに貼着された粘着テープを切断するカッタを備えた粘着テープの切断装置であって、
上記カッタを上昇方向に駆動して上記粘着テープを切断した後で、上記カッタを下降させる前に、このカッタを切断方向と交差する方向に駆動する駆動手段を備えていることを特徴とする粘着テープの切断装置にある。
This invention is an adhesive tape cutting device comprising a cutter for cutting an adhesive tape attached to a release tape,
And driving the cutter upward after cutting the adhesive tape, prior to lowering the cutter, characterized in that it comprises driving means for driving in a direction intersecting the cutter and the cutting direction adhesive In the tape cutting device.
Claims (8)
上記粘着テープに対して接離する方向に駆動され接近方向に駆動されたときに上記粘着テープを切断するカッタと、 A cutter that cuts the adhesive tape when driven in the approaching direction to and away from the adhesive tape; and
このカッタによって所定の長さに切断された上記粘着テープを上記離型テープとともに上記基板に加圧して貼着する加圧ツールと、 A pressure tool that presses and adheres the adhesive tape cut to a predetermined length by the cutter to the substrate together with the release tape;
上記離型テープの幅方向に対して軸線を相対的に所定の角度で傾斜させた状態で上記基板に貼着された粘着テープから上記離型テープを剥離する離型ローラと A release roller for peeling the release tape from the adhesive tape attached to the substrate in a state where the axis is inclined at a predetermined angle relative to the width direction of the release tape;
を具備したことを特徴とする粘着テープの貼着装置。 An adhesive tape sticking device comprising:
上記基板に粘着テープを貼着してから上記離型テープを剥離するときに、上記ステージによって基板を回転させて上記離型テープの幅方向に対して上記離型ローラの軸線を所定の角度で傾斜させることを特徴とする請求項１記載の粘着テープの貼着装置。 When the release tape is peeled off after sticking the adhesive tape on the substrate, the substrate is rotated by the stage so that the axis of the release roller is at a predetermined angle with respect to the width direction of the release tape. The pressure-sensitive adhesive tape sticking device according to claim 1, wherein the pressure-sensitive adhesive tape is inclined.
上記粘着テープを上記カッタによって切断する工程と、 Cutting the adhesive tape with the cutter;
上記カッタによって所定の長さに切断された上記粘着テープを上記離型テープとともに上記基板に加圧して貼着する工程と、 Applying the pressure-sensitive adhesive tape, cut to a predetermined length by the cutter, to the substrate together with the release tape;
上記離型テープの幅方向に対して軸線を相対的に所定の角度で傾斜させた状態の離型ローラによって上記基板に貼着された粘着テープから上記離型テープを剥離する工程と Peeling the release tape from the adhesive tape attached to the substrate by a release roller in a state where the axis is inclined at a predetermined angle relative to the width direction of the release tape;
を具備したことを特徴とする粘着テープの貼着方法。 A method for attaching an adhesive tape, comprising:
上記粘着テープを切断するカッタを有し、このカッタは上記粘着テープの幅方向に対して所定の角度で傾斜して配置されていることを特徴とする粘着テープの切断装置。 An adhesive tape cutting device comprising a cutter for cutting the adhesive tape, wherein the cutter is disposed at a predetermined angle with respect to the width direction of the adhesive tape.
上記カッタは、一側面が垂直面、他側面が傾斜面、先端が平坦面に形成されていて、 The cutter is formed such that one side is a vertical surface, the other side is an inclined surface, and the tip is a flat surface.
上記カッタが前進して粘着テープを切断してから後退するとき、上記垂直面と上記粘着テープの切断された面との接触抵抗によって上記粘着テープの切断部分が上記離型テープから剥離されることを特徴とする粘着テープの切断装置。 When the cutter moves forward and cuts the adhesive tape and then moves backward, the cut portion of the adhesive tape is peeled off from the release tape due to contact resistance between the vertical surface and the cut surface of the adhesive tape. An adhesive tape cutting device.
上記カッタを上昇方向に駆動して上記粘着テープを切断した後で、上記カッタを下降させる前に、このカッタを切断方向と交差する方向に駆動する駆動手段を備えていることを特徴とする粘着テープの切断装置。 An adhesive comprising drive means for driving the cutter in a direction intersecting the cutting direction after the cutter is driven in the upward direction and the adhesive tape is cut and before the cutter is lowered. Tape cutting device.
上記粘着テープを上記カッタによって切断する工程と、 Cutting the adhesive tape with the cutter;
上記カッタによって切断された上記粘着テープの切断箇所の近傍を上記離型テープから剥離する工程と Peeling the vicinity of the cut portion of the adhesive tape cut by the cutter from the release tape;
を具備したことを特徴とする粘着テープの切断方法。 A method of cutting an adhesive tape, comprising:
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008050474A JP5078672B2 (en) | 2007-12-06 | 2008-02-29 | Adhesive tape sticking device and sticking method |
| KR1020107014951A KR101184132B1 (en) | 2007-12-06 | 2008-11-12 | Applying device and applying method for adhesive tape |
| CN2008801185224A CN101883729B (en) | 2007-12-06 | 2008-11-12 | Cutting device and cutting method for adhesive tape, and applying device and applying method for adhesive tape |
| PCT/JP2008/070610 WO2009072377A1 (en) | 2007-12-06 | 2008-11-12 | Cutting device and cutting method for adhesive tape, and applying device and applying method for adhesive tape |
| TW097144843A TWI462815B (en) | 2007-12-06 | 2008-11-20 | Adhesive tape is attached to the device and close to the method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007316051 | 2007-12-06 | ||
| JP2007316051 | 2007-12-06 | ||
| JP2008050474A JP5078672B2 (en) | 2007-12-06 | 2008-02-29 | Adhesive tape sticking device and sticking method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009154284A JP2009154284A (en) | 2009-07-16 |
| JP2009154284A5 true JP2009154284A5 (en) | 2010-07-01 |
| JP5078672B2 JP5078672B2 (en) | 2012-11-21 |
Family
ID=40958845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008050474A Active JP5078672B2 (en) | 2007-12-06 | 2008-02-29 | Adhesive tape sticking device and sticking method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5078672B2 (en) |
| KR (1) | KR101184132B1 (en) |
| CN (1) | CN101883729B (en) |
| TW (1) | TWI462815B (en) |
| WO (1) | WO2009072377A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009037506B4 (en) * | 2009-08-17 | 2011-09-15 | Karl Eugen Fischer Gmbh | Cutting device for cutting a thin and sticky strip, in particular a cord band |
| CN102172918A (en) * | 2011-01-06 | 2011-09-07 | 硕方科技（北京）有限公司 | Semi-cut control equipment and method |
| JP5408177B2 (en) * | 2011-04-18 | 2014-02-05 | パナソニック株式会社 | ACF sticking device |
| TWI618131B (en) * | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | Device for forming separation starting point, stack manufacturing apparatus, and method for forming separation starting point |
| JP6431256B2 (en) * | 2013-10-11 | 2018-11-28 | デクセリアルズ株式会社 | Adhesive film, film winding body, connection structure manufacturing method, connection method, connection structure |
| JP6086883B2 (en) * | 2014-09-01 | 2017-03-01 | 株式会社シーティーケイ | Long material cutting device |
| JP6463160B2 (en) * | 2015-02-05 | 2019-01-30 | リンテック株式会社 | Sheet manufacturing equipment |
| JP6622461B2 (en) * | 2015-02-05 | 2019-12-18 | リンテック株式会社 | Sheet manufacturing equipment |
| CN106477377B (en) * | 2016-12-12 | 2018-05-11 | 深圳市欣中大自动化技术有限公司 | A kind of half cutting apparatus of cover layer |
| JP2018104152A (en) * | 2016-12-27 | 2018-07-05 | スリーエム イノベイティブ プロパティズ カンパニー | Tape cutting device |
| EP3351361A1 (en) * | 2017-01-19 | 2018-07-25 | 3M Innovative Properties Company | Apparatus for scoring a layer adhesively placed on a substrate and method of separating such a layer |
| JP6901122B2 (en) * | 2017-05-11 | 2021-07-14 | マルゴ工業株式会社 | Tape pasting unit and tape pasting device |
| DE102017011506B4 (en) * | 2017-12-13 | 2021-01-28 | Lts Lohmann Therapie-Systeme Ag | Separating device and separating method for adhesive composite material |
| CN110682336A (en) * | 2019-09-19 | 2020-01-14 | 无锡先导智能装备股份有限公司 | Rubberizing device and rubber cutting mechanism thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08133560A (en) * | 1994-11-09 | 1996-05-28 | Toshiba Corp | Applying device and applying method of adhesive tape piece |
| JPH11160695A (en) * | 1997-11-28 | 1999-06-18 | Optrex Corp | Method of peeling off a polarized light film and device therefor |
| JP4230120B2 (en) * | 2001-02-28 | 2009-02-25 | キヤノンファインテック株式会社 | Printing tape half-cutting device |
| JP4080187B2 (en) | 2001-08-02 | 2008-04-23 | 芝浦メカトロニクス株式会社 | Tape material sticking device |
| JP4461753B2 (en) * | 2003-09-24 | 2010-05-12 | セイコーエプソン株式会社 | Liquid crystal device and electronic device |
| JP2006121035A (en) * | 2004-09-27 | 2006-05-11 | Ngk Spark Plug Co Ltd | Film peeling apparatus and method for manufacturing wiring board |
| JP5076292B2 (en) * | 2005-08-08 | 2012-11-21 | パナソニック株式会社 | Anisotropic conductive film pasting apparatus and method |
| JP4417893B2 (en) * | 2005-08-10 | 2010-02-17 | 芝浦メカトロニクス株式会社 | Adhesive tape sticking device and sticking method |
-
2008
- 2008-02-29 JP JP2008050474A patent/JP5078672B2/en active Active
- 2008-11-12 WO PCT/JP2008/070610 patent/WO2009072377A1/en active Application Filing
- 2008-11-12 CN CN2008801185224A patent/CN101883729B/en not_active Expired - Fee Related
- 2008-11-12 KR KR1020107014951A patent/KR101184132B1/en not_active IP Right Cessation
- 2008-11-20 TW TW097144843A patent/TWI462815B/en not_active IP Right Cessation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009154284A5 (en) | ||
| JP4740296B2 (en) | Sheet peeling apparatus and peeling method | |
| KR101579783B1 (en) | Sheet peeling apparatus | |
| TWI466185B (en) | Peeling device of a protection tape | |
| JP4441450B2 (en) | Sheet sticking device and sticking method | |
| TWI462815B (en) | Adhesive tape is attached to the device and close to the method | |
| JP4802213B2 (en) | Adhesive seal peeling method | |
| KR20110079818A (en) | Apparatus and method for peeling sheet | |
| TWI419217B (en) | Device manufacturing method | |
| TW200738084A (en) | Method and device for sticking film | |
| EP1617463A3 (en) | Film peeling method and film peeling device | |
| WO2007060803A1 (en) | Sheet adhering apparatus and sheet adhering method | |
| JP2011023612A5 (en) | ||
| EP1903599A3 (en) | Adhesive tape cutting method and adhesive tape joining apparatus using the same | |
| JP2008115259A (en) | Sheet for pasting | |
| JP2013095006A5 (en) | ||
| JP4824622B2 (en) | Sheet peeling apparatus and peeling method | |
| JP2007043057A (en) | Table for adhering sheet | |
| WO2008126212A1 (en) | Ultrasonic bonding apparatus | |
| JP2012017204A5 (en) | ||
| WO2008099704A1 (en) | Cutting device and method for controlling the same | |
| JP5238390B2 (en) | Sheet peeling apparatus and peeling method | |
| JP4643512B2 (en) | Sheet sticking device and sticking method | |
| JP2009300566A (en) | Label and label peeling device | |
| JP5378089B2 (en) | Protective tape peeling device |