JP2009066468A - Liquid-drop discharging device, method for manufacturing electro-optical device, and electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple-structure liquid-drop discharging device which can float a workpiece above a setting table without damaging and deforming the workpiece. <P>SOLUTION: This device is provided with an ink-jet-type functional liquid-drop discharge head 17 for drawing on the workpiece W by discharging functional liquid-drops, the setting table 21 setting the workpiece W for lithographic processing, and a workpiece floating means assembled in the setting table 21 and floating the workpiece W by blowing a releasing gas released from the surface of the setting table 21 against the workpiece W. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a droplet discharge device that performs drawing processing by discharging functional droplets on a set work, an electro-optical device manufacturing method, and an electro-optical device.

Conventionally, as this type of liquid droplet ejection device, a device having a functional liquid droplet ejection head that performs functional drawing by ejecting functional liquid droplets onto a work and a set table (suction table) that sets the work during the graphic processing is known. (See Patent Document 1). In this case, the set table incorporates a lift-up device that lifts up the workpiece when carrying it in or out (feeding / removing material). The lift-up device has a large number of lift-up pins that appear and disappear from small holes in the set table, and lifts up the workpiece on the set table by projecting the numerous lift-up pins from the set table. .
JP 2005-66490 A

  However, in such a droplet discharge device, since the work is floated on the set table by abutting the lift-up pin, there is a problem that the work is damaged or deformed by the contact of the lift-up pin. . Further, the use of the lift-up device has a problem that the configuration of the device becomes complicated and the set table becomes thick.

  An object of the present invention is to provide a droplet discharge device, a method of manufacturing an electro-optical device, and an electro-optical device that can float the work with respect to a set table with a simple configuration without damaging or deforming the work. .

  The droplet discharge device of the present invention includes an inkjet-type functional droplet discharge head that performs drawing processing by discharging functional droplets onto a workpiece, a set table that sets a workpiece during drawing processing, and a set table. And a workpiece floating means for discharging the released gas from the surface of the set table and floating the workpiece.

  According to this configuration, as a mechanism for floating the work on the set table main body, the work can be lifted without directly contacting the work by using the work lifting means that lifts the work with the released gas. , It is possible to suppress deformation. In addition, the apparatus can have a simple configuration and the set table can be made thin.

  In this case, the workpiece floating means is connected to the plurality of porous members embedded in the set table and configured to allow gas to pass therethrough, and the downstream side is connected to the plurality of porous members, and the upstream side supplies the discharge gas. A gas flow path connected to the compressed gas supply means.

  According to this configuration, the workpiece floating means has a plurality of porous members and a gas flow path connected to the porous members, so that the discharge gas supplied from the compressed gas supply means is passed through the gas flow paths and the porous member. Released from the surface of the set table. Thereby, a workpiece floating means can be made into a simple structure.

  In this case, a vacuum channel branched from the gas channel, a vacuum suction means connected to the downstream side of the vacuum channel, and a branch part of the gas channel are provided between the gas channel and the vacuum channel. It is preferable to further comprise switching means for switching the flow path.

  According to this configuration, by switching the flow path between the gas flow path and the vacuum flow path, the floating of the work by the compressed gas supply means and the suction (adsorption) of the work by the vacuum suction means are the same porous. This can be done with a material. Therefore, the workpiece can be floated and sucked (sucked) with a simple configuration.

  In these cases, it is preferable to further include a static elimination means that is interposed in the gas flow path and ionizes the emitted gas.

  According to this configuration, the discharge gas discharged from the surface of the set table is ionized by discharging the discharge gas, and the static electricity charged on the workpiece can be discharged by the discharge gas. In particular, static electricity generated when the workpiece comes in contact with the set table can be removed efficiently.

  In these cases, the supply table is arranged adjacent to the set table and feeds the work to the set table, and the work is levitated from the surface of the supply table by releasing the released gas from the surface of the supply table. It is preferable to further include a material floating means and a material feeding means for moving the floated work from the material table to the set table.

  According to this configuration, the workpiece supported by the material floating means of the supply table can be moved by the material supplying means so as to be supported by the workpiece floating means of the set table. As described above, since the workpiece feeding can be performed in a floating state, it is not necessary to directly contact and support the workpiece when feeding the workpiece, and the workpiece can be further prevented from being damaged or deformed. . In addition, the work can be moved with an extremely small force.

  In this case, it is preferable that the surface of the supply table is disposed at a position higher than the surface of the set table.

  According to this configuration, the workpiece can be prevented from colliding with the end of the set table even when the workpiece is slightly lowered during the feeding of the material by the feeding means (movement from the feeding table to the set table). can do.

  On the other hand, it is preferable to further include chamber means for controlling the temperature of the internal atmosphere and accommodating the functional liquid droplet ejection head, the set table, and the supply table.

  According to this configuration, in addition to the functional liquid droplet ejection head and the set table for performing the drawing process, the material supply table is accommodated in the chamber means, so that the workpiece to be supplied can be brought to the ambient temperature in the chamber means during the supply. It can be in a habituated state. Therefore, it is possible to eliminate the thermal effect of the work during the drawing process.

  Also, a material removal table that is arranged adjacent to the set table and removes the workpiece from the set table, and a material removal that is incorporated in the material removal table and releases the released gas from the surface of the material removal table to lift the workpiece. It is preferable to further include a levitation means and a material removal means for moving the floated work from the set table to the material removal table.

  According to this configuration, the work that is levitated and supported by the work levitating means of the set table can be moved by the material removal means so that the work is levitated and supported by the material removal levitating means of the material removal table. As described above, since the material removal conveyance of the workpiece can be performed in a floating state, it is not necessary to directly support and support the workpiece during the material removal conveyance, and the workpiece can be further prevented from being damaged or deformed. .

  In this case, it is preferable that the surface of the material removal table is disposed at a position lower than the surface of the set table.

  According to this configuration, the workpiece collides with the end of the material removal table even when the workpiece is slightly lowered during material removal conveyance (movement from the set table to the material removal table) by the material removal means. Can be prevented.

  On the other hand, the workpiece is a transparent glass substrate, and is positioned between the set table and the material removal table, and further includes a drawing result detecting means for inspecting a drawing result drawn on the upper surface of the workpiece by the functional liquid droplet ejection head. The drawing result detecting means preferably includes an illumination that faces the workpiece from one of the upper and lower sides, and an imaging camera that faces the workpiece from the upper and lower sides and is disposed to face the illumination. The detection of the drawing result includes detection of mixed color, uneven stripes, and the like.

  According to this configuration, the drawing result detecting means is disposed between the set table and the material removal table, thereby drawing using the material removal conveyance (movement from the set table to the material removal table). Result detection can be performed. Therefore, the drawing result can be detected efficiently. In addition, since the drawing result can be detected by the transmitted light from the illumination, it is possible to detect the drawing result with high accuracy.

  A method for manufacturing an electro-optical device according to the present invention is characterized in that a film-forming unit made of functional droplets is formed on a workpiece using the above-described droplet discharge device.

  Similarly, an electro-optical device according to the present invention is characterized in that a film-forming portion made of functional droplets is formed on a workpiece using the above-described droplet discharge device.

  According to this configuration, a high-quality electro-optical device can be efficiently manufactured. In addition, as a functional material, the light emitting material (Electro-Luminescence light emitting layer / hole injection layer) of the organic EL device, the filter material (filter element) of the color filter used for the liquid crystal display device, the electron emission device (Field Emission) Display, FED) fluorescent material (phosphor), fluorescent material (phosphor) of PDP (plasma display panel) device, electrophoretic material (electrophore) of electrophoretic display device, etc. A liquid material that can be discharged by an inkjet head). Examples of the electro-optical device (Flat Panel Display, FPD) include an organic EL device, a liquid crystal display device, an electron emission device, a PDP device, and an electrophoretic display device.

  Hereinafter, a droplet discharge device to which a functional liquid supply device of the present invention is applied will be described with reference to the accompanying drawings. This droplet discharge device is incorporated in a flat panel display production line, and uses, for example, a function droplet discharge head into which a special ink or a functional liquid that is a light-emitting resin liquid is introduced, and the color of a liquid crystal display device A light emitting element or the like to be used for each pixel of a filter or an organic EL device is formed. A transparent glass substrate is used as the workpiece.

  As shown in FIGS. 1 and 2, the droplet discharge device 1 is disposed on an X-axis support base 2 supported by a stone surface plate, and extends in the X-axis direction, which is the main scanning direction. An X-axis table 11 that moves the workpiece W set on the table 21 in the X-axis direction (main scanning direction), and a pair (a pair spanned across the X-axis table 11 via a plurality of columns 4) 10 carriage units on which two Y-axis support bases 3 are mounted and mounted with a Y-axis table 12 extending in the Y-axis direction as the sub-scanning direction and a plurality of functional liquid droplet ejection heads 17 The ten carriage units 51 are suspended from the Y-axis table 12 so as to be movable. Further, the droplet discharge device 1 includes a material supply table 141, a material removal table 142, and a robot arm unit 144, and a material supply / discharge material mechanism 20 that supplies and removes the workpiece W to and from the set table 21, and these devices And a chamber (chamber means) 6 that accommodates in a temperature and humidity controlled atmosphere. After the workpiece W is supplied by the supply / discharge material mechanism 20, the functional droplet discharge head 17 is driven to discharge in synchronization with the driving of the X-axis table 11 and the Y-axis table 12. As a result, R, G, and B3 functional droplets are ejected, and a predetermined drawing pattern is drawn on the workpiece W. The drawn workpiece W is removed by the feed / release material mechanism 20.

  The droplet discharge device 1 includes a maintenance device 5 including a flushing unit 14, a suction unit 15, a wiping unit 16, and a discharge performance inspection unit 18, and these units are used for maintenance of the functional droplet discharge head 17. The function of the functional liquid droplet ejection head 17 is maintained and recovered. Of the units constituting the maintenance device 5, the flushing unit 14 and the discharge performance inspection unit 18 are mounted on the X-axis table 11, and the suction unit 15 and the wiping unit 16 extend from the X-axis table 11 at a right angle, In addition, the Y-axis table 12 is disposed on a pedestal disposed at a position where the carriage unit 51 can move (strictly speaking, the discharge performance inspection unit 18 includes a stage unit 77 which will be described later, the X-axis table 11. The camera unit 78 is supported by the Y-axis support base 3).

  The flushing unit 14 includes a pair of pre-drawing flushing units 71 and 71 and a regular flushing unit 72, and is performed immediately before ejection of the functional liquid droplet ejection head 17 or when drawing work is suspended such as when the workpiece W is replaced. Then, the functional liquid droplet ejection head 17 is subjected to the discarded ejection (flushing). The suction unit 15 includes a plurality of divided suction units 74 and forcibly sucks the functional liquid from the discharge nozzle 98 of each functional liquid droplet discharge head 17 and performs capping. The wiping unit 16 has a wiping sheet 75 and wipes the nozzle surface 97 of the functional liquid droplet ejection head 17 after suction. The ejection performance inspection unit 18 includes a stage unit 77 on which an inspection sheet 83 that receives functional droplets ejected from the functional droplet ejection head 17 is mounted, and a camera unit 78 that inspects functional droplets on the stage unit 77 by image recognition. And the ejection performance (the presence / absence of ejection and the flight curve) of the functional droplet ejection head 17 is inspected.

  Next, components of the droplet discharge device 1 will be briefly described. As shown in FIG. 1 or FIG. 2, the X-axis table 11 includes a set table 21 for setting a workpiece W, an X-axis first slider 22 for slidably supporting the set table 21 in the X-axis direction, and the flushing described above. An X-axis second slider 23 that supports the unit 14 and the stage unit 77 slidably in the X-axis direction, and extends in the X-axis direction, and the set table 21 (work W) is moved through the X-axis first slider 22 to the X A pair of left and right X-axis linear motors (not shown) that move in the axial direction and move the flushing unit 14 and the stage unit 77 in the X-axis direction via the X-axis second slider 23, and parallel to the X-axis linear motor A pair of (two) X-axis common support bases 24 for guiding the movement of the X-axis first slider 22 and the X-axis second slider 23. That.

  The set table 21 includes a suction table 31 that sucks and sets the work W, a θ table 32 that supports the suction table 31 and corrects the position of the work W set on the suction table 31 in the θ-axis direction. is doing. The pre-drawing flushing unit 71 is attached to each of a pair of sides parallel to the Y-axis direction of the set table 21.

  The Y-axis table 12 includes 10 bridge plates 52 each of which has 10 carriage units 51 suspended therein, 10 sets of Y-axis sliders (not shown) that support the 10 bridge plates 52 in both ends, A pair of Y-axis linear motors (not shown) are provided on the pair of Y-axis support bases 3 and move the bridge plate 52 in the Y-axis direction via 10 sets of Y-axis sliders. Further, the Y-axis table 12 sub-scans the functional liquid droplet ejection head 17 at the time of drawing via each carriage unit 51, and the functional liquid droplet ejection head 17 is exposed to the maintenance device 5 (the suction unit 15 and the wiping unit 16). I will.

  When the pair of Y-axis linear motors are driven (synchronously), each Y-axis slider translates in the Y-axis direction simultaneously with the pair of Y-axis support bases 3 as a guide. As a result, the bridge plate 52 moves in the Y-axis direction, and the carriage unit 51 moves in the Y-axis direction at the same time. In this case, by controlling the driving of the Y-axis linear motor, each carriage unit 51 can be moved independently and individually, or ten carriage units 51 can be moved together. It is.

  Each carriage unit 51 includes a head unit 13 including twelve functional liquid droplet ejection heads 17 and a head plate 53 that supports the twelve functional liquid droplet ejection heads 17 in two groups. (See FIG. 3). Further, each carriage unit 51 supports the head unit 13 via the θ rotation mechanism 61 that supports the head unit 13 so as to be capable of θ correction (θ rotation), and the Y axis table 12 (each bridge plate 52) via the θ rotation mechanism 61. And a suspension member 62 to be supported on.

  As shown in FIG. 4, the functional liquid droplet ejection head 17 has a so-called double structure, a functional liquid introduction part 91 having two connection needles 92, and a dual head substrate that is continuous with the functional liquid introduction part 91. 93, and a head main body 94 which is connected to the lower side of the functional liquid introducing portion 91 and has an in-head flow path filled with the functional liquid therein. The connection needle 92 is connected to a functional liquid supply system (not shown), and supplies the functional liquid to the functional liquid introduction unit 91. The head main body 94 includes a cavity 95 (piezoelectric piezoelectric element) and a nozzle plate 96 having a nozzle surface 97 in which a large number of discharge nozzles 98 are opened. When the functional liquid droplet ejection head 17 is driven to eject (a voltage is applied to the piezoelectric element), functional liquid droplets are ejected from the ejection nozzle 98 by the pump action of the cavity 95.

  In addition, two nozzle rows 98b made up of a large number of discharge nozzles 98 are formed on the nozzle surface 97 in parallel with each other. The two nozzle rows 98b are displaced from each other by a half nozzle pitch.

  The chamber 6 is composed of a prefabricated clean booth (clean room) incorporating gas conditioning equipment that keeps the internal temperature and humidity or gas concentration constant. That is, the drawing on the workpiece W by the droplet discharge device 1 is performed in an atmosphere in which the temperature and humidity are controlled to be constant values. The chamber 6 is formed with a loading door 102 that is used when the workpiece W is loaded by the robot arm unit 144 and a material removal door 101 that is used when the workpiece W is removed by the material removal table 142. ing. In the case of manufacturing an organic EL device or the like, the chamber 6 is preferably configured in an atmosphere of an inert gas (nitrogen gas).

  Here, the suction table 31 will be described in detail with reference to FIGS. 5 and 6. As shown in the figure, the adsorption table 31 includes a table main body 103 on which the work W is placed, and a gas flow path system 104 that is connected to the table main body 103 and floats or adsorbs the work W on the table main body 103. Yes.

  The table main body 103 is formed with a plurality of insertion portions 105 which are stepped and circularly recessed on the upper surface thereof. A plurality of porous members 106 are fitted into the fitting portion 105 so as to be supported by the stepped portion, and a buffer portion constituting a lower space of the fitting portion 105 is provided below the plurality of porous members 106. 105a is formed. The plurality of insertion portions 105 are formed so that the surface of the plurality of porous members 106 and the surface of the table main body 103 are flush with each other when the plurality of porous members 106 are inserted. A communication hole 107 is formed in the lower surface of the buffer portion 105a, and each communication hole 107 is connected to a common air chamber 108 formed at the other end. Further, a connection hole 110 for connecting the air chamber 108 to the outside of the table main body 103 (gas flow path system 104) is formed on the side surface of the air chamber 108.

  During the levitation process, the release gas is supplied from the gas flow path system 104, and the release gas is supplied to each porous member 106 via the connection hole 110, the air chamber 108, each communication hole 107, and each buffer portion 105a. The release gas is released from the material member 106. On the other hand, during the adsorption process, a negative suction pressure is applied from the gas flow path system 104, and is applied to the table main body 103 via the connection holes 110, the air chambers 108, the communication holes 107, the buffer portions 105 a, and the porous members 106. The set work W is vacuum-sucked.

  Further, at the end of the table body 103 on the side of the material supply table 141, a material removal kick-out that applies a self-propelling force by pushing the workpiece W that has floated for material removal toward the material removal table 142 is provided. A mechanism 109 is provided. The material removal kick-out mechanism 109 has, for example, a work contact portion made of an elastic member, a kick arm that rotates so as to protrude from the surface of the table main body 103, an air cylinder that rotates the kick arm, etc. It consists of On the other hand, at the end of the table main body 103 on the side of the material removal table 142, a material supply stopper mechanism 114 for stopping the workpiece W kicked out by a material supply kick mechanism 164 described later on the set table 21 is provided. ing. The feed material stopper mechanism 114 includes, for example, a barrier-shaped stopper body that protrudes and protrudes from the surface of the table body 103, an air cylinder that protrudes and retracts the stopper body, and the like.

  The gas flow path system 104 includes a discharge gas supply mechanism (compressed gas supply means) 111 that supplies a release gas to the table body 103, and a vacuum suction mechanism (vacuum suction means) 112 that sucks the workpiece W through the table body 103. The table main body 103 and the connection flow path 113 for connecting the discharge gas supply mechanism 111 and the vacuum suction mechanism 112 are provided. The gas flow path system 104 includes a compressed air supply facility 85 that supplies compressed air, and a gas exhaust facility 87 that performs gas exhaust from each portion.

  The connection flow path 113 is connected to the main flow path 122 connected to the connection hole 110 of the table main body 103, and the main flow path 122 via a branch part 124 that divides the main flow path 122 into two, and the other is connected to the discharge gas supply mechanism 111. And a suction side flow path 126 connected to the main flow path 122 via the branch portion 124 and connected to the vacuum suction mechanism 112 on the other side. The main flow path 122 is provided with an ionizer 127 (static elimination means) that ionizes the emitted gas, and is configured such that static electricity charged on the workpiece (and the table main body 103) is eliminated by releasing the emitted gas. Yes. In addition, a pair of switching valves 128 are provided near the main flow path 122 of the supply side flow path 125 and the suction side flow path 126. The pair of switching valves 128, 128 constitute switching means for switching the channel connection from the main channel 122 between the supply side channel 125 and the suction side channel 126. The gas flow path described in the claims is composed of a main flow path 122 and a supply-side flow path 125, and the vacuum flow path described in the claims is composed of a suction-side flow path 126.

  The discharge gas supply mechanism 111 has a flow rate adjustment valve 131 connected to the compressed air supply facility 85. The flow rate of the compressed air supplied from the compressed air supply facility 85 is adjusted by the flow rate adjusting valve 131 and supplied to the table main body 103 via the connection channel 113. That is, the discharge gas supply mechanism 111 includes a compressed air supply facility 85 and a flow rate adjustment valve 131.

  The vacuum suction mechanism 112 is disposed in an ejector 135 connected to the compressed air supply facility 85 and the gas exhaust facility 87, and a flow path between the ejector 135 and the compressed air supply facility 85, and is supplied to the ejector 135. An electropneumatic regulator 136 for adjusting the pressure of the electropneumatic regulator and a flow sensor 137 provided adjacent to the electropneumatic regulator 136 are provided. The pressure is adjusted by the electropneumatic regulator 136, and the air in the connection channel 113 is pulled toward the gas exhaust equipment 87 by the accompanying flow of the compressed air supplied to the ejector 135, and is sucked into the connection channel 113 side. Pressure is applied.

  Here, the floating processing operation and the suction processing operation of the suction table 31 will be described. When performing the levitation process, the pair of switching valves 128 and 128 switches the channel connection from the main channel 122 to the supply side channel 125 and drives the discharge gas supply mechanism 111. Strictly speaking, the flow rate adjusting valve 131 is adjusted to supply the discharge gas at a desired pressure. The supplied discharge gas is sent to the plurality of porous members 106 via the supply-side flow path 125 and the main flow path 122 and is discharged from the plurality of porous members 106. As a result, the discharged gas is blown to the lower surface of the set work W, and the work W is lifted.

  As described above, the workpiece floating means described in the claims includes the porous member 106 and the connection flow path 113 (the main flow path 122 and the supply-side flow path 125) connected to the porous member 106. As a mechanism for floating the workpiece W on the table main body 103, the workpiece W can be floated without directly contacting the workpiece W by using the workpiece floating means for floating the workpiece W by the released gas. While being able to suppress a deformation | transformation, this apparatus can be comprised simply. Further, since the workpiece floating means includes the porous member 106 and the connection flow path 113 connected thereto, the workpiece floating means can be configured simply.

  On the other hand, when performing the adsorption process, the pair of switching valves 128 and 128 switches the channel connection from the main channel 122 to the suction side channel 126 and drives the vacuum suction mechanism 112. Strictly speaking, the negative suction pressure by the ejector 135 is adjusted by adjusting the electropneumatic regulator 136. The suction negative pressure is transmitted to the set work W through the suction side flow path 126, the main flow path 122 and the porous member 106. As a result, the work W is attracted to the table main body 103.

  As described above, by switching the flow path between the supply-side flow path 125 and the suction-side flow path 126 with the pair of switching valves 128, 128, the floating of the workpiece W by the discharge gas supply mechanism 111 and the vacuum suction are performed. The suction (adsorption) of the workpiece W by the mechanism 112 can be performed by the same porous member 106. Therefore, the workpiece W can be floated and sucked (sucked) with a simple configuration. In addition, although the several porous member 106 in this embodiment is connected to the single air chamber 108, and comprises 1 system | suction / flotation system, it processes several types of workpiece | work W from which a magnitude | size differs. In this case, it is preferable to divide the table main body 103 into areas according to the type of the work W and to use a plurality of suction / levitation systems. However, when ascending, use the entire system regardless of the size of the workpiece.

  Next, the supply / discharge material mechanism 20 will be described with reference to FIGS. 5 and 6. The material supply / removal mechanism 20 is disposed adjacent to one side in the Y-axis direction (on the left side in FIG. 5) of the set table 21 located at the material supply / removal material position, and supplies the workpiece W to the set table 21. 141, a material removal table 142 disposed adjacent to the other side of the set table 21 in the Y-axis direction (on the right side in FIG. 5) at the feed / removal material position to remove the workpiece W from the set table 21, and a set A drawing result detecting device (drawing result detecting means) 143 that is arranged between the table 21 and the material removal table 142 and inspects the drawing result of the workpiece W during material removal conveyance, and the work W on the material supply table 141 from another process. And a robot arm unit 144 that carries the workpiece W out of the material removal table 142 in a separate process. That is, the workpiece W before drawing processing is carried into the material supply table 141 by the robot arm unit 144, and then the workpiece W is supplied to the set table 21 by the material supply table 141. On the other hand, the workpiece W after drawing processing is removed from the set table 21 by the material removal table 142, and then the workpiece W is carried out of the material removal table 142 by the robot arm unit 144.

  The robot arm unit 144 includes a robot arm 151 and an arm moving mechanism 154 that supports the robot arm 151 movably in the Y-axis direction. The robot arm 151 includes a holding portion 152 that holds the workpiece W by suction at the tip, and holds the workpiece W in a form of being placed by a pair of (two) holding pieces 153 and 153 formed at the tip. In this state, the workpiece W is transferred (in and out) by moving the holding unit 152 by the robot arm 151.

  The arm moving mechanism 154 is disposed so as to face the material supply table 141 and the material removal table 142, and includes a carry-in position where the work W is carried into the material supply table 141, and a carry-out where the work W is carried out to the material removal table 142. The robot arm 151 is translated between the positions. Thereby, carrying in and carrying out can be performed by the single robot arm 151. The robot arm 151 is disposed outside the chamber 6, whereas the feed table 141 is disposed in the chamber 6. Therefore, the robot arm 151 loads the workpiece W into the chamber 6 via the loading door 102 of the chamber 6 (see FIG. 1).

  The feed table 141 includes a feed table main body 161 and a feed gas supply system 162 that supplies a release gas to the feed table main body 161. The release gas supplied from the supply gas supply system 162 is released from the surface of the supply table main body 161, and the workpiece W is floated during supply. Further, at the end of the supply table main body 161 on the side of the set table 21, the supply material kick-out that applies the self-propelling force by pushing the work W floating for supply to the set table 21. A mechanism 164 is provided. The feed kick mechanism 164 has a workpiece contact portion made of, for example, an elastic member and rotates so as to protrude from the surface of the feed table main body 161, and air that rotates the kick arm. It is composed of a cylinder. The workpiece W kicked out by the feed kick mechanism 164 is stopped on the set table 21 by the feed stopper mechanism 114 of the set table 21 described above. As described above, the material supply means described in the claims includes the material supply kick mechanism 164 and the material supply stopper mechanism 114.

  The feed table main body 161 is configured such that the surface thereof is higher than the surface of the set table 21. Like the table main body 103 of the set table 21, the supply table main body 161 has a plurality of porous members 106 and a plurality of porous members 106. A plurality of insertion portions 105 for inserting a plurality of holes, a plurality of communication holes 107 connected thereto, an air chamber 108 and a connection hole 110 are formed. Further, a pair of insertion grooves 163 and 163 into which the pair of holding pieces 153 and 153 of the robot arm 151 are inserted are formed at positions excluding the plurality of insertion portions 105. The robot arm 151 descends from above the pair of insertion grooves 163, 163 with the workpiece W placed on the pair of holding pieces 153, 153, and the pair of holding pieces 153, 153 enters the pair of insertion grooves 163, 163. Thus, the workpiece W is set on the supply table main body 161. As a result, the workpiece W is delivered from the robot arm 151 to the supply table main body 161. The supply table main body 161 is disposed in the chamber 6 (see FIG. 1). Thereby, the workpiece | work W to supply can be made into the state accustomed to the atmospheric temperature in the chamber 6 in the case of supply. Therefore, the thermal effect of the workpiece W during the drawing process can be eliminated.

  The supply gas supply system 162 includes a gas supply mechanism 171 and a gas supply flow path 172 that connects the supply table main body 161 and the gas supply mechanism 171. The gas supply mechanism 171 has a gas flow rate adjustment valve 173 connected to the compressed air supply facility 85, and adjusts the gas flow rate adjustment valve 173 to supply a discharge gas (compressed air) at a constant pressure. The supplied release gas is supplied to the plurality of porous members 106 via the gas supply flow path 172, the communication hole 107 and the fitting portion 105, and the release gas is released from the plurality of porous members 106. Thereby, the set work W is levitated. As described above, the feed material floating means described in the claims includes the porous member 106 and the feed gas supply system 162.

  The material removal table 142 includes a material removal table main body 181 and a material removal gas supply system 182 that supplies a release gas to the material removal table main body 181. The release gas supplied from the material removal gas supply system 182 is released from the surface of the material removal table main body 181 to float the workpiece W during material removal. Further, at the end of the material removal table body 181 on the set table 21 side, the material removal material for stopping the workpiece W kicked by the material removal kicking mechanism 109 of the set table 21 on the material removal table 142 is provided. A stopper mechanism 184 is provided. The material removal stopper mechanism 184 includes a work piece contact portion made of, for example, an elastic member, a barrier stopper main body that protrudes and protrudes from the surface of the table main body 103, an air cylinder that protrudes and retracts the stopper main body, and the like. That is, the material removal means referred to in the claims includes the material removal kick-out mechanism 109 and the material removal stopper mechanism 184.

  The material removal table body 181 is configured such that the surface thereof is at a lower position than the surface of the set table 21. Like the table body 103 of the set table 21, the material removal table body 181 includes a plurality of porous members 106 and a plurality of porous members. A plurality of insertion portions 105 into which the member 106 is inserted, a plurality of communication holes 107 connected thereto, an air chamber 108 and a connection hole 110 are formed. Further, a pair of insertion grooves 163 and 163 into which the pair of holding pieces 153 and 153 of the robot arm 151 are inserted are formed at positions excluding the plurality of insertion portions 105. The robot arm 151 inserts the pair of holding pieces 153 and 153 into the pair of insertion grooves 163 and 163 from the side in a state where the workpiece W is set, and then lifts the holding portion 152 to raise the pair of holding pieces 153 and 153. Place work W on As a result, the workpiece W is delivered from the material removal table main body 181 to the robot arm 151. Note that the material removal levitation means described in the claims includes a porous member 106 and a material removal gas supply system 182. Moreover, since the material removal gas supply system 182 has the same configuration as the material supply gas supply system 162, the description thereof is omitted.

  The drawing result detection device 143 is disposed between the set table 21 and the material removal table 142, and is a color mixture that faces the workpiece W to be removed (conveyed from the set table 21 to the material removal table 142) from above. A camera (imaging camera) 191 and an illumination 192 arranged to face the color mixing camera 191 so as to sandwich the workpiece W are provided. The drawing processing result of the workpiece W conveyed by the material removal is captured by the color mixing camera 191 in a state where the irradiation light from the illumination 192 is received. Since the workpiece W is a transparent glass substrate, the drawing result can be detected by transmitted light. Based on the detection result, the mixed color of the drawing result is inspected, and the defect of the workpiece subjected to the drawing process is determined.

  As described above, by arranging the drawing result detection device 143 located between the set table 21 and the material removal table 142, the drawing result can be detected by using the material removal conveyance. Therefore, the drawing result can be detected efficiently. In addition, since the drawing result can be detected by the transmitted light from the illumination 192, it is possible to detect the drawing result with high accuracy. In the present embodiment, the color mixture camera 191 performs a pixel color mixture inspection. However, instead of (or in addition to) the color mixing camera 191, a color density detection camera may be provided to inspect the color density and detect density unevenness and stripe unevenness.

  Here, with reference to FIG. 7, the material supply / discharge material operation of the droplet discharge device 1 will be described. In the feeding / removing operation, feeding and removal are performed in the same process. Therefore, in this operation, the workpiece W before drawing processing (hereinafter referred to as “supplying workpiece W1”) is set in the material supply table 141, and the workpiece W after drawing processing (hereinafter referred to as material removal workpiece W2) is set in the set table 21. ) Is set (FIG. 7A). Further, the material removal opening / closing door 101 formed in the chamber 6 is opened.

  First, the feed gas supply system 162, the material removal gas supply system 182 and the gas flow path system 104 are driven (the gas flow path system 104 is driven to float). Thereby, the material work W1 on the material table 141 is levitated and the material removal work W2 on the set table 21 is levitated (FIG. 7B). When the workpieces W1 and W2 are lifted, the feed material workpiece W1 is moved in the horizontal direction by the feed material kick-out mechanism 164, and the material removal workpiece W2 is moved in the horizontal direction by the material removal kick-out mechanism 109 (FIG. 7C). As a result, the material supply work W1 is transferred from the supply table 141 to the set table 21, and the material removal work W2 is transferred from the set table 21 to the material removal table 142. At this time, the material removal work W2 passes through the material removal opening / closing door 101 and then passes over the drawing result detection device 143, and the drawing result is inspected.

  When the material supply work W1 moves onto the set table 21 and the material removal work W2 moves onto the material removal table 142, the material supply work W1 is moved onto the set table 21 by the material supply stopper mechanism 114 of the set table 21. Is stopped at a predetermined position. On the other hand, the material removal work W2 is stopped at a predetermined position on the material removal table 142 by the material removal stopper mechanism 184 of the material removal table 142 (FIG. 7D). Thereafter, the driving of the gas flow path system 104, the supply gas supply system 162, and the removal material gas supply system 182 is stopped, and the supply / discharge material is completed (FIG. 7E).

  As described above, according to the above-described configuration, the workpiece W can be conveyed and fed in a floating state. Therefore, it is not necessary to directly contact and support the workpiece W during conveyance of the supply / discharge material, it is possible to suppress damage and deformation of the workpiece W, and it is possible to move the workpiece W with an extremely small force. Moreover, since the feeding / unloading material conveyance of the workpiece | work W can be performed simultaneously, the feeding / unloading material of the workpiece | work W can be performed efficiently. Furthermore, since the surface of the set table 21 is lower than the surface of the supply table 141 and the surface of the material removal table 142 is lower than the surface of the set table 21, the workpiece W slightly drops during the supply / discharge material conveyance. Even in this case, it is possible to prevent the workpiece W from colliding with the end of the receiving table (the set table 21 or the material removal table 142).

  According to the configuration as described above, the workpiece W is floated without being in direct contact with the workpiece W by using the workpiece floating means for floating the workpiece W with the released gas as a mechanism for floating the workpiece W on the table body 103. Therefore, it is possible to prevent the workpiece W from being damaged or deformed. In addition, the present apparatus can have a simple configuration and the set table 21 can be made thin.

  Unlike the present embodiment, a plurality of porous members 106 may be equally arranged in the XY directions on the set table 21, the material supply table 141, and the material removal table 142.

  Further, in the present embodiment, the kicking mechanism and the stopper mechanism are used as the mechanism for moving the floated workpiece W (the material supply means and the material removal means described in the claims), but the invention is not limited thereto. As another implementation method, the lifted workpiece W may be moved by pushing (or pulling) the end surface of the workpiece W by the robot arm unit 144. As another implementation method, a discharge gas supply mechanism 111 (flow rate adjustment valve 131) may be provided for each porous member 106 and the discharge pressure may be adjusted by each porous member 106 to move the workpiece W. For example, the discharge pressure of the porous member 106 at the tail end side in the movement direction may be lower than the discharge pressure of the porous member 106 at the tip end side in the movement direction, and the workpiece W may be moved so as to be supported slightly obliquely. . Furthermore, as another implementation method, it has an air nozzle that is connected to the compressed air supply equipment 85 and discharges the compressed air obliquely toward the end of the work W, and the work W is pressed by the compressed air discharged from the air nozzle. You may do it.

  Further, in the present embodiment, a device including the droplet discharge device 1 including ten carriage units 51 is used, but the number of carriage units 51 is arbitrary.

  Next, as an electro-optical device (flat panel display) manufactured using the droplet discharge device 1 of this embodiment, a color filter, a liquid crystal display device, an organic EL device, a plasma display (PDP device), an electron emission device ( FED devices, SED devices), and active matrix substrates formed in these display devices will be described as an example for their structures and manufacturing methods. Note that an active matrix substrate refers to a substrate on which a thin film transistor, a source line electrically connected to the thin film transistor, and a data line are formed.

First, a method for manufacturing a color filter incorporated in a liquid crystal display device, an organic EL device, or the like will be described. FIG. 8 is a flowchart showing the manufacturing process of the color filter, and FIG. 9 is a schematic cross-sectional view of the color filter 500 (filter base body 500A) of this embodiment shown in the order of the manufacturing process.
First, in the black matrix forming step (S101), a black matrix 502 is formed on a substrate (W) 501 as shown in FIG. The black matrix 502 is formed of metal chromium, a laminate of metal chromium and chromium oxide, resin black, or the like. A sputtering method, a vapor deposition method, or the like can be used to form the black matrix 502 made of a metal thin film. Further, when forming the black matrix 502 made of a resin thin film, a gravure printing method, a photoresist method, a thermal transfer method, or the like can be used.

Subsequently, in the bank formation step (S102), a bank 503 is formed in a state of being superimposed on the black matrix 502. That is, first, as shown in FIG. 9B, a resist layer 504 made of a negative transparent photosensitive resin is formed so as to cover the substrate 501 and the black matrix 502. Then, an exposure process is performed with the upper surface covered with a mask film 505 formed in a matrix pattern shape.
Further, as shown in FIG. 9C, the resist layer 504 is patterned by etching an unexposed portion of the resist layer 504 to form a bank 503. When the black matrix is formed from resin black, it is possible to use both the black matrix and the bank.
The bank 503 and the black matrix 502 below the partition wall 507b partitioning each pixel region 507a, and in the subsequent colored layer forming step, the colored liquid layers (film forming portions) 508R, 508G, When forming 508B, the landing area of the functional droplet is defined.

The filter substrate 500A is obtained through the above black matrix forming step and bank forming step.
In the present embodiment, as the material for the bank 503, a resin material whose surface is lyophobic (hydrophobic) is used. Since the surface of the substrate (glass substrate) 501 is lyophilic (hydrophilic), the droplets into each pixel region 507a surrounded by the bank 503 (partition wall portion 507b) in the colored layer forming step described later. Variations in landing position can be automatically corrected.

  Next, in the colored layer forming step (S103), as shown in FIG. 9D, the functional liquid droplets are ejected by the functional liquid droplet ejection head 17, and each pixel region 507a is surrounded by the partition wall portion 507b. Let it land. In this case, the functional liquid droplet ejection head 17 is used to introduce functional liquids (filter materials) of three colors of R, G, and B to eject functional liquid droplets. Note that the three-color arrangement pattern of R, G, and B includes a stripe arrangement, a mosaic arrangement, and a delta arrangement.

Thereafter, the functional liquid is fixed through a drying process (a process such as heating), and three colored layers 508R, 508G, and 508B are formed. When the colored layers 508R, 508G, and 508B are formed, the process proceeds to the protective film forming step (S104), and as shown in FIG. 9E, the substrate 501, the partition wall portion 507b, and the colored layers 508R, 508G, and 508B are moved. A protective film 509 is formed so as to cover the upper surface.
That is, after the protective film coating liquid is discharged over the entire surface of the substrate 501 where the colored layers 508R, 508G, and 508B are formed, the protective film 509 is formed through a drying process.
Then, after forming the protective film 509, the color filter 500 moves to a film forming process such as ITO (Indium Tin Oxide) which becomes a transparent electrode in the next process.

  FIG. 10 is a cross-sectional view of a main part showing a schematic configuration of a passive matrix liquid crystal device (liquid crystal device) as an example of a liquid crystal display device using the color filter 500 described above. By attaching auxiliary elements such as a liquid crystal driving IC, a backlight, and a support to the liquid crystal device 520, a transmissive liquid crystal display device as a final product can be obtained. Since the color filter 500 is the same as that shown in FIG. 9, the corresponding parts are denoted by the same reference numerals, and description thereof is omitted.

The liquid crystal device 520 is roughly configured by a color filter 500, a counter substrate 521 made of a glass substrate, and a liquid crystal layer 522 made of an STN (Super Twisted Nematic) liquid crystal composition sandwiched between them, The filter 500 is arranged on the upper side (observer side) in the figure.
Although not shown, polarizing plates are provided on the outer surfaces of the counter substrate 521 and the color filter 500 (surfaces opposite to the liquid crystal layer 522 side), and the polarizing plates located on the counter substrate 521 side are also provided. A backlight is disposed outside.

On the protective film 509 of the color filter 500 (on the liquid crystal layer side), a plurality of strip-shaped first electrodes 523 elongated in the left-right direction in FIG. 10 are formed at predetermined intervals. The color of the first electrode 523 A first alignment film 524 is formed so as to cover the surface opposite to the filter 500 side.
On the other hand, a plurality of strip-shaped second electrodes 526 elongated in a direction orthogonal to the first electrode 523 of the color filter 500 are formed on the surface of the counter substrate 521 facing the color filter 500 at a predetermined interval. A second alignment film 527 is formed so as to cover the surface of the two electrodes 526 on the liquid crystal layer 522 side. The first electrode 523 and the second electrode 526 are made of a transparent conductive material such as ITO.

The spacer 528 provided in the liquid crystal layer 522 is a member for keeping the thickness (cell gap) of the liquid crystal layer 522 constant. The sealing material 529 is a member for preventing the liquid crystal composition in the liquid crystal layer 522 from leaking to the outside. Note that one end of the first electrode 523 extends to the outside of the sealing material 529 as a lead-out wiring 523a.
A portion where the first electrode 523 and the second electrode 526 intersect with each other is a pixel, and the color layers 508R, 508G, and 508B of the color filter 500 are located in the portion that becomes the pixel.

  In a normal manufacturing process, patterning of the first electrode 523 and application of the first alignment film 524 are performed on the color filter 500 to create a portion on the color filter 500 side. Patterning of the electrode 526 and application of the second alignment film 527 are performed to create a portion on the counter substrate 521 side. Thereafter, a spacer 528 and a sealing material 529 are formed in the portion on the counter substrate 521 side, and the portion on the color filter 500 side is bonded in this state. Next, liquid crystal constituting the liquid crystal layer 522 is injected from the inlet of the sealing material 529, and the inlet is closed. Thereafter, both polarizing plates and the backlight are laminated.

  The droplet discharge device 1 according to the embodiment applies, for example, a spacer material (functional liquid) that constitutes the cell gap, and before the portion on the color filter 500 side is bonded to the portion on the counter substrate 521 side, the sealing material Liquid crystal (functional liquid) can be uniformly applied to the region surrounded by 529. Further, the printing of the sealing material 529 can be performed by the functional liquid droplet ejection head 17. Further, the first and second alignment films 524 and 527 can be applied by the functional liquid droplet ejection head 17.

FIG. 11 is a cross-sectional view of a principal part showing a schematic configuration of a second example of a liquid crystal device using the color filter 500 manufactured in the present embodiment.
The liquid crystal device 530 is significantly different from the liquid crystal device 520 in that the color filter 500 is arranged on the lower side (the side opposite to the observer side) in the figure.
The liquid crystal device 530 is generally configured by sandwiching a liquid crystal layer 532 made of STN liquid crystal between a color filter 500 and a counter substrate 531 made of a glass substrate or the like. Although not shown, polarizing plates and the like are provided on the outer surfaces of the counter substrate 531 and the color filter 500, respectively.

On the protective film 509 of the color filter 500 (on the liquid crystal layer 532 side), a plurality of strip-shaped first electrodes 533 elongated in the depth direction in the figure are formed at predetermined intervals, and the liquid crystal of the first electrodes 533 is formed. A first alignment film 534 is formed so as to cover the surface on the layer 532 side.
A plurality of strip-shaped second electrodes 536 extending in a direction orthogonal to the first electrode 533 on the color filter 500 side are formed on the surface of the counter substrate 531 facing the color filter 500 at a predetermined interval. A second alignment film 537 is formed so as to cover the surface of the second electrode 536 on the liquid crystal layer 532 side.

The liquid crystal layer 532 is provided with a spacer 538 for keeping the thickness of the liquid crystal layer 532 constant and a sealing material 539 for preventing the liquid crystal composition in the liquid crystal layer 532 from leaking to the outside. Yes.
Similarly to the liquid crystal device 520 described above, a portion where the first electrode 533 and the second electrode 536 intersect with each other is a pixel, and the colored layers 508R, 508G, and 508B of the color filter 500 are located at the portion that becomes the pixel. Is configured to do.

FIG. 12 shows a third example in which a liquid crystal device is configured using a color filter 500 to which the present invention is applied, and is an exploded perspective view showing a schematic configuration of a transmissive TFT (Thin Film Transistor) type liquid crystal device. It is.
In the liquid crystal device 550, the color filter 500 is arranged on the upper side (observer side) in the figure.

The liquid crystal device 550 includes a color filter 500, a counter substrate 551 disposed so as to face the color filter 500, a liquid crystal layer (not shown) sandwiched therebetween, and an upper surface side (observer side) of the color filter 500. The polarizing plate 555 and the polarizing plate (not shown) arranged on the lower surface side of the counter substrate 551 are roughly configured.
A liquid crystal driving electrode 556 is formed on the surface of the protective film 509 of the color filter 500 (the surface on the counter substrate 551 side). The electrode 556 is made of a transparent conductive material such as ITO, and is a full surface electrode that covers the entire region where a pixel electrode 560 described later is formed. An alignment film 557 is provided so as to cover the surface of the electrode 556 opposite to the pixel electrode 560.

  An insulating layer 558 is formed on the surface of the counter substrate 551 facing the color filter 500, and the scanning lines 561 and the signal lines 562 are formed on the insulating layer 558 in a state of being orthogonal to each other. A pixel electrode 560 is formed in a region surrounded by the scanning lines 561 and the signal lines 562. In an actual liquid crystal device, an alignment film is provided on the pixel electrode 560, but the illustration is omitted.

  In addition, a thin film transistor 563 including a source electrode, a drain electrode, a semiconductor, and a gate electrode is incorporated in a portion surrounded by the cutout portion of the pixel electrode 560 and the scanning line 561 and the signal line 562. . The thin film transistor 563 is turned on / off by application of signals to the scanning line 561 and the signal line 562 so that energization control to the pixel electrode 560 can be performed.

  Note that the liquid crystal devices 520, 530, and 550 in the above examples are transmissive, but a reflective liquid crystal device or a transflective liquid crystal device is provided by providing a reflective layer or a transflective layer. You can also

  Next, FIG. 13 is a cross-sectional view of a main part of a display area of an organic EL device (hereinafter simply referred to as a display device 600).

The display device 600 is schematically configured with a circuit element portion 602, a light emitting element portion 603, and a cathode 604 laminated on a substrate (W) 601.
In the display device 600, light emitted from the light emitting element portion 603 to the substrate 601 side is transmitted through the circuit element portion 602 and the substrate 601 and emitted to the observer side, and the light emitting element portion 603 is opposite to the substrate 601. After the light emitted to the side is reflected by the cathode 604, the light passes through the circuit element portion 602 and the substrate 601 and is emitted to the observer side.

  A base protective film 606 made of a silicon oxide film is formed between the circuit element portion 602 and the substrate 601, and an island-shaped semiconductor film 607 made of polycrystalline silicon is formed on the base protective film 606 (on the light emitting element portion 603 side). Is formed. In the left and right regions of the semiconductor film 607, a source region 607a and a drain region 607b are formed by high concentration cation implantation, respectively. A central portion where no positive ions are implanted is a channel region 607c.

  In the circuit element portion 602, a transparent gate insulating film 608 covering the base protective film 606 and the semiconductor film 607 is formed, and a position corresponding to the channel region 607c of the semiconductor film 607 on the gate insulating film 608 is formed. For example, a gate electrode 609 made of Al, Mo, Ta, Ti, W or the like is formed. On the gate electrode 609 and the gate insulating film 608, a transparent first interlayer insulating film 611a and a second interlayer insulating film 611b are formed. Further, contact holes 612a and 612b are formed through the first and second interlayer insulating films 611a and 611b and communicating with the source region 607a and the drain region 607b of the semiconductor film 607, respectively.

A transparent pixel electrode 613 made of ITO or the like is patterned and formed in a predetermined shape on the second interlayer insulating film 611b, and the pixel electrode 613 is connected to the source region 607a through the contact hole 612a. .
A power supply line 614 is disposed on the first interlayer insulating film 611a, and the power supply line 614 is connected to the drain region 607b through the contact hole 612b.

  Thus, the driving thin film transistors 615 connected to the pixel electrodes 613 are formed in the circuit element portion 602, respectively.

The light emitting element portion 603 includes a functional layer 617 stacked on each of the plurality of pixel electrodes 613, and a bank portion 618 provided between each pixel electrode 613 and the functional layer 617 to partition each functional layer 617. It is roughly structured.
The pixel electrode 613, the functional layer 617, and the cathode 604 provided on the functional layer 617 constitute a light emitting element. Note that the pixel electrode 613 is formed by patterning in a substantially rectangular shape in plan view, and a bank portion 618 is formed between the pixel electrodes 613.

The bank unit 618 is laminated on the inorganic bank layer 618a (first bank layer) 618a formed of an inorganic material such as SiO, SiO ₂ , TiO _{2, and the} like, and is made of an acrylic resin, a polyimide resin, or the like. It is composed of an organic bank layer 618b (second bank layer) having a trapezoidal cross section formed of a resist having excellent heat resistance and solvent resistance. A part of the bank unit 618 is formed on the peripheral edge of the pixel electrode 613.
An opening 619 that gradually expands upward with respect to the pixel electrode 613 is formed between the bank portions 618.

The functional layer 617 includes a hole injection / transport layer 617a formed in a stacked state on the pixel electrode 613 in the opening 619, and a light emitting layer 617b formed on the hole injection / transport layer 617a. Has been. Note that another functional layer having other functions may be further formed adjacent to the light emitting layer 617b. For example, it is possible to form an electron transport layer.
The hole injection / transport layer 617a has a function of transporting holes from the pixel electrode 613 side and injecting them into the light emitting layer 617b. The hole injection / transport layer 617a is formed by discharging a first composition (functional liquid) containing a hole injection / transport layer forming material. A known material is used as the hole injection / transport layer forming material.

  The light emitting layer 617b emits light in red (R), green (G), or blue (B), and discharges a second composition (functional liquid) containing a light emitting layer forming material (light emitting material). Is formed. As the solvent (nonpolar solvent) of the second composition, a known material that is insoluble in the hole injection / transport layer 617a is preferably used, and such a nonpolar solvent is used as the second composition of the light emitting layer 617b. By using the light emitting layer 617b, the light emitting layer 617b can be formed without re-dissolving the hole injection / transport layer 617a.

  The light emitting layer 617b is configured such that the holes injected from the hole injection / transport layer 617a and the electrons injected from the cathode 604 are recombined in the light emitting layer to emit light.

  The cathode 604 is formed so as to cover the entire surface of the light emitting element portion 603, and plays a role of flowing current to the functional layer 617 in a pair with the pixel electrode 613. Note that a sealing member (not shown) is disposed on the cathode 604.

Next, the manufacturing process of said display apparatus 600 is demonstrated with reference to FIGS.
As shown in FIG. 14, the display device 600 includes a bank part forming step (S111), a surface treatment step (S112), a hole injection / transport layer forming step (S113), a light emitting layer forming step (S114), It is manufactured through an electrode formation step (S115). In addition, a manufacturing process is not restricted to what is illustrated, and when other processes are removed as needed, it may be added.

First, in the bank part forming step (S111), as shown in FIG. 15, an inorganic bank layer 618a is formed on the second interlayer insulating film 611b. The inorganic bank layer 618a is formed by forming an inorganic film at a formation position and then patterning the inorganic film using a photolithography technique or the like. At this time, a part of the inorganic bank layer 618 a is formed so as to overlap with the peripheral edge of the pixel electrode 613.
When the inorganic bank layer 618a is formed, an organic bank layer 618b is formed on the inorganic bank layer 618a as shown in FIG. The organic bank layer 618b is also formed by patterning using a photolithography technique or the like in the same manner as the inorganic bank layer 618a.
In this way, the bank portion 618 is formed. Accordingly, an opening 619 opening upward with respect to the pixel electrode 613 is formed between the bank portions 618. The opening 619 defines a pixel region.

In the surface treatment step (S112), a lyophilic process and a lyophobic process are performed. The regions to be subjected to lyophilic treatment are the first stacked portion 618aa of the inorganic bank layer 618a and the electrode surface 613a of the pixel electrode 613. These regions are made lyophilic by plasma treatment using oxygen as a treatment gas, for example. Is done. This plasma treatment also serves to clean the ITO that is the pixel electrode 613.
In addition, the lyophobic treatment is performed on the wall surface 618s of the organic bank layer 618b and the upper surface 618t of the organic bank layer 618b. )
By performing this surface treatment process, when forming the functional layer 617 using the functional liquid droplet ejection head 17, the functional liquid droplets can be landed more reliably on the pixel area. It is possible to prevent the functional droplets from overflowing from the opening 619.

  Then, the display device base 600A is obtained through the above steps. The display device base 600A is placed on the set table 21 of the droplet discharge device 1 shown in FIG. 1, and the following hole injection / transport layer forming step (S113) and light emitting layer forming step (S114) are performed. .

  As shown in FIG. 17, in the hole injection / transport layer forming step (S113), the first composition containing the hole injection / transport layer forming material is transferred from the functional liquid droplet ejection head 17 to each opening 619 that is a pixel region. Discharge inside. Thereafter, as shown in FIG. 18, a drying process and a heat treatment are performed to evaporate the polar solvent contained in the first composition, thereby forming a hole injection / transport layer 617a on the pixel electrode (electrode surface 613a) 613.

Next, the light emitting layer forming step (S114) will be described. In this light emitting layer forming step, as described above, in order to prevent re-dissolution of the hole injection / transport layer 617a, the hole injection / transport layer 617a is used as a solvent for the second composition used in forming the light emitting layer. A non-polar solvent insoluble in.
However, since the hole injection / transport layer 617a has a low affinity for the nonpolar solvent, the hole injection / transport layer 617a has a low affinity even if the second composition containing the nonpolar solvent is discharged onto the hole injection / transport layer 617a. There is a possibility that the injection / transport layer 617a and the light emitting layer 617b cannot be adhered to each other, or the light emitting layer 617b cannot be applied uniformly.
Therefore, in order to increase the surface affinity of the hole injection / transport layer 617a with respect to the nonpolar solvent and the light emitting layer forming material, it is preferable to perform surface treatment (surface modification treatment) before forming the light emitting layer. In this surface treatment, a surface modifying material which is the same solvent as the non-polar solvent of the second composition used in the formation of the light emitting layer or a similar solvent is applied on the hole injection / transport layer 617a, and this is applied. This is done by drying.
By performing such treatment, the surface of the hole injection / transport layer 617a is easily adapted to the nonpolar solvent. In the subsequent step, the second composition containing the light emitting layer forming material is added to the hole injection / transport layer. It can be uniformly applied to 617a.

  Then, as shown in FIG. 19, the second composition containing the light emitting layer forming material corresponding to one of the colors (blue (B) in the example of FIG. 19) is used as a functional droplet as a pixel region ( A predetermined amount is driven into the opening 619). The second composition driven into the pixel region spreads on the hole injection / transport layer 617a and fills the opening 619. Even if the second composition deviates from the pixel region and lands on the upper surface 618t of the bank portion 618, the upper composition 618t is subjected to the liquid repellent treatment as described above. Things are easy to roll into the opening 619.

  Thereafter, by performing a drying process and the like, the second composition after discharge is dried, the nonpolar solvent contained in the second composition is evaporated, and as shown in FIG. 20, the hole injection / transport layer 617a A light emitting layer 617b is formed thereon. In the case of this figure, a light emitting layer 617b corresponding to blue (B) is formed.

  Similarly, using the functional liquid droplet ejection head 17, as shown in FIG. 21, the same steps as in the case of the light emitting layer 617b corresponding to the blue (B) described above are sequentially performed, and other colors (red (R) and red (R) and A light emitting layer 617b corresponding to green (G) is formed. Note that the order in which the light-emitting layers 617b are formed is not limited to the illustrated order, and may be formed in any order. For example, the order of formation can be determined according to the light emitting layer forming material. In addition, the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  As described above, the functional layer 617, that is, the hole injection / transport layer 617a and the light emitting layer 617b are formed on the pixel electrode 613. And it transfers to a counter electrode formation process (S115).

In the counter electrode forming step (S115), as shown in FIG. 22, a cathode 604 (counter electrode) is formed on the entire surface of the light emitting layer 617b and the organic bank layer 618b by, for example, vapor deposition, sputtering, CVD, or the like. In the present embodiment, the cathode 604 is configured by, for example, laminating a calcium layer and an aluminum layer.
At the top of the cathode 604, Al film as the electrode, Ag film and a protective layer of SiO _2, SiN, or the like for its antioxidant is appropriately provided.

  After forming the cathode 604 in this way, the display device 600 is obtained by performing other processes such as a sealing process for sealing the upper part of the cathode 604 with a sealing member and a wiring process.

Next, FIG. 23 is an exploded perspective view of a main part of a plasma display device (PDP device: hereinafter simply referred to as a display device 700). In the figure, the display device 700 is shown with a part thereof cut away.
The display device 700 is schematically configured to include a first substrate 701, a second substrate 702, and a discharge display portion 703 formed between them, which are disposed to face each other. The discharge display unit 703 includes a plurality of discharge chambers 705. Among the plurality of discharge chambers 705, the three discharge chambers 705 of the red discharge chamber 705R, the green discharge chamber 705G, and the blue discharge chamber 705B are arranged to form one pixel.

Address electrodes 706 are formed in stripes at predetermined intervals on the upper surface of the first substrate 701, and a dielectric layer 707 is formed so as to cover the address electrodes 706 and the upper surface of the first substrate 701. On the dielectric layer 707, partition walls 708 are provided so as to be positioned between the address electrodes 706 and along the address electrodes 706. The partition 708 includes one extending on both sides in the width direction of the address electrode 706 as shown, and one not shown extending in the direction orthogonal to the address electrode 706.
A region partitioned by the partition 708 is a discharge chamber 705.

  A phosphor 709 is disposed in the discharge chamber 705. The phosphor 709 emits red (R), green (G), or blue (B) fluorescence, and the red phosphor 709R is disposed at the bottom of the red discharge chamber 705R, and the green discharge chamber 705G. A green phosphor 709G and a blue phosphor 709B are arranged at the bottom and the blue discharge chamber 705B, respectively.

On the lower surface of the second substrate 702 in the drawing, a plurality of display electrodes 711 are formed in stripes at predetermined intervals in a direction orthogonal to the address electrodes 706. A dielectric layer 712 and a protective film 713 made of MgO or the like are formed so as to cover them.
The first substrate 701 and the second substrate 702 are bonded so that the address electrodes 706 and the display electrodes 711 face each other in a state of being orthogonal to each other. The address electrode 706 and the display electrode 711 are connected to an AC power source (not shown).
When the electrodes 706 and 711 are energized, the phosphor 709 emits light in the discharge display portion 703, and color display is possible.

In the present embodiment, the address electrode 706, the display electrode 711, and the phosphor 709 can be formed by using the droplet discharge device 1 shown in FIG. Hereinafter, a process of forming the address electrode 706 on the first substrate 701 will be exemplified.
In this case, the following steps are performed with the first substrate 701 placed on the set table 21 of the droplet discharge device 1.
First, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the address electrode formation region as a functional liquid droplet by the functional liquid droplet ejection head 17. This liquid material is obtained by dispersing conductive fine particles such as metal in a dispersion medium as a conductive film wiring forming material. As the conductive fine particles, metal fine particles containing gold, silver, copper, palladium, nickel, or the like, a conductive polymer, or the like is used.

  When the replenishment of the liquid material is completed for all the address electrode formation regions to be replenished, the address material 706 is formed by drying the discharged liquid material and evaporating the dispersion medium contained in the liquid material. .

By the way, although the formation of the address electrode 706 has been exemplified in the above, the display electrode 711 and the phosphor 709 can also be formed through the above steps.
In the case of forming the display electrode 711, as in the case of the address electrode 706, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the display electrode formation region as a functional droplet.
Further, in the case of forming the phosphor 709, a liquid material (functional liquid) containing a fluorescent material corresponding to each color (R, G, B) is ejected as droplets from the functional liquid droplet ejection head 17, and it corresponds. Land in the color discharge chamber 705.

Next, FIG. 24 is a cross-sectional view of an essential part of an electron emission device (also referred to as an FED device or an SED device: hereinafter simply referred to as a display device 800). In the drawing, a part of the display device 800 is shown as a cross section.
The display device 800 is schematically configured to include a first substrate 801, a second substrate 802, and a field emission display portion 803 formed therebetween, which are disposed to face each other. The field emission display unit 803 includes a plurality of electron emission units 805 arranged in a matrix.

  A first element electrode 806a and a second element electrode 806b constituting the cathode electrode 806 are formed on the upper surface of the first substrate 801 so as to be orthogonal to each other. In addition, a conductive film 807 having a gap 808 is formed in a portion partitioned by the first element electrode 806a and the second element electrode 806b. That is, the first element electrode 806a, the second element electrode 806b, and the conductive film 807 constitute a plurality of electron emission portions 805. The conductive film 807 is made of, for example, palladium oxide (PdO), and the gap 808 is formed by forming after forming the conductive film 807.

  An anode electrode 809 that faces the cathode electrode 806 is formed on the lower surface of the second substrate 802. A grid-like bank portion 811 is formed on the lower surface of the anode electrode 809, and a phosphor 813 is disposed in each downward opening 812 surrounded by the bank portion 811 so as to correspond to the electron emission portion 805. Yes. The phosphor 813 emits fluorescence of any one of red (R), green (G), and blue (B), and each opening 812 has a red phosphor 813R, a green phosphor 813G, and a blue color. The phosphors 813B are arranged in the predetermined pattern described above.

  The first substrate 801 and the second substrate 802 configured as described above are bonded together with a minute gap. In this display device 800, electrons that jump out of the first element electrode 806 a or the second element electrode 806 b that are cathodes through the conductive film (gap 808) 807 are formed on the phosphor 813 that is formed on the anode electrode 809 that is an anode. When excited, it emits light and enables color display.

  Also in this case, as in the other embodiments, the first element electrode 806a, the second element electrode 806b, the conductive film 807, and the anode electrode 809 can be formed using the droplet discharge device 1 and each color. The phosphors 813R, 813G, and 813B can be formed using the droplet discharge device 1.

  The first element electrode 806a, the second element electrode 806b, and the conductive film 807 have the planar shape shown in FIG. 25A, and when these are formed, as shown in FIG. 25B. In addition, the bank portion BB is formed (photolithographic method), leaving portions where the first element electrode 806a, the second element electrode 806b, and the conductive film 807 are previously formed. Next, the first element electrode 806a and the second element electrode 806b were formed in the groove portion constituted by the bank portion BB (inkjet method using the droplet discharge device 1), and the solvent was dried to form a film. After that, a conductive film 807 is formed (an ink jet method using the droplet discharge device 1). Then, after forming the conductive film 807, the bank portion BB is removed (ashing peeling process), and the process proceeds to the above forming process. As in the case of the organic EL device described above, it is preferable to perform a lyophilic process on the first substrate 801 and the second substrate 802 and a lyophobic process on the bank portions 811 and BB.

  As other electro-optical devices, devices such as metal wiring formation, lens formation, resist formation, and light diffuser formation are conceivable. By using the droplet discharge device 1 described above for manufacturing various electro-optical devices (devices), various electro-optical devices can be efficiently manufactured.

It is a top view of a droplet discharge device. It is a side view of a droplet discharge device. It is a figure of the functional droplet discharge head which comprises a head group. It is an external appearance perspective view of a functional droplet discharge head. It is the top view shown about the set table and the supply / discharge material mechanism circumference. It is the schematic diagram shown about the set table and the supply / discharge material mechanism. It is explanatory drawing shown about the feeding / discharging material operation | movement by a feeding / dispensing material mechanism. It is a flowchart explaining a color filter manufacturing process. (A)-(e) is a schematic cross section of the color filter shown to the manufacturing process order. It is principal part sectional drawing which shows schematic structure of the liquid crystal device using the color filter to which this invention is applied. It is principal part sectional drawing which shows schematic structure of the liquid crystal device of the 2nd example using the color filter to which this invention is applied. It is principal part sectional drawing which shows schematic structure of the liquid crystal device of the 3rd example using the color filter to which this invention is applied. It is principal part sectional drawing of the display apparatus which is an organic electroluminescent apparatus. It is a flowchart explaining the manufacturing process of the display apparatus which is an organic electroluminescent apparatus. It is process drawing explaining formation of an inorganic bank layer. It is process drawing explaining formation of an organic substance bank layer. It is process drawing explaining the process in which a positive hole injection / transport layer is formed. It is process drawing explaining the state in which the positive hole injection / transport layer was formed. It is process drawing explaining the process in which a blue light emitting layer is formed. It is process drawing explaining the state in which the blue light emitting layer was formed. It is process drawing explaining the state in which the light emitting layer of each color was formed. It is process drawing explaining formation of a cathode. It is a principal part disassembled perspective view of the display apparatus which is a plasma type display apparatus (PDP apparatus). It is principal part sectional drawing of the display apparatus which is an electron emission apparatus (FED apparatus). It is the top view (a) around the electron emission part of a display apparatus, and the top view (b) which shows the formation method.

Explanation of symbols

  1: droplet discharge device, 6: chamber, 17: functional droplet discharge head, 21: set table, 106: porous member, 109: kicking mechanism for material removal, 111: discharge gas supply mechanism, 112: vacuum suction Mechanism: 113: Connection flow path, 114: Feeder stopper mechanism 122: Main flow path, 125: Supply side flow path, 126: Suction side flow path, 127: Ionizer, 128: Switching valve, 141: Feeding table, 142 : Material removal table, 143: drawing result detection device, 162: material supply gas supply system, 164: material supply kick-out mechanism, 182: material removal gas supply system, 184: material removal stopper mechanism, 191: color mixing camera, 192: Lighting, W: Workpiece

Claims (12)

An inkjet functional droplet ejection head that performs drawing processing by ejecting functional droplets to a workpiece;
In the drawing process, a set table for setting the workpiece;
A droplet discharge apparatus comprising: a work floating means that is incorporated in the set table and releases the release gas from the surface of the set table to float the work. The workpiece levitation means is embedded in the set table, and is configured to allow gas to pass therethrough, and a plurality of porous members,
The gas flow path is connected to the plurality of porous members on the downstream side and connected to the compressed gas supply means for supplying the released gas on the upstream side. The liquid droplet ejection apparatus described. A vacuum channel branched from the gas channel;
Vacuum suction means connected to the downstream side of the vacuum flow path;
The liquid according to claim 2, further comprising a switching unit that is provided at a branch portion of the gas flow path and performs flow path switching between the gas flow path and the vacuum flow path. Drop ejection device.   4. The liquid droplet ejection apparatus according to claim 2, further comprising a static elimination unit interposed in the gas flow path and ionizing the emitted gas. A supply table disposed adjacent to the set table and supplying the workpiece to the set table;
A material levitation means incorporated in the material table, for releasing the release gas from the surface of the material table to levitate the workpiece;
The liquid droplet ejection apparatus according to claim 1, further comprising a material supply unit that moves the floated work from the material supply table to the set table.   The droplet discharge device according to claim 5, wherein the surface of the supply table is disposed at a position higher than the surface of the set table.   7. The droplet discharge device according to claim 5, further comprising chamber means for controlling the temperature of the internal atmosphere and accommodating the functional droplet discharge head, the set table, and the supply table. . A material removal table disposed adjacent to the set table for removing the workpiece from the set table;
A material removal means that is incorporated in the material removal table and releases the released gas from the surface of the material removal table to float the workpiece;
The liquid droplet ejection apparatus according to claim 1, further comprising a material removal unit that moves the floated workpiece from the set table to the material removal table.   The liquid droplet ejection apparatus according to claim 8, wherein the surface of the material removal table is disposed at a position lower than the surface of the set table. The workpiece is a transparent glass substrate,
A drawing result detecting means that is located between the set table and the material removal table and inspects a drawing result drawn on the work upper surface by the functional liquid droplet ejection head;
The drawing result detection means includes illumination that faces the workpiece from above and below,
The liquid droplet ejection apparatus according to claim 1, further comprising: an imaging camera that faces the workpiece from the upper and lower sides and is disposed to face the illumination.   11. A method of manufacturing an electro-optical device, wherein the droplet discharge device according to claim 1 is used to form a film forming portion with functional droplets on the workpiece.   An electro-optical device using the droplet discharge device according to claim 1, wherein a film forming portion is formed by functional droplets on the workpiece.

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