JP2009110825A - 液晶表示装置 - Google Patents
液晶表示装置 Download PDFInfo
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- JP2009110825A JP2009110825A JP2007282624A JP2007282624A JP2009110825A JP 2009110825 A JP2009110825 A JP 2009110825A JP 2007282624 A JP2007282624 A JP 2007282624A JP 2007282624 A JP2007282624 A JP 2007282624A JP 2009110825 A JP2009110825 A JP 2009110825A
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- light
- guide plate
- liquid crystal
- light guide
- display device
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 61
- 239000000463 material Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 16
- 238000005452 bending Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000000191 radiation effect Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 25
- 229920005989 resin Polymers 0.000 description 25
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000005286 illumination Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
【解決手段】 発光ダイオードを柔軟な基板上に配置し配線基板を形成する、配線基板は導光板入光面よりも面積大に形成され、導光板入光面に対向するように配置する。導光板と配線基板を収納ケース内部に収納し、配線基板にスリットを設け折り曲げ可能として、配線基板を収納ケースに折り曲げて収納する。配線基板は折り曲げて収納されることで収納ケースとの接触面積が増加し、放熱効果が増大する。
【選択図】 図4
Description
Claims (12)
- 表示パネルと、該表示パネルに光を照射するバックライトと、
上記バックライトに設けられた複数の発光素子と、
上記発光素子が配置される回路基板と、
上記発光素子の光が入射する導光板と、
上記導光板を収納する収納ケースとを有し、
上記回路基板の上記発光素子が搭載された面は上記導光板の入射面に対向するように設けられ、
上記回路基板の幅は上記導光板の入射面の厚さよりも大きく、
上記回路基板は折り曲げられて収納され、
上記回路基板には折り曲げ可能なようにスリットが設けられていることを特徴とする液晶表示装置。 - 上記発光素子はLEDであることを特徴とする請求項1に記載の液晶表示装置。
- 上記回路基板は高反射率な表面を有することを特徴とする請求項1に記載の液晶表示装置。
- 上記収納ケースは金属からなり、
上記回路基板は収納ケースに接触していることを特徴とする請求項1に記載の液晶表示装置。 - 液晶パネルと、該液晶パネルに光を照射する面状光源装置と、
該面状光源装置内で線状に配置された発光ダイオードと、
該発光ダイオードを電気的に接続する回路基板と、
上記発光ダイオードの光が入射する入射面を有する導光板と、
上記導光板を収納する収納部とを有し、
上記回路基板は上記導光板の入射面に対向するよう配置され、回路基板の幅は上記導光板の入射面の厚さよりも大きく、
上記収納部は上記導光板の入射面に沿うように形成された側壁を有し、
上記回路基板は折り曲げられて、上記側壁の表面と裏面とに接触していることを特徴とする液晶表示装置。 - 上記回路基板には折り曲げ可能なようにスリットが設けられていることを特徴とする請求項5に記載の液晶表示装置。
- 上記回路基板は高反射率な表面を有することを特徴とする請求項5に記載の液晶表示装置。
- 上記スリットは上記収納部の側壁の端部に位置することを特徴とする請求項5に記載の液晶表示装置。
- 液晶パネルと、該液晶パネルに光を照射するバックライトとを有する液晶表示装置であって、
上記バックライトは、導光板と、上記導光板の一辺に沿って形成された板状光源部とを有し、
上記板状光源部は発光ダイオードを搭載した光出射面と上記発光ダイオードに電気的に接続した配線部とを有し、
上記板状光源部の幅は上記導光板の厚さより厚く、
上記導光板の下には反射シートが形成され、
上記板状光源部は折り曲げられて、
上記反射シートが形成する面の上側に上記発光ダイオードが位置し、下側には上記配線部が設けられたことを特徴とする液晶表示装置。 - 上記発光ダイオードは線状に配置されたことを特徴とする請求項9に記載の液晶表示装置。
- 上記導光板は収納ケースに収納され、収納ケースと導光板との間にクッション材を有することを特徴とする請求項9に記載の液晶表示装置。
- 上記板状光源部は折り曲げ可能なようにスリットが設けられることを特徴とする請求項9に記載の液晶表示装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007282624A JP4959506B2 (ja) | 2007-10-31 | 2007-10-31 | 液晶表示装置 |
US12/255,115 US8269911B2 (en) | 2007-10-31 | 2008-10-21 | Liquid crystal display device |
CN200810173902XA CN101424824B (zh) | 2007-10-31 | 2008-10-30 | 液晶显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007282624A JP4959506B2 (ja) | 2007-10-31 | 2007-10-31 | 液晶表示装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009110825A true JP2009110825A (ja) | 2009-05-21 |
JP2009110825A5 JP2009110825A5 (ja) | 2010-11-04 |
JP4959506B2 JP4959506B2 (ja) | 2012-06-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007282624A Active JP4959506B2 (ja) | 2007-10-31 | 2007-10-31 | 液晶表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8269911B2 (ja) |
JP (1) | JP4959506B2 (ja) |
CN (1) | CN101424824B (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011046341A3 (en) * | 2009-10-14 | 2011-09-09 | Lg Innotek Co., Ltd. | Heat radiating printed circuit board and chassis assembly having the same |
JP2012015000A (ja) * | 2010-07-02 | 2012-01-19 | Hitachi Displays Ltd | バックライト装置及び液晶表示装置 |
JP2012079418A (ja) * | 2010-09-30 | 2012-04-19 | Casio Computer Co Ltd | 光源装置、液晶表示装置及びフレキシブルプリント基板 |
CN102444838A (zh) * | 2010-10-13 | 2012-05-09 | 乐金显示有限公司 | Led组件及包括该led组件的液晶显示设备 |
JP2012164627A (ja) * | 2011-01-19 | 2012-08-30 | Mitsubishi Electric Corp | 面状光源装置および表示装置 |
JP2012203997A (ja) * | 2011-03-23 | 2012-10-22 | Sony Corp | 照明装置および表示装置 |
JP2013518308A (ja) * | 2010-01-29 | 2013-05-20 | ネーデルランゼ オルハニサティー フォール トゥーヘパスト−ナトゥールウェテンスハッペァイク オンデルゾーク テーエンオー | 集合体、集合体用コンポーネントおよび集合体製造方法 |
WO2013073458A1 (ja) * | 2011-11-18 | 2013-05-23 | シャープ株式会社 | 照明装置、表示装置及びテレビ受信装置 |
JP2013243042A (ja) * | 2012-05-21 | 2013-12-05 | Rohm Co Ltd | 光源装置、照明装置および表示装置 |
KR20140092125A (ko) * | 2013-01-15 | 2014-07-23 | 엘지이노텍 주식회사 | 회로기판, 상기 회로기판을 포함하는 조명장치 및 평판 디스플레이 |
JP2016146304A (ja) * | 2015-02-09 | 2016-08-12 | ミネベア株式会社 | 面状照明装置 |
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TWI402571B (zh) * | 2009-04-22 | 2013-07-21 | Advanced Optoelectronic Tech | 具有光線補色區域之背光模組 |
KR101055023B1 (ko) * | 2010-01-15 | 2011-08-05 | 엘지이노텍 주식회사 | 백라이트 유닛 및 이를 이용한 디스플레이 장치 |
JP5081933B2 (ja) * | 2010-01-25 | 2012-11-28 | 株式会社ジャパンディスプレイイースト | 液晶表示装置及び照明装置 |
KR20120012150A (ko) * | 2010-07-30 | 2012-02-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
TWI425279B (zh) * | 2010-08-31 | 2014-02-01 | Au Optronics Corp | 發光組件、背光模組以及液晶顯示裝置 |
CN101949498B (zh) * | 2010-09-07 | 2013-09-18 | 友达光电股份有限公司 | 发光元件、背光模块以及液晶显示装置 |
JP5518149B2 (ja) * | 2012-08-27 | 2014-06-11 | ヤマハモーターエレクトロニクス株式会社 | 液晶表示装置 |
CN102865528A (zh) * | 2012-10-18 | 2013-01-09 | 深圳市华星光电技术有限公司 | 一种背光模组及液晶显示装置 |
KR20140094914A (ko) * | 2013-01-23 | 2014-07-31 | 삼성디스플레이 주식회사 | 백라이트 어셈블리를 갖는 표시 장치 |
TWI566375B (zh) * | 2014-09-23 | 2017-01-11 | 錼創科技股份有限公司 | 發光模組 |
US10408993B2 (en) * | 2015-08-31 | 2019-09-10 | Sharp Kabushiki Kaisha | Light source unit, lighting device, and display device |
KR102385930B1 (ko) * | 2015-12-07 | 2022-04-12 | 엘지디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 디스플레이 장치 |
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KR20140092125A (ko) * | 2013-01-15 | 2014-07-23 | 엘지이노텍 주식회사 | 회로기판, 상기 회로기판을 포함하는 조명장치 및 평판 디스플레이 |
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JP2016146304A (ja) * | 2015-02-09 | 2016-08-12 | ミネベア株式会社 | 面状照明装置 |
US10078176B2 (en) | 2015-02-09 | 2018-09-18 | Minebea Co., Ltd. | Planar illumination device |
Also Published As
Publication number | Publication date |
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US8269911B2 (en) | 2012-09-18 |
JP4959506B2 (ja) | 2012-06-27 |
CN101424824B (zh) | 2011-07-13 |
US20090109368A1 (en) | 2009-04-30 |
CN101424824A (zh) | 2009-05-06 |
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