JP2009081311A - Apparatus and method of mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus not allowing an anisotropic conductive material to be solved and cured before final compression bonding of TCP to a liquid crystal cell. <P>SOLUTION: The TCP mounting apparatus finally compression-bonds TCP6, which has been tentatively compression-bonded with the anisotropic conductive material of thermosetting resin, to a side part of the liquid crystal cell 4. This TCP mounting apparatus includes a transfer table 47 for transfer by holding the liquid crystal cell at the upper surface and projecting the side part to which TCP is tentatively compression-bonded to the external side, a backup tool 19 for supporting the lower surface of the tentatively compression-bonded side par with TCP of the liquid crystal cell located for transfer with the transfer table that is provided to be driven in the vertical direction, and a pressurizing tool 16 for supporting, with its backup tool, the lower surface of the part that is driven in the falling direction synchronously with drive in the upward direction of the backup tool and is allowing tentative compression-bonding of TCP of the liquid crystal cell and also for finally compression-bonding TCP by giving pressure thereto. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for subjecting an electronic component temporarily bonded to a side portion of a substrate to main compression bonding.

  For example, a TCP (Tape Carrier Package), which is an electronic component, is pressure-bonded to a liquid crystal cell as a substrate through an anisotropic conductive member in which metal particles are mixed in a thermosetting resin as an adhesive material. The liquid crystal cell is configured by adhering two glass plates at a predetermined interval with a sealing agent, encapsulating liquid crystal between these glass plates, and attaching a polarizing plate to the outer surface of each glass plate. In the liquid crystal cell having the above configuration, the anisotropic conductive member is attached to the upper surface of the side portion, and the TCP is temporarily pressure-bonded onto the anisotropic conductive member, and then the liquid crystal cell is finally pressure-bonded. .

  When TCP is pressure-bonded to the upper surface of the side portion of the liquid crystal cell, first, the liquid crystal cell having TCP temporarily bonded to one side is supplied and placed on the transport table. Next, when the liquid crystal cell is transported by the transport table and the one side portion on which the TCP is temporarily crimped is positioned and placed on the backup tool, the pressure tool disposed above the backup tool is lowered, and the TCP Is pressurized.

  The backup tool and the pressure tool are provided with a heater. Accordingly, if one side of the liquid crystal cell is positioned on the backup tool and pressed by the pressure tool, the anisotropic conductive member attached to the one side of the liquid crystal cell is heated while being pressed. Therefore, the anisotropic conductive member is cured after being melted.

Thereby, the TCP is connected and fixed to one side of the liquid crystal cell. That is, the TCP is finally bonded to the liquid crystal cell. Such prior art is disclosed in Patent Document 1.
JP 2005-116883 A

  By the way, when TCP is finally pressure-bonded to the liquid crystal cell in this way, first, one side portion of the liquid crystal cell in which the TCP is temporarily pressure-bonded by the anisotropic conductive member is placed on the backup tool. Next, the temporarily pressure-bonded TCP is pressed by a pressing tool.

  For this reason, when the backup tool is heated to a high temperature by the heater, the anisotropic conductive member is partially cured under the influence of heat from the backup tool before the TCP is pressurized by the pressure tool. It will be done.

  If the anisotropic conductive member is cured before being pressed by the pressure tool, the anisotropic conductive member is limited when the anisotropic conductive member is melted and deformed when the TCP is pressed by the pressure tool. In some cases, electrical connection between the lead of the TCP and the lead of the liquid crystal cell is not reliably performed by the metal particles mixed in the liquid crystal.

  Therefore, conventionally, the heating temperature of the backup tool is sufficiently lower than the heating temperature of the pressure tool, and the anisotropic conductive member provided on one side of the liquid crystal cell placed on the backup tool is a pressure tool. Therefore, it is prevented from being hardened before the main pressure bonding. For example, the heating temperature of the pressure tool is set to about 500 ° C., and the heating temperature of the backup tool is set to about 100 ° C.

  However, recently, in order to improve productivity, an anisotropic conductive member that melts and cures at a relatively low heating temperature has been used so that the anisotropic conductive member is melt-cured at the time of main compression bonding in a short time. It is getting to be.

  Therefore, even if the heating temperature of the backup tool is set to a temperature sufficiently lower than that of the pressurizing tool, the anisotropic conductive member is melted and cured before the main press bonding is started. Lead connection failure.

  It is also conceivable that the heating temperature of the backup tool is sufficiently lowered to a temperature at which the anisotropic conductive member does not melt and harden, and the anisotropic conductive member is prevented from being melted and hardened before the main pressure bonding is started. However, if the heating temperature of the backup tool is too low, it takes too much time for the anisotropic conductive member to melt and harden at the time of the main pressure bonding, and thus the productivity is lowered.

  The present invention provides a mounting apparatus and a mounting method for an electronic component that can improve productivity without melting and curing the anisotropic conductive member with the heat of the backup tool before the main pressing. is there.

The present invention is an electronic component mounting apparatus that performs final pressure bonding of an electronic component temporarily bonded to a side portion of a substrate by an anisotropic conductive member of a thermosetting resin,
A transport table that holds and transports the substrate on the upper surface by protruding the side part on which the electronic component is temporarily crimped; and
A backup tool that supports the lower surface of the side portion on which the electronic component of the substrate, which is provided so as to be drivable in the vertical direction and is transported and positioned by the transport table, is temporarily bonded;
The backup tool supports the lower surface of the portion of the substrate where the electronic component is temporarily pressed in synchronization with the upward drive of the backup tool, and simultaneously presses the electronic component to perform main press bonding. An electronic component mounting apparatus comprising: a pressure tool.

  When the substrate is positioned by the transport table, the side portion of the substrate on which the electronic component is temporarily crimped is horizontal so that the lower side of the side portion is supported by the backup tool. It is preferable that a support member for supporting the lower surface of the inner portion is provided.

  The transfer table can be driven in the vertical direction, and the substrate is driven in the descending direction from the raised position, and the inner portion of the side portion of the substrate on which the electronic component is temporarily crimped is attached to the support member. It is preferably supported by the upper end surface.

The present invention is a mounting method of an electronic component in which an electronic component temporarily bonded to a side portion of a substrate by a thermosetting anisotropic conductive member is finally bonded with a backup tool and a pressure tool,
Positioning the side part between the backup tool and the pressurizing tool that transports the substrate and the electronic component is temporarily crimped;
The backup tool is raised and the pressure tool is lowered in synchronization, and the lower surface of the side part of the substrate on which the electronic component is temporarily bonded is supported by the backup tool, and at the same time, the electronic component on the side part is temporarily attached. There is provided a method for mounting an electronic component, comprising the step of pressing the upper surface of the crimped portion with the pressing tool.

  It is preferable to have a step of horizontally supporting the side portion of the substrate when the side portion of the substrate is positioned between the backup tool and the pressure tool.

  According to this invention, the rising of the backup tool and the lowering of the pressurizing tool are synchronized, and the support of the lower surface of the side portion of the substrate by the backup tool and the pressurization of the electronic component by the pressurizing tool are performed simultaneously. .

  For this reason, since the anisotropic conductive member is not heated by the backup tool before the main press bonding is started, the connection of the electronic components is ensured and the anisotropic conductive member having a low melt curing temperature is used. Productivity can be improved.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a schematic configuration of the mounting apparatus. In this mounting apparatus, a plurality of TCPs 6 as electronic components temporarily bonded by a tape-like anisotropic conductive member 5 as an adhesive material are provided on the periphery of a glass liquid crystal cell 4 as a substrate shown in FIG. It is designed to be crimped.

  As shown in FIG. 1, the mounting apparatus positions the pressure bonding unit 11 and the liquid crystal cell 4 as pressing means in a horizontal direction (X, Y direction), a rotation direction (θ direction), and a vertical direction (Z direction). A unit 12 is provided. The crimping unit 11 has a pedestal 13, and an upper cylinder 15 is provided on the support portion 14 provided at the upper end of the pedestal 13 with the shaft edge vertical. A pressure tool 16 is provided on the rod 15 a of the upper cylinder 15. Thereby, the pressurizing tool 16 can be driven in the vertical direction.

The pressurizing tool 16 is provided with a first heater 16a. The first heater 16a heats the pressurizing tool 16 to, for example, 500 ° C.
A base member 17 is provided below the pressure tool 16. A lower cylinder 18 is provided on the upper end surface of the base member 17 with the axis line vertical. A backup tool 19 is provided on the rod 18 a of the lower cylinder 18. Thereby, the backup tool 19 can be driven in the vertical direction.

  The backup tool 19 is provided with a second heater 19a. The second heater 19a heats the backup tool 19 to 100 ° C., for example.

  A support member 20 is erected on the base member 17 closer to the positioning unit 12 than the backup tool 19. The height of the support member 20 is set to be higher than the upper end surface of the backup tool 19 whose upper end surface is in the lowered position.

  Then, as will be described later, when the lower surface of the side portion to which the TCP 6 of the liquid crystal cell 4 is temporarily bonded is supported by the upper end surface of the support member 20 at the time of the final press bonding, the liquid crystal is liquid crystal from the lower end surface of the pressing tool 16 at the rising limit. The distance to the upper surface of the cell 4 is the same as the distance from the upper end surface of the backup tool 19 at the lower limit to the lower surface of the liquid crystal cell 4.

  The upper cylinder 15 and the lower cylinder 18 are supplied with compressed air via a first control valve 21 and a second control valve 22, respectively, as shown in FIG. The control valves 21 and 22 are controlled to be opened and closed by a control device 23. As a result, the rods 18a and 15a of the cylinders 15 and 18 are driven forward and backward.

  In this embodiment, the driving of the first control valve 21 and the second control valve 22 is controlled by the control device 23 in synchronization. As a result, the pressing tool 16 is lowered and the backup tool 19 is raised simultaneously.

  Note that the pressure tool 16 and the backup tool 19 are set to lengths that can simultaneously simultaneously press-bond a plurality of TCPs 6 temporarily bonded to the side portions of the liquid crystal cell 4 by the anisotropic conductive member 5. The support member 20 is also set to a length that can support the entire length of the side portion of the liquid crystal cell 4.

  The positioning unit 12 is disposed on the side of the crimping unit 11. The positioning unit 12 has an X table 28, and an X movable body 30 that is driven in the X direction by an X drive source 29 is provided on the X table 28. In addition, let the direction parallel to the said crimping | compression-bonding unit 11 be an X direction.

  A Y table 31 is integrally provided on the upper surface of the X movable body 30. A Y movable body 32 is provided on the upper surface of the Y table 31. The Y movable body 32 is driven along a Y direction indicated by an arrow by a Y drive source 33 provided at one end of the Y table 31.

  The Y movable body 32 is provided with a support body 35 having a crank-shaped side surface. Between the support portion 36 provided at the upper end of the support 35 and the Y movable body 32, a screw shaft 37 and a guide shaft 38 are provided with their axes perpendicular to each other. The screw shaft 37 is rotatably provided, and the guide shaft 38 is fixedly provided.

  A Z movable body 39 is screwed onto the screw shaft 37, and the guide shaft 38 is slidably inserted into the Z movable body 39. Therefore, if the screw shaft 37 is rotated, the Z movable body 39 moves up and down along the guide shaft 38 without rotating.

  The upper end portion of the screw shaft 37 protrudes from the upper surface of the support portion 36, and a driven gear 40 is fitted to the protruding end. A driving gear 41 is engaged with the driven gear 40. The drive gear 41 is fitted on a drive shaft 42 a of a Z drive source 42 provided on the support 35. Accordingly, when the Z drive source 42 is actuated and the drive shaft 42a rotates, the screw shaft 37 is rotated via the pair of meshed gears 40 and 41, so that the Z movable body 39 is in the Z direction indicated by the arrow. Will be driven.

  One side of an L-shaped attachment member 44 is fixed to the Z movable body 39. A θ movable body 46 that is rotationally driven about a vertical axis by a θ drive source 45 is provided on the upper surface of the other side that is horizontal to the mounting member 44.

  A transport table 47 having a rectangular planar shape is provided on the upper surface of the θ movable body 46. The transfer table 47 can hold the liquid crystal cell 4 by, for example, vacuum suction.

  In the liquid crystal cell 4 held by suction on the transport table 47, the side part to which the TCP 6 is temporarily press-bonded protrudes outward from the side edge along the Y direction of the transport table 47.

  As shown in FIG. 1, a height sensor 48 made of a laser sensor or the like is provided on the upper surface of the Y table 31. The height sensor 48 detects the height of the lower surface of the liquid crystal cell 4 adsorbed and supported by the transport table 47, that is, the height of the lower surface of the side portion to which the TCP 6 is temporarily bonded.

  An imaging camera 49 that images the liquid crystal cell 4 held by suction on the transport table 47 is disposed above the transport table 47. As shown in FIG. 2, the detection signal of the height sensor 48 and the imaging signal of the imaging camera 49 are input to the control device 23.

  As shown in FIG. 2, the control device 23 performs image processing on the imaging signal from the imaging camera 49 to calculate the position in the X, Y, and θ directions of the liquid crystal cell 4 sucked and held on the transport table 47, Based on the calculation, the X drive source 29, the Y drive source 33, and the θ drive source 45 are driven, and the side part to which the TCP 6 of the liquid crystal cell 4 is temporarily press-bonded is used as the pressing tool 16 and the backup tool 19. Positioning so that it is parallel.

  Further, the control device 23 detects the detection signal from the height sensor 48 such that the lower surface of the one side portion of the liquid crystal cell 4 is supported by the upper end surface of the support member 20 as indicated by a chain line in FIG. The Z drive source 42 is driven so that the transport table 47 is positioned in the downward direction.

Next, a procedure for permanently press-bonding the TCP 6 to the upper surface of one side of the liquid crystal cell 4 by the mounting apparatus having the above configuration will be described with reference to FIGS.
First, the liquid crystal cell 4 in which a plurality of TCPs 6 are temporarily press-bonded to the upper surface of the side portion by the anisotropic conductive member 5 is supplied to the transport table 47 by a delivery mechanism (not shown). The liquid crystal cell 4 supplied to the transport table 47 and sucked and held is positioned in the X, Y, Z, and θ directions based on the detection signal of the height sensor 48 and the imaging signal of the imaging camera 49.

  That is, as shown in FIG. 3A, the liquid crystal cell 4 is positioned in the X, Y, and θ directions so that the side portion to which the TCP 6 is temporarily bonded is opposed to the upper side of the backup tool 19, and then the descending direction. Is driven downward in the Z direction so that the inner part of the lower side of the side edge portion of the TCP 6 is temporarily supported by the upper end surface of the support member 20. Thereby, the side part of the liquid crystal cell 4 is supported horizontally without bending downward.

  When the side part of the liquid crystal cell 4 is supported by the support member 20, the distance L1 from the lower surface of the pressure tool 16 at the upper limit to the upper surface of the liquid crystal cell 4 and the liquid crystal from the upper surface of the backup tool 19 at the lower limit. The upper limit of the pressing tool 16 and the lower limit of the backup tool 19 are set with respect to the height of the upper end surface of the support member 20 so that the distance L2 to the lower surface of the cell 4 is the same. Yes.

  When the liquid crystal cell 4 is positioned with respect to the support member 20, the upper cylinder 15 and the lower cylinder 18 are driven in synchronization by the control device 23. 3B, the pressure tool 16 is lowered, the backup tool 19 is raised, and the lower surface of the side part to which the TCP 6 of the liquid crystal cell 4 is temporarily bonded is supported by the backup tool 19. At the same time, the upper surface is pressed by the pressing tool 16.

  When the pressurizing tool 16 and the backup tool 19 are driven, the anisotropic conductive member 5 in which the TCP 6 is temporarily press-bonded to the liquid crystal cell 4 is transferred to the first heater 16 a provided in the pressurizing tool 16 and the backup tool 19. The second heater 19a provided is pressurized while being heated. Thereby, the anisotropic conductive member 5 is melt-cured and the TCP 6 is finally pressure-bonded.

  As described above, when the TCP 6 is finally pressure-bonded, the upper surface and the lower surface of the side portion to which the TCP 6 of the liquid crystal cell 4 is temporarily pressure-bonded are pressurized and heated simultaneously by the pressure tool 16 and the backup tool 19. The anisotropic conductive member 5 temporarily bonded to the liquid crystal cell 4 is heated by the second heater 19 a provided in the backup tool 19 and partially melted and cured before being pressurized and heated by the pressure tool 19. Can be prevented.

  Therefore, since the anisotropic conductive member 5 is melted and cured simultaneously by both the pressure tool 16 and the backup tool 19 at the time of the main pressure bonding, the electrical connection between the liquid crystal cell 4 and the lead of the TCP 6 is surely performed. be able to.

  Moreover, since the anisotropic conductive member 5 is not previously heated by the backup tool 19, the anisotropic conductive member 5 that is melt-cured at a low temperature can be used. As a result, the anisotropic conductive member 5 can be melt-cured in a short time at the time of the main press-bonding, so that the tact time required for the main press-bonding can be shortened and the productivity can be improved.

  Before the pressure bonding tool 16 and the backup tool 19 are used for final pressure bonding of the side portion of the liquid crystal cell 4, the lower surface of the inner portion of the side portion of the liquid crystal cell 4 where the TCP 6 is temporarily bonded is supported by the support member 20. To support.

  As a result, the side portion of the liquid crystal cell 4 is supported horizontally without being bent downward by the support member 20, so that the TCP 6 temporarily press-bonded to the side portion of the liquid crystal cell 4 can be precisely aligned without causing displacement. Can be permanently bonded to

  When the lower surface of the side portion of the liquid crystal cell 4 is supported on the upper surface of the support member 20, the transport table 47 is lowered from above in the Z direction. Therefore, even if the side portion of the liquid crystal cell 4 is bent downward before being supported by the support member 20, the side portion can be reliably supported on the upper surface of the support member 20.

  Further, if the pressure tool 16 and the backup tool 19 have the same mass, when the main pressure bonding of the liquid crystal cell 4 is simultaneously performed by the pressure tool 16 and the backup tool 19, the liquid crystal cell 4 and the TCP 6 can be moved vertically. The applied load can be made substantially the same. As a result, the liquid crystal cell 4 is prevented from warping during the main press bonding, and the accuracy of the main press bonding can be improved.

  In the above embodiment, the height sensor detects the height of the lower surface of one side of the liquid crystal cell supported on the transfer table, and based on the detection, the lower surface of the one side of the liquid crystal cell is positioned on the upper surface of the support member. Driven downward in the Z direction to be supported, but the height of the upper surface of the support member is known, so if the height when the transport table receives the liquid crystal cell is known in advance, the height sensor Even if not, the transport table can be driven downward in the Z direction so that the side portion of the liquid crystal cell is supported by the upper surface of the support member.

  When the liquid crystal cell is enlarged and the pressure tool and the backup tool are long, the pressure tool and the backup tool may be driven up and down by a plurality of cylinders.

  The means for driving the pressure tool and the backup tool up and down is not limited to the cylinder, and the screw shaft may be rotationally driven by a servo motor and moved up and down by the rotation of the screw shaft. The means is limited. Not a thing.

BRIEF DESCRIPTION OF THE DRAWINGS Schematic of the whole structure of the mounting apparatus which shows one embodiment of this invention. The block diagram of a control system. (A) is a figure when one side part of a liquid crystal cell is supported by a support member, and (b) is a figure when a liquid crystal cell is supported by a support member and then TCP is temporarily pressure-bonded to the liquid crystal cell. The top view of a liquid crystal cell.

Explanation of symbols

  4 ... Liquid crystal cell (substrate), 5 ... Anisotropic conductive member, 6 ... TCP (component), 11 ... Crimp unit, 12 ... Positioning unit, 15 ... Upper cylinder, 16 ... Pressure tool, 18 ... Lower cylinder, 19 ... backup tool, 23 ... control device, 47 ... transfer table.

Claims (5)

An electronic component mounting apparatus that performs final pressure bonding of an electronic component temporarily bonded by an anisotropic conductive member of a thermosetting resin to a side portion of a substrate,
A transport table that holds and transports the substrate on the upper surface by protruding the side part on which the electronic component is temporarily crimped; and
A backup tool that supports the lower surface of the side portion on which the electronic component of the substrate, which is provided so as to be drivable in the vertical direction and is transported and positioned by the transport table, is temporarily bonded;
The backup tool supports the lower surface of the portion of the substrate where the electronic component is temporarily pressed in synchronization with the upward drive of the backup tool, and simultaneously presses the electronic component to perform main press bonding. An electronic component mounting apparatus comprising: a pressure tool.   When the substrate is positioned by the transport table, the side portion of the substrate on which the electronic component is temporarily crimped is horizontal so that the lower side of the side portion is supported by the backup tool. The electronic component mounting apparatus according to claim 1, further comprising a support member that supports a lower surface of the inner portion.   The transfer table can be driven in the vertical direction, and the substrate is driven in the descending direction from the raised position, and the inner portion of the side portion of the substrate on which the electronic component is temporarily crimped is attached to the support member. 3. The electronic component mounting apparatus according to claim 2, wherein the electronic component mounting apparatus is supported by an upper end surface. An electronic component mounting method in which an electronic component temporarily bonded by a thermosetting anisotropic conductive member to a side portion of a substrate is subjected to main compression bonding with a backup tool and a pressure tool,
Positioning the side part between the backup tool and the pressurizing tool that transports the substrate and the electronic component is temporarily crimped;
The backup tool is raised and the pressure tool is lowered in synchronization, and the lower surface of the side part of the substrate on which the electronic component is temporarily bonded is supported by the backup tool, and at the same time, the electronic component on the side part is temporarily attached. And a step of pressing the upper surface of the crimped portion with the pressing tool.   6. The electronic component according to claim 5, further comprising a step of horizontally supporting the side portion of the substrate when the side portion of the substrate is positioned between the backup tool and the pressure tool. Implementation method.

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