JP2009105366A5 - - Google Patents

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Publication number
JP2009105366A5
JP2009105366A5 JP2008097648A JP2008097648A JP2009105366A5 JP 2009105366 A5 JP2009105366 A5 JP 2009105366A5 JP 2008097648 A JP2008097648 A JP 2008097648A JP 2008097648 A JP2008097648 A JP 2008097648A JP 2009105366 A5 JP2009105366 A5 JP 2009105366A5
Authority
JP
Japan
Prior art keywords
semiconductor device
tape carrier
metal layer
resin layer
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008097648A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009105366A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008097648A priority Critical patent/JP2009105366A/ja
Priority claimed from JP2008097648A external-priority patent/JP2009105366A/ja
Priority to US12/211,364 priority patent/US20090091021A1/en
Publication of JP2009105366A publication Critical patent/JP2009105366A/ja
Publication of JP2009105366A5 publication Critical patent/JP2009105366A5/ja
Withdrawn legal-status Critical Current

Links

JP2008097648A 2007-10-03 2008-04-04 半導体装置及び半導体装置の製造方法ならびに半導体装置の実装体 Withdrawn JP2009105366A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008097648A JP2009105366A (ja) 2007-10-03 2008-04-04 半導体装置及び半導体装置の製造方法ならびに半導体装置の実装体
US12/211,364 US20090091021A1 (en) 2007-10-03 2008-09-16 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007259296 2007-10-03
JP2008097648A JP2009105366A (ja) 2007-10-03 2008-04-04 半導体装置及び半導体装置の製造方法ならびに半導体装置の実装体

Publications (2)

Publication Number Publication Date
JP2009105366A JP2009105366A (ja) 2009-05-14
JP2009105366A5 true JP2009105366A5 (ko) 2011-04-14

Family

ID=40538210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008097648A Withdrawn JP2009105366A (ja) 2007-10-03 2008-04-04 半導体装置及び半導体装置の製造方法ならびに半導体装置の実装体

Country Status (2)

Country Link
JP (1) JP2009105366A (ko)
CN (1) CN101404267A (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8508056B2 (en) * 2009-06-16 2013-08-13 Dongbu Hitek Co., Ltd. Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same
TWI485825B (zh) * 2009-07-28 2015-05-21 Xintec Inc 晶片封裝體及其形成方法
US8535989B2 (en) 2010-04-02 2013-09-17 Intel Corporation Embedded semiconductive chips in reconstituted wafers, and systems containing same
JP5799541B2 (ja) 2011-03-25 2015-10-28 株式会社ソシオネクスト 半導体装置及びその製造方法
US8848380B2 (en) * 2011-06-30 2014-09-30 Intel Corporation Bumpless build-up layer package warpage reduction
US9257368B2 (en) 2012-05-14 2016-02-09 Intel Corporation Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias
CN103594434B (zh) * 2013-10-23 2017-12-29 广东明路电力电子有限公司 带复合散热层的功率部件
KR101630769B1 (ko) 2014-06-24 2016-06-16 매그나칩 반도체 유한회사 방열 반도체 칩 패키지 및 그 제조 방법
TWI697079B (zh) * 2019-03-06 2020-06-21 南茂科技股份有限公司 薄膜覆晶封裝結構
CN113327899A (zh) * 2021-04-22 2021-08-31 成都芯源系统有限公司 倒装芯片封装单元及封装方法

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