JP2009137002A5 - - Google Patents
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- Publication number
- JP2009137002A5 JP2009137002A5 JP2008266367A JP2008266367A JP2009137002A5 JP 2009137002 A5 JP2009137002 A5 JP 2009137002A5 JP 2008266367 A JP2008266367 A JP 2008266367A JP 2008266367 A JP2008266367 A JP 2008266367A JP 2009137002 A5 JP2009137002 A5 JP 2009137002A5
- Authority
- JP
- Japan
- Prior art keywords
- strip
- void
- substrates
- voids
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0707213A FR2922203B1 (fr) | 2007-10-15 | 2007-10-15 | Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009137002A JP2009137002A (ja) | 2009-06-25 |
| JP2009137002A5 true JP2009137002A5 (https=) | 2011-11-24 |
Family
ID=39487232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008266367A Pending JP2009137002A (ja) | 2007-10-15 | 2008-10-15 | 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8112882B2 (https=) |
| EP (1) | EP2050713B1 (https=) |
| JP (1) | JP2009137002A (https=) |
| FR (1) | FR2922203B1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4942671B2 (ja) * | 2008-01-24 | 2012-05-30 | 株式会社フジクラ | 半導体装置およびその製造方法 |
| DE102009029180B4 (de) * | 2009-09-03 | 2017-07-20 | Robert Bosch Gmbh | Mikrosystem |
| US9102517B2 (en) | 2012-08-22 | 2015-08-11 | International Business Machines Corporation | Semiconductor structures provided within a cavity and related design structures |
| CN103395736B (zh) * | 2013-08-09 | 2015-12-09 | 杭州士兰集成电路有限公司 | Mems玻璃浆料键合结构及其制造方法 |
| US20190202684A1 (en) * | 2017-12-29 | 2019-07-04 | Texas Instruments Incorporated | Protective bondline control structure |
| EP4172258A1 (en) | 2020-06-24 | 2023-05-03 | Dow Global Technologies LLC | Crosslinked compositions from olefin/silane interpolymers |
| CN114824148A (zh) * | 2021-01-29 | 2022-07-29 | 上海和辉光电股份有限公司 | 一种oled封装结构及其制备方法和应用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837935A (en) * | 1996-02-26 | 1998-11-17 | Ford Motor Company | Hermetic seal for an electronic component having a secondary chamber |
| US6428650B1 (en) * | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
| US6136128A (en) * | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
| US6374683B1 (en) * | 1999-01-29 | 2002-04-23 | Genomic Instrumentation Services, Inc. | Pipetter |
| KR100347436B1 (ko) * | 1999-12-16 | 2002-08-03 | 엘지.필립스 엘시디 주식회사 | 액정 표시장치의 씰 패턴 형성방법 및 그 방법에 의해제조된 씰 패턴 |
| US6589625B1 (en) * | 2001-08-01 | 2003-07-08 | Iridigm Display Corporation | Hermetic seal and method to create the same |
| US6791660B1 (en) * | 2002-02-12 | 2004-09-14 | Seiko Epson Corporation | Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
| JP4069639B2 (ja) * | 2002-02-12 | 2008-04-02 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
| DE102004027501A1 (de) | 2004-06-04 | 2005-12-22 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren |
| US20060076631A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for providing MEMS device package with secondary seal |
| US20060076634A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for packaging MEMS devices with incorporated getter |
| FR2901639B1 (fr) * | 2006-05-24 | 2008-08-22 | Commissariat Energie Atomique | Micro-composant integre associant les fonctions de recuperation et de stockage de l'energie |
-
2007
- 2007-10-15 FR FR0707213A patent/FR2922203B1/fr not_active Expired - Fee Related
-
2008
- 2008-10-07 EP EP08354068A patent/EP2050713B1/fr active Active
- 2008-10-09 US US12/285,623 patent/US8112882B2/en active Active
- 2008-10-15 JP JP2008266367A patent/JP2009137002A/ja active Pending
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