JP2009123726A - Production process of aggregate of electronic component and aggregate of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To propose a method for obtaining an aggregate of electronic components which can achieve a smaller interval between components than before, and to propose an aggregate of electronic components which can be obtained by that method. <P>SOLUTION: The production method of an aggregate of electronic components comprises a step for arranging a plurality of chip type components to be brought into contact with one another; a step for making a holding member hold the chip type components thus arranged; a step for extending the holding member holding the plurality of chip type components, to form a gap between respective chip type components; a step for feeding curable insulating resin, in a state where the holding member is extended and coating the plurality of chip type components with the insulating resin, while filling the gap with the insulating resin; and a step for removing the holding member, after the insulating resin is cured. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component assembly manufacturing method in which a plurality of chip-type electronic components are integrated, and an electronic component assembly formed by the manufacturing method.

  In recent years, communication devices such as mobile phones have been reduced in size and functionality. Such a communication device is composed of a circuit device in which a semiconductor component such as an IC or LSI, a passive component such as a capacitor or a chip resistor, and other mechanical components are mounted on a wiring board. Such circuit devices are also increasingly required to be miniaturized. Further, this circuit device tends to increase the number of components mounted in order to meet the demand for higher functionality. For this reason, the number of parts per unit area, that is, the mounting density of the circuit device has been increased due to the demand for miniaturization.

Such a circuit device includes a step of printing and applying cream solder on a bonding pad on a wiring board, a step of mounting an electronic component on the bonding pad by a mounter, and a heating of the wiring substrate on which the electronic component is mounted in a reflow furnace. Then, the cream solder is melted and the electronic component is soldered to the reflow process. For this reason, the mounting density of circuit devices is influenced by component size errors (tolerances), mounter mounting position errors, and cream solder printing errors in addition to the progress of miniaturization of components. At present, due to these effects, the distance between the components of the circuit device is about 0.1 mm for electronic components of the 0402 type (length × width is 0.4 mm × 0.2 mm). Therefore, the ratio of the interval between components to the size of the electronic component is increased, and there is a problem that the dead space is increased.

As a means for solving such a problem, there is a method using an array type electronic component. An array type electronic component is, for example, a capacitor array in which two or more capacitors are formed in one component. For example, a 2010 type (2.0 mm × 1.0 mm) quadruple capacitor array is equivalent to an array of four 1005 type (1.0 mm × 0.5 mm) capacitors. The capacitor array has a smaller mounting area than the case where individual capacitors are mounted side by side, so that at least an interval between components is not required. Therefore, the array-type electronic component is advantageous for increasing the mounting density. However, in the array type electronic component, the type of component (capacitor, resistor, etc.) and the electrical characteristics (capacitance, resistance value, etc.) of the component are fixed. Therefore, the array type electronic component has a problem that the range of selection of the component type and the electrical characteristics is narrowed.

Therefore, as a means for expanding the range of selection of component types and electrical characteristics of components, there is a method of forming an electronic component assembly in which a plurality of individual chip type electronic components are integrated by a resin mold or the like Can be mentioned. Since this electronic component assembly is formed by combining individual chip-type electronic components, the degree of freedom in selecting the type of component and selecting the electrical characteristics of the component is increased. As a form of the electronic component assembly, there is a configuration in which a plurality of electronic components are arranged in a predetermined positional relationship on the holding member as disclosed in Japanese Patent Application Laid-Open No. 2004-179317. There exists a form of hold | maintaining an electronic component in the block body which has the some recessed part for holding | maintenance as disclosed by -057434 gazette.

JP 2004-179317 A JP 2002-057434 A

However, since the electronic component assembly disclosed in Japanese Patent Application Laid-Open No. 2004-179317 uses a component mounting machine, that is, a mounter, when arranging chip-type electronic components, the interval between components is a component of a normal circuit device. However, it was difficult to further increase the mounting density.

Further, in the electronic component assembly disclosed in Japanese Patent Application Laid-Open No. 2002-057434, in order to achieve high packaging density, the interval between the holding recesses of the block body is smaller than the current interval between components. There is a need to. However, in this case, since the thickness between the holding recesses of the block body becomes very thin, the formation of the block body becomes very difficult. Further, the strength of the block body becomes weak, and it becomes difficult to insert the chip-type electronic component into the holding recess.

The present invention obtains an electronic assembly capable of realizing an interval smaller than the current interval between components while taking advantage of the possibility of expanding the range of selection of component types and electrical characteristics of components. A method that can be used, and an electronic component assembly obtained by the method are proposed.

  In the present invention, as a first solution, in a method of manufacturing an electronic component assembly in which a plurality of chip-type electronic components are integrated by a resin mold, a step of packing and holding a plurality of chip-type electronic components on a holding member; Extending the holding member holding the plurality of chip-type electronic components in a planar direction to form a gap between each of the plurality of chip-type electronic components; and extending the holding member And a step of pouring a curable insulating resin to cover the plurality of chip-type electronic components and filling the gap with the insulating resin; and after the insulating resin is cured, the holding member is removed. And a step of manufacturing the electronic component assembly. In addition, as a means for extending the holding member in the plane direction, there are a method in which the holding member is heated and thermally expanded, or a method in which tension is applied to the holding member and the holding member is extended.

In the first solution, the chip-type electronic components are once arranged in contact with each other and the holding member is extended in the plane direction to form a gap between the components. The size of the gap can be controlled by the coefficient of thermal expansion (linear expansion coefficient) of the holding member and the heating temperature, or by the tension when the holding member is stretched. As a result, the interval between components can be made smaller than the level of conventional mounting density (0.12 mm interval for the 0402 type).

In the present invention, an electronic component assembly formed through the steps of the first solution is proposed as the second solution. The electronic component assembly according to the second solution means that the interval between the components is formed even smaller than the conventional mounting density level (0.12 mm interval for the 0402 type), so that further high-density mounting is possible. Become. Moreover, this electronic component assembly may include electronic components having different shapes. Thereby, an electronic component assembly corresponding to the circuit design can be obtained.

  According to the manufacturing method of the present invention, it is possible to realize an interval smaller than the current interval between components while taking advantage of the possibility of widening the selection of component types and the selection of electrical characteristics of components. An electronic assembly can be obtained. Moreover, according to the electronic component assembly of the present invention, a mounting density higher than the current mounting density can be realized.

  Embodiments according to the electronic component assembly of the present invention will be described with reference to the drawings. 1A and 1B show an electronic component assembly formed by the manufacturing method of the present invention. FIG. 1A is a side view, and FIG. 1B is a bottom view.

  In the electronic component assembly 1, a plurality of chip-type electronic components 2 are arranged at intervals in the length direction W1 and the width direction W2, and the plurality of arranged chip-type electronic components 2 are formed of an insulating resin. It has a structure integrated by the resin mold 3. A part of the terminal electrodes 2a of the plurality of chip-type electronic components 2 is exposed on the lower surface of the electronic component assembly 1 in order to connect to the bonding pads on the wiring board.

  The chip type electronic component 2 includes, for example, a multilayer capacitor, a multilayer inductor, a resistor chip, a chip varistor, and the like as a component type. The shape of the chip-type electronic component 2 includes a square shape and a cylindrical shape, but a square shape is preferable. In the electronic component assembly 1 of FIG. 1, nine chip-type electronic components 2 of the same size are aligned in a 3 × 3 lattice pattern, and the electronic component assembly 1 shown in FIG. Like ', the type of component, the size (length, width, height) of the component and the orientation of the component do not have to be uniform and can be variously changed according to the circuit design.

  In the electronic component assembly 1 of the present invention, the intervals W1 and W2 between the chip-type electronic components 2 are formed to be smaller than 0.1 mm. At the mounting density level by the current mounter, the limit of the interval between components is 0402 type and 0.1 mm, so that the electronic component assembly 1 of the present invention can be mounted at a higher density than before.

The resin mold 3 is formed of a curable insulating resin such as an epoxy resin or a phenol resin. As the insulating resin, a photocurable, ultraviolet curable or thermosetting resin is used. The insulating resin is used with its viscosity and the like adjusted as appropriate so that it can enter a gap between parts smaller than 0.1 mm.

  FIG. 3 shows a state where the electronic component assembly 1 of the present invention is mounted on a wiring board. The terminal electrode 2 a of the chip-type electronic component 2 exposed on the lower surface of the electronic component assembly 1 is bonded to the bonding pad 4 a on the wiring substrate 4. Since the distance between the bonding pads 4a is also a minimum and smaller than 0.1 mm, the size of the bonding pad is designed to be smaller than that of a normal wiring board.

  Next, an embodiment according to a first process of the electronic component assembly of the present invention will be described. In the following description, chip type electronic components of 1005 type (length 1.0 mm, width 0.5 mm, height 0.5 mm) are arranged in a 3 × 3 lattice pattern at intervals of 0.01 to 0.02 mm. The electronic component assembly arranged in the above will be described as an example.

  First, as shown in FIG. 4, nine chip-type electronic components 2 are arranged in a grid pattern. As a method of arranging the chip-type electronic components 2, there are a method of using a component supply device such as a linear feeder, an existing alignment jig, or the like. Note that “packed and arranged” means that the chip-type electronic components 2 are arranged in contact with each other or close to each other. In addition, the “state close to that” refers to a state where there is a slight gap compared to a state where they are in contact with each other. Here, a gap smaller than 0.01 mm is provided.

  Subsequently, as shown in FIG. 5, a PTFE (polytetrafluoroethylene: linear expansion coefficient = about 100 ppm / ° C.) holding member 5 provided with an adhesive member 5a is prepared, and the aligned chip-type electronic components 2 are held. Let The chip-type electronic component 2 is bonded to the bonding member 5 a and held by the holding member 5. In this case, as shown in FIG. 4, the chip-type electronic component 2 may bite into the adhesive member 5a. Here, the PTFE plate material is used as the holding member 5, but there is no particular limitation on the material as long as it is a plate-like member that expands when heated. However, it is desirable to select a member such that the heating temperature for obtaining a desired interval between components is a temperature that does not adversely affect the insulating resin for resin molding. The adhesive member 5a is preferably a silicon-based adhesive sheet, for example. The adhesive member 5 a is preferably made of a material that can follow the thermal expansion of the holding member 5. In this embodiment, the chip type electronic component 2 is arranged and then held by the holding member 5. However, the chip type electronic component 2 may be arranged directly on the holding member 5.

  Subsequently, as shown in FIG. 6, the holding member 5 is heated and thermally expanded. By heating the PTFE holding member 5 at about 200 ° C., the distance between the chip-type electronic components 2 is increased to 0.01 to 0.02 mm. The distance between the chip-type electronic components 2 can be controlled by the expansion coefficient of the holding member 5. The expansion coefficient of the holding member 5 can be controlled by the linear expansion coefficient of the holding member 5 and the heating temperature. Therefore, the material between the chip-type electronic components 2 can be controlled by using a material whose linear expansion coefficient is known as the holding member 5 and controlling the heating temperature.

  Subsequently, as shown in FIG. 7, the chip-type electronic component 2 is covered with a resin mold 3 and integrated. At this time, since it is necessary to keep a space between the chip-type electronic components 2, it is necessary to keep the holding member 5 in a state of being thermally expanded. Therefore, a curable insulating resin is poured in the state where the holding member 5 is heated. When the insulating resin is poured, in order to fill the insulating resin between the chip-type electronic components 2, it may be performed under reduced pressure using a vacuum chamber or the like. If the curable insulating resin is thermosetting, it is heated and cured as it is. If it is photocurable or ultraviolet curable, the holding member 5 is heated and irradiated with light or ultraviolet rays to be cured. After the insulating resin is cured, the holding member 5 and the adhesive member 5a are removed. In this way, the electronic component assembly 1 shown in FIG. 1 is obtained.

  In the above-described embodiment, the method of forming the electronic component assemblies 1 one by one has been shown. However, as shown in FIG. 8, a larger number of chip-type electronic components 2 are arranged in a lattice pattern to perform the above-described implementation. After forming the resin mold 3 in the same manner as the embodiment, a method of cutting and dividing along a cutting line CL using a dicing saw, a laser processing machine, or the like may be used.

  Next, an embodiment according to the second process of the electronic component assembly of the present invention will be described. This second process is the same as the first process except that the material of the holding member 5 and the method of forming the interval between the chip-type electronic components 2 are different. Therefore, a different part from a 1st process is demonstrated here.

  The chip-type electronic components 2 aligned in the same manner as in the first process are held by the holding member 5 as shown in FIG. This holding member 5 is equivalent to that used for a dicing sheet for a semiconductor wafer. As the material, a polyolefin-based material is used. Here, for the sake of convenience, the drawing is circular, but a substantially rectangular sheet may be used. Since the holding member 5 is provided with an adhesive, the chip-type electronic component 2 is held by the holding member 5 with this adhesive.

  Subsequently, as shown in FIG. 10, the holding member 5 is stretched by applying tension. At this time, it is stretched so that tension is evenly applied. By applying the tension evenly, the distance between the chip-type electronic components 2 is made substantially the same. In this way, the holding member 5 is stretched until the distance between the chip-type electronic components 2 becomes 0.02 mm. Control of the distance between the chip-type electronic components 2 can be performed by controlling the tension. In addition, as a method of extending the holding member 5, it is preferable to use, for example, a wafer expander such as TEX-21BG manufactured by Technovision.

  Thereafter, the electronic component assembly 1 is obtained by integration with a resin mold in the same manner as in the first process. Since the holding member 5 used in the second process is in the form of a film, it is preferable to fix the holding member 5 on a rigid plate-like member when forming the resin mold.

  The electronic component assembly obtained by the process described above can realize a higher mounting density than the conventional mounting density.

It is a schematic diagram which shows the electronic component assembly formed by the manufacturing method of this invention, (a) is a side view, (b) is a bottom view. It is a schematic diagram which shows another example of the electronic component assembly formed by the manufacturing method of this invention, (a) is a side view, (b) is a bottom view. It is a schematic diagram which shows the state which mounted the electronic component assembly formed by the manufacturing method of this invention on the wiring board. It is a schematic diagram which shows the 1st manufacturing process of the electronic component assembly of this invention, (a) is a side view, (b) is a top view. It is a schematic diagram which shows the 1st manufacturing process of the electronic component assembly of this invention, (a) is a side view, (b) is a top view. It is a schematic diagram which shows the 1st manufacturing process of the electronic component assembly of this invention, (a) is a side view, (b) is a top view. It is a schematic diagram which shows the 1st manufacturing process of the electronic component assembly of this invention, (a) is a side view, (b) is a top view. It is a schematic diagram which shows another example of the 1st manufacturing process of the electronic component assembly of this invention, (a) is a side view, (b) is a top view. It is a schematic diagram which shows the 2nd manufacturing process of the electronic component aggregate | assembly of this invention. It is a schematic diagram which shows the 2nd manufacturing process of the electronic component aggregate | assembly of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1 'electronic component assembly 2 Chip-type electronic component 3 Resin mold 4 Wiring board 4a Bonding pad 5 Holding member 5a Adhesive member

Claims (5)

In the manufacturing method of an electronic component assembly in which a plurality of chip-type electronic components are integrated by a resin mold,
A step of packing a plurality of chip-type electronic components on a holding member and holding them side by side;
Extending the holding member holding the plurality of chip-type electronic components in a planar direction to form a gap between each of the plurality of chip-type electronic components;
Pouring a curable insulating resin in a state in which the holding member is stretched, covering the plurality of chip-type electronic components, and filling the gap with the insulating resin;
Removing the holding member after curing the insulating resin;
A method for producing an electronic component assembly, comprising:   2. The method of manufacturing an electronic component assembly according to claim 1, wherein the means for extending the holding member in a planar direction is to heat and heat-expand the holding member.   2. The method of manufacturing an electronic component assembly according to claim 1, wherein the means for extending the holding member in a planar direction is to apply tension to the holding member and extend the holding member. In an electronic component assembly in which a plurality of chip-type electronic components are integrated by a resin mold,
A step of packing a plurality of chip-type electronic components on a holding member and holding them side by side;
Extending the holding member holding the plurality of chip-type electronic components in a planar direction to form a gap between each of the plurality of chip-type electronic components;
Pouring a curable insulating resin in a state in which the holding member is stretched, covering the plurality of chip-type electronic components, and filling the gap with the insulating resin;
Removing the holding member after curing the insulating resin;
An electronic component assembly characterized by being formed through a process. The electronic component assembly according to claim 4, wherein the plurality of chip-type electronic components include different shapes.

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