JP2009137002A - 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体 - Google Patents

穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体 Download PDF

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Publication number
JP2009137002A
JP2009137002A JP2008266367A JP2008266367A JP2009137002A JP 2009137002 A JP2009137002 A JP 2009137002A JP 2008266367 A JP2008266367 A JP 2008266367A JP 2008266367 A JP2008266367 A JP 2008266367A JP 2009137002 A JP2009137002 A JP 2009137002A
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JP
Japan
Prior art keywords
strip
sealing strip
substrate
substrates
void
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008266367A
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English (en)
Japanese (ja)
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JP2009137002A5 (https=
Inventor
Xavier Baillin
グザビエ、ベラン
Jean Brun
ジャン、ブラン
Thierry Enot
ティエリー、エノ
David Henry
ダビド、アンリ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
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Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of JP2009137002A publication Critical patent/JP2009137002A/ja
Publication of JP2009137002A5 publication Critical patent/JP2009137002A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
JP2008266367A 2007-10-15 2008-10-15 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体 Pending JP2009137002A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0707213A FR2922203B1 (fr) 2007-10-15 2007-10-15 Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue.

Publications (2)

Publication Number Publication Date
JP2009137002A true JP2009137002A (ja) 2009-06-25
JP2009137002A5 JP2009137002A5 (https=) 2011-11-24

Family

ID=39487232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008266367A Pending JP2009137002A (ja) 2007-10-15 2008-10-15 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体

Country Status (4)

Country Link
US (1) US8112882B2 (https=)
EP (1) EP2050713B1 (https=)
JP (1) JP2009137002A (https=)
FR (1) FR2922203B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176955A (ja) * 2008-01-24 2009-08-06 Fujikura Ltd 半導体装置およびその製造方法
US12384861B2 (en) 2020-06-24 2025-08-12 Dow Global Technologies Llc Crosslinked compositions from olefin/silane interpolymers

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009029180B4 (de) * 2009-09-03 2017-07-20 Robert Bosch Gmbh Mikrosystem
US9102517B2 (en) 2012-08-22 2015-08-11 International Business Machines Corporation Semiconductor structures provided within a cavity and related design structures
CN103395736B (zh) * 2013-08-09 2015-12-09 杭州士兰集成电路有限公司 Mems玻璃浆料键合结构及其制造方法
US20190202684A1 (en) * 2017-12-29 2019-07-04 Texas Instruments Incorporated Protective bondline control structure
CN114824148A (zh) * 2021-01-29 2022-07-29 上海和辉光电股份有限公司 一种oled封装结构及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002518862A (ja) * 1998-06-23 2002-06-25 アメラシア インターナショナル テクノロジー，インコーポレイテッド 電子素子の接着剤プリフォーム蓋を作成する方法
US6589625B1 (en) * 2001-08-01 2003-07-08 Iridigm Display Corporation Hermetic seal and method to create the same
JP2003243160A (ja) * 2002-02-12 2003-08-29 Seiko Epson Corp 電気光学装置の製造方法及び製造装置、電気光学装置、電子機器
JP2006121052A (ja) * 2004-09-27 2006-05-11 Idc Llc Ｍｅｍｓデバイスを、組み込まれたゲッターとともにパッケージする方法及びシステム
JP2006123160A (ja) * 2004-09-27 2006-05-18 Idc Llc 二次的シールを有するｍｅｍｓ装置パッケージを提供する方法及び装置
JP2007317663A (ja) * 2006-05-24 2007-12-06 Commiss Energ Atom エネルギー回復と貯蔵機能を結合する一体化されたマイクロ部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
US6428650B1 (en) * 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6374683B1 (en) * 1999-01-29 2002-04-23 Genomic Instrumentation Services, Inc. Pipetter
KR100347436B1 (ko) * 1999-12-16 2002-08-03 엘지.필립스 엘시디 주식회사 액정 표시장치의 씰 패턴 형성방법 및 그 방법에 의해제조된 씰 패턴
US6791660B1 (en) * 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
DE102004027501A1 (de) 2004-06-04 2005-12-22 Robert Bosch Gmbh Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002518862A (ja) * 1998-06-23 2002-06-25 アメラシア インターナショナル テクノロジー，インコーポレイテッド 電子素子の接着剤プリフォーム蓋を作成する方法
US6589625B1 (en) * 2001-08-01 2003-07-08 Iridigm Display Corporation Hermetic seal and method to create the same
JP2003243160A (ja) * 2002-02-12 2003-08-29 Seiko Epson Corp 電気光学装置の製造方法及び製造装置、電気光学装置、電子機器
JP2006121052A (ja) * 2004-09-27 2006-05-11 Idc Llc Ｍｅｍｓデバイスを、組み込まれたゲッターとともにパッケージする方法及びシステム
JP2006123160A (ja) * 2004-09-27 2006-05-18 Idc Llc 二次的シールを有するｍｅｍｓ装置パッケージを提供する方法及び装置
JP2007317663A (ja) * 2006-05-24 2007-12-06 Commiss Energ Atom エネルギー回復と貯蔵機能を結合する一体化されたマイクロ部品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176955A (ja) * 2008-01-24 2009-08-06 Fujikura Ltd 半導体装置およびその製造方法
US12384861B2 (en) 2020-06-24 2025-08-12 Dow Global Technologies Llc Crosslinked compositions from olefin/silane interpolymers

Also Published As

Publication number Publication date
US20090094816A1 (en) 2009-04-16
EP2050713B1 (fr) 2012-05-23
EP2050713A1 (fr) 2009-04-22
FR2922203B1 (fr) 2009-11-20
FR2922203A1 (fr) 2009-04-17
US8112882B2 (en) 2012-02-14

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