JP2009049086A5 - - Google Patents
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- Publication number
- JP2009049086A5 JP2009049086A5 JP2007211990A JP2007211990A JP2009049086A5 JP 2009049086 A5 JP2009049086 A5 JP 2009049086A5 JP 2007211990 A JP2007211990 A JP 2007211990A JP 2007211990 A JP2007211990 A JP 2007211990A JP 2009049086 A5 JP2009049086 A5 JP 2009049086A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding film
- substrate
- bonding
- atom
- adherend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 13
- 125000004429 atom Chemical group 0.000 claims 8
- 239000000463 material Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 125000004430 oxygen atom Chemical group O* 0.000 claims 5
- 238000005304 joining Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 125000004437 phosphorous atom Chemical group 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 238000005240 physical vapour deposition Methods 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007211990A JP2009049086A (ja) | 2007-08-15 | 2007-08-15 | 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007211990A JP2009049086A (ja) | 2007-08-15 | 2007-08-15 | 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009049086A JP2009049086A (ja) | 2009-03-05 |
| JP2009049086A5 true JP2009049086A5 (https=) | 2010-08-26 |
Family
ID=40501061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007211990A Withdrawn JP2009049086A (ja) | 2007-08-15 | 2007-08-15 | 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009049086A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3993021A1 (en) * | 2020-11-03 | 2022-05-04 | Infineon Technologies AG | Method of manufacturing a bonded substrate stack |
| CN119950825B (zh) * | 2025-03-13 | 2025-07-22 | 北京工业大学 | 基于压电驱动的自适应释药电纺覆膜气管支架的制备方法 |
-
2007
- 2007-08-15 JP JP2007211990A patent/JP2009049086A/ja not_active Withdrawn
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