JP2009032914A5 - - Google Patents
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- Publication number
- JP2009032914A5 JP2009032914A5 JP2007195594A JP2007195594A JP2009032914A5 JP 2009032914 A5 JP2009032914 A5 JP 2009032914A5 JP 2007195594 A JP2007195594 A JP 2007195594A JP 2007195594 A JP2007195594 A JP 2007195594A JP 2009032914 A5 JP2009032914 A5 JP 2009032914A5
- Authority
- JP
- Japan
- Prior art keywords
- etching solution
- etching
- solution according
- potassium
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005530 etching Methods 0.000 claims 11
- NBVXSUQYWXRMNV-UHFFFAOYSA-N Fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- XMPZTFVPEKAKFH-UHFFFAOYSA-P Ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 claims 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N Perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims 2
- 125000004432 carbon atoms Chemical group C* 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910001416 lithium ion Inorganic materials 0.000 claims 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N potassium Chemical group [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 229910001414 potassium ion Inorganic materials 0.000 claims 1
- 229910001415 sodium ion Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007195594A JP4897604B2 (ja) | 2007-07-27 | 2007-07-27 | フォトマスク製造用のエッチング液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007195594A JP4897604B2 (ja) | 2007-07-27 | 2007-07-27 | フォトマスク製造用のエッチング液 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009032914A JP2009032914A (ja) | 2009-02-12 |
JP2009032914A5 true JP2009032914A5 (da) | 2009-07-16 |
JP4897604B2 JP4897604B2 (ja) | 2012-03-14 |
Family
ID=40403112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007195594A Active JP4897604B2 (ja) | 2007-07-27 | 2007-07-27 | フォトマスク製造用のエッチング液 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4897604B2 (da) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4940102B2 (ja) * | 2007-10-25 | 2012-05-30 | 株式会社 マイクロプロセス | エッチング剤組成物及びそれを用いた半導体装置の製造方法 |
JP5293114B2 (ja) * | 2008-11-26 | 2013-09-18 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP5442987B2 (ja) * | 2008-12-10 | 2014-03-19 | 株式会社Dnpファインケミカル | エッチング液およびブラックマトリックスの製造方法 |
JP5678464B2 (ja) * | 2009-07-14 | 2015-03-04 | 株式会社リコー | インクジェット記録用インク、インクカートリッジ、インクジェット記録装置 |
JP2011108975A (ja) * | 2009-11-20 | 2011-06-02 | Dnp Fine Chemicals Co Ltd | 導電膜用エッチング液および導電膜のエッチング方法 |
JP2011198901A (ja) * | 2010-03-18 | 2011-10-06 | Dnp Fine Chemicals Co Ltd | 導電膜用エッチング液および導電膜のエッチング方法 |
JP5872213B2 (ja) * | 2011-09-08 | 2016-03-01 | 公益財団法人神奈川科学技術アカデミー | 拡面処理された箔の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02285081A (ja) * | 1989-04-25 | 1990-11-22 | Sanyo Chem Ind Ltd | エッチング液 |
JPH05271967A (ja) * | 1992-03-24 | 1993-10-19 | The Ink Tec Kk | エッチング液組成物およびクロム材薄膜のエッチング方法 |
US6555510B2 (en) * | 2001-05-10 | 2003-04-29 | 3M Innovative Properties Company | Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
JP4005437B2 (ja) * | 2002-07-26 | 2007-11-07 | ザ・インクテック株式会社 | ニッケル系薄膜用エッチング液 |
US6884338B2 (en) * | 2002-12-16 | 2005-04-26 | 3M Innovative Properties Company | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
-
2007
- 2007-07-27 JP JP2007195594A patent/JP4897604B2/ja active Active
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