FR2922203B1 - Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. - Google Patents
Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue.Info
- Publication number
- FR2922203B1 FR2922203B1 FR0707213A FR0707213A FR2922203B1 FR 2922203 B1 FR2922203 B1 FR 2922203B1 FR 0707213 A FR0707213 A FR 0707213A FR 0707213 A FR0707213 A FR 0707213A FR 2922203 B1 FR2922203 B1 FR 2922203B1
- Authority
- FR
- France
- Prior art keywords
- making
- seal cord
- adjusted seal
- structure obtained
- adjusted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49181—Assembling terminal to elongated conductor by deforming
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0707213A FR2922203B1 (fr) | 2007-10-15 | 2007-10-15 | Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. |
EP08354068A EP2050713B1 (fr) | 2007-10-15 | 2008-10-07 | Procédé de réalisation d'une cavité ayant un cordon de scellement |
US12/285,623 US8112882B2 (en) | 2007-10-15 | 2008-10-09 | Method for producing a structure |
JP2008266367A JP2009137002A (ja) | 2007-10-15 | 2008-10-15 | 穿孔されたシール・ストリップを有する構造体を製造する方法およびこの方法により得られる構造体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0707213A FR2922203B1 (fr) | 2007-10-15 | 2007-10-15 | Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2922203A1 FR2922203A1 (fr) | 2009-04-17 |
FR2922203B1 true FR2922203B1 (fr) | 2009-11-20 |
Family
ID=39487232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0707213A Expired - Fee Related FR2922203B1 (fr) | 2007-10-15 | 2007-10-15 | Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. |
Country Status (4)
Country | Link |
---|---|
US (1) | US8112882B2 (fr) |
EP (1) | EP2050713B1 (fr) |
JP (1) | JP2009137002A (fr) |
FR (1) | FR2922203B1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4942671B2 (ja) * | 2008-01-24 | 2012-05-30 | 株式会社フジクラ | 半導体装置およびその製造方法 |
DE102009029180B4 (de) * | 2009-09-03 | 2017-07-20 | Robert Bosch Gmbh | Mikrosystem |
US9102517B2 (en) | 2012-08-22 | 2015-08-11 | International Business Machines Corporation | Semiconductor structures provided within a cavity and related design structures |
CN103395736B (zh) * | 2013-08-09 | 2015-12-09 | 杭州士兰集成电路有限公司 | Mems玻璃浆料键合结构及其制造方法 |
US20190202684A1 (en) * | 2017-12-29 | 2019-07-04 | Texas Instruments Incorporated | Protective bondline control structure |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837935A (en) * | 1996-02-26 | 1998-11-17 | Ford Motor Company | Hermetic seal for an electronic component having a secondary chamber |
US6428650B1 (en) * | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
US6136128A (en) * | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
US6374683B1 (en) * | 1999-01-29 | 2002-04-23 | Genomic Instrumentation Services, Inc. | Pipetter |
KR100347436B1 (ko) * | 1999-12-16 | 2002-08-03 | 엘지.필립스 엘시디 주식회사 | 액정 표시장치의 씰 패턴 형성방법 및 그 방법에 의해제조된 씰 패턴 |
US6589625B1 (en) * | 2001-08-01 | 2003-07-08 | Iridigm Display Corporation | Hermetic seal and method to create the same |
JP4069639B2 (ja) * | 2002-02-12 | 2008-04-02 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
US6791660B1 (en) * | 2002-02-12 | 2004-09-14 | Seiko Epson Corporation | Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances |
DE102004027501A1 (de) | 2004-06-04 | 2005-12-22 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren |
US20060076634A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for packaging MEMS devices with incorporated getter |
US20060076631A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for providing MEMS device package with secondary seal |
FR2901639B1 (fr) * | 2006-05-24 | 2008-08-22 | Commissariat Energie Atomique | Micro-composant integre associant les fonctions de recuperation et de stockage de l'energie |
-
2007
- 2007-10-15 FR FR0707213A patent/FR2922203B1/fr not_active Expired - Fee Related
-
2008
- 2008-10-07 EP EP08354068A patent/EP2050713B1/fr active Active
- 2008-10-09 US US12/285,623 patent/US8112882B2/en active Active
- 2008-10-15 JP JP2008266367A patent/JP2009137002A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20090094816A1 (en) | 2009-04-16 |
FR2922203A1 (fr) | 2009-04-17 |
JP2009137002A (ja) | 2009-06-25 |
US8112882B2 (en) | 2012-02-14 |
EP2050713B1 (fr) | 2012-05-23 |
EP2050713A1 (fr) | 2009-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20140630 |