JP2009038077A - プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ - Google Patents

プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ Download PDF

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Publication number
JP2009038077A
JP2009038077A JP2007198674A JP2007198674A JP2009038077A JP 2009038077 A JP2009038077 A JP 2009038077A JP 2007198674 A JP2007198674 A JP 2007198674A JP 2007198674 A JP2007198674 A JP 2007198674A JP 2009038077 A JP2009038077 A JP 2009038077A
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JP
Japan
Prior art keywords
wall portion
mold
bottom wall
arm
shield plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007198674A
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English (en)
Japanese (ja)
Inventor
Hiroshi Saito
博 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP2007198674A priority Critical patent/JP2009038077A/ja
Priority to US12/220,867 priority patent/US20090072334A1/en
Priority to TW097128714A priority patent/TW200913178A/zh
Priority to KR1020080073837A priority patent/KR20090013067A/ko
Priority to CN200810144129.4A priority patent/CN101359645B/zh
Publication of JP2009038077A publication Critical patent/JP2009038077A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2007198674A 2007-07-31 2007-07-31 プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ Pending JP2009038077A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007198674A JP2009038077A (ja) 2007-07-31 2007-07-31 プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ
US12/220,867 US20090072334A1 (en) 2007-07-31 2008-07-29 Semiconductor device, pre-mold package, and manufacturing method therefor
TW097128714A TW200913178A (en) 2007-07-31 2008-07-29 Semiconductor device, pre-mold package, and manufacturing method therefor
KR1020080073837A KR20090013067A (ko) 2007-07-31 2008-07-29 반도체 장치, 예비 주형 패키지, 및 그의 제조 방법
CN200810144129.4A CN101359645B (zh) 2007-07-31 2008-07-29 半导体装置、预模制封装结构及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007198674A JP2009038077A (ja) 2007-07-31 2007-07-31 プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ

Publications (1)

Publication Number Publication Date
JP2009038077A true JP2009038077A (ja) 2009-02-19

Family

ID=40332043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007198674A Pending JP2009038077A (ja) 2007-07-31 2007-07-31 プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ

Country Status (2)

Country Link
JP (1) JP2009038077A (zh)
CN (1) CN101359645B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138921A (ja) * 2009-12-28 2011-07-14 Murata Mfg Co Ltd 電子部品装置及びリードフレーム
WO2014018718A2 (en) * 2012-07-27 2014-01-30 Knowles Electronics, Llc Housing and method to control solder creep on housing
JP2014522102A (ja) * 2011-07-29 2014-08-28 エプコス アクチエンゲゼルシャフト 半導体チップのハウジングおよびハウジングを有する半導体チップ
WO2021107769A1 (en) * 2019-11-29 2021-06-03 Ampleon Netherlands B.V. Lead frame based molded radio frequency package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105684147B (zh) * 2014-04-30 2019-04-05 富士电机株式会社 半导体模块及其制造方法
DE102016217007A1 (de) * 2016-09-07 2018-03-08 Siemens Aktiengesellschaft Leistungsmodul
EP3797962A1 (de) * 2019-09-30 2021-03-31 Siemens Aktiengesellschaft Gehäuse eines elektronikmoduls und dessen herstellung
CN112151509B (zh) * 2020-09-24 2022-11-25 维沃移动通信有限公司 封装器件、电子设备及器件封装方法
CN113091921A (zh) * 2021-03-26 2021-07-09 瓷金科技(河南)有限公司 贴片式传感器用封装管壳及使用该管壳的贴片式传感器

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138921A (ja) * 2009-12-28 2011-07-14 Murata Mfg Co Ltd 電子部品装置及びリードフレーム
JP2014522102A (ja) * 2011-07-29 2014-08-28 エプコス アクチエンゲゼルシャフト 半導体チップのハウジングおよびハウジングを有する半導体チップ
US9177880B2 (en) 2011-07-29 2015-11-03 Epcos Ag Housing for a semiconductor chip and semiconductor chip with a housing
WO2014018718A2 (en) * 2012-07-27 2014-01-30 Knowles Electronics, Llc Housing and method to control solder creep on housing
WO2014018718A3 (en) * 2012-07-27 2014-03-20 Knowles Electronics, Llc Housing and method to control solder creep on housing
US9402118B2 (en) 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
WO2021107769A1 (en) * 2019-11-29 2021-06-03 Ampleon Netherlands B.V. Lead frame based molded radio frequency package

Also Published As

Publication number Publication date
CN101359645A (zh) 2009-02-04
CN101359645B (zh) 2012-04-18

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