JP2009031584A - Organic el display and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL display and its manufacturing method that can stabilize electrical connection between a contact electrode layer and a second electrode layer by connecting the contact electrode layer and the second electrode layer directly even if an organic material forming a charge-injection layer is attached to a contact area. <P>SOLUTION: The organic EL display comprises an element substrate 2; a first electrode layer 14; the contact electrode layer 11 juxtaposed with a space to the first electrode layer 14; an insulator 19 formed from the end top of the first electrode layer 14 to the end top of the contact electrode layer 11; the charge-injection layer 15 formed from the top of a center area of the first electrode layer 14 to the end top of the contact electrode layer 11 through the top of the insulator 19; an organic luminescent layer 16 formed on the center area of the first electrode layer 14; and the second electrode layer 17 formed from the top of the organic luminescent layer 16 to the top of the contact electrode layer 11 through the top of the insulator 19 and directly connected to the contact electrode layer 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an organic EL display and a manufacturing method thereof.

  Organic EL displays have such characteristics as thinness, wide viewing angle, low power consumption, and excellent moving image display characteristics. Conventionally, organic EL displays are configured by arranging a plurality of organic EL elements in a matrix. It has been.

  Such an organic EL element includes a first electrode layer formed on the element substrate, an organic light emitting layer formed on the first electrode layer, and a second electrode layer formed on the organic light emitting layer. ing. In general, the organic light emitting layer is composed of a plurality of layers made of an organic material.

  The organic light emitting layer applies voltage to the first electrode layer and the second electrode layer, injects holes and electrons from the first electrode layer and the second electrode layer into the organic light emitting layer, and in the organic light emitting layer, As electrons recombine, part of the released energy excites the light emitting molecules in the organic light emitting layer. The organic light emitting layer emits energy by emitting energy when the excited light emitting molecules return to the ground state.

  In addition, the second electrode layer is disclosed as being electrically connected to a contact electrode layer formed with a gap from the first electrode layer (see Patent Document 1 below).

Further, as shown in FIG. 14, when the organic light emitting layer is formed, the contact electrode layer is masked so that a material different from both electrode layers is not deposited between the contact electrode layer and the second electrode layer. To be done. If a material different from both electrode layers is deposited between the two electrode layers, the electrical resistance increases between the two electrode layers, making it difficult for current to flow through the organic light emitting layer.
JP 2004-119210 A

  However, masking a fine contact electrode layer is difficult to align, and as the pixels become smaller, the contact electrode layer also becomes smaller, which makes it difficult to mask. Further, when the material constituting the organic light emitting layer is deposited, the organic material may be deposited so as to cover the surface of the contact electrode layer when the masking alignment is shifted. As a result, the electrical connection between the contact electrode layer and the second electrode layer may become unstable.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an organic EL display capable of stabilizing electrical connection between a contact electrode layer and a second electrode layer and a method for manufacturing the same. And

  In order to solve the above problems, an organic EL display according to the present invention includes an element substrate, a first electrode layer formed on the element substrate, and an element substrate formed between the first electrode layer and the first electrode layer. A contact electrode layer provided side by side; an insulator formed on an end portion of the first electrode layer to an end portion of the contact electrode layer; and on the insulator from a central region of the first electrode layer A charge injection layer formed over an end of the contact electrode layer through the organic electroluminescence layer formed on the charge injection layer and on a central region of the first electrode layer, and the organic light emission And a second electrode layer formed on the contact electrode layer through the insulator and directly connected to the contact electrode layer.

  In the organic EL display of the present invention, a gap is formed between the insulator and the contact electrode layer, and the gap is partially filled with the charge injection layer. .

  In the organic EL display of the present invention, the insulator is formed so as to surround a central region of the contact electrode layer, and the gap is formed along the central region of the contact electrode layer. It is characterized by.

  In addition, the method for manufacturing an organic EL display according to the present invention includes a step of preparing an element substrate having a first electrode layer and a contact electrode layer provided side by side with the first electrode layer; Forming an insulator from the end of the electrode layer to the end of the contact electrode layer; and a charge injection layer from the central region of the first electrode layer to the contact electrode layer through the insulator And a step of applying heat to the charge injection layer, melting and removing the charge injection layer on the contact electrode layer, and exposing the contact electrode layer. .

  In the organic EL display manufacturing method of the present invention, a gap is formed between the insulator and the contact electrode layer, and the charge injection layer deposited on the contact electrode layer is melted. The melt is poured into the gap between the insulator and the contact electrode layer.

  In the method for manufacturing an organic EL display according to the present invention, an intermediate layer made of molybdenum is formed between the contact electrode layer and the insulator, and the intermediate layer is etched after the insulator is formed. Thus, a gap is formed between the insulator and the contact electrode layer.

  According to the present invention, there is provided an organic EL display capable of forming a second electrode layer on a contact electrode layer with the upper surface of the contact electrode layer exposed, and stabilizing the electrical connection between them, and a method for manufacturing the same. Can be provided.

  The present invention will be described below with reference to the drawings.

  FIG. 1 is a top perspective view of an organic EL display 1 according to an embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view of a pixel of the organic EL display according to the embodiment of the present invention. FIG. 3 is an enlarged cross-sectional view of the organic EL element.

  As shown in FIG. 1, the organic EL display 1 is used for a home appliance such as a television, an electronic device such as a mobile phone or a computer device, and has a flat element substrate 2 as a substrate and an element substrate 2. A plurality of pixels 3 and a drive IC 4 that controls light emission of the pixels 3 are included.

  The element substrate 2 is made of, for example, glass or plastic, and a plurality of pixels 3 arranged in a matrix are formed in the display region D1 located in the center of the element substrate 2. A driving IC 4 is mounted on the non-display area D2 located at the end of the element substrate 2.

  As shown in FIG. 2, the pixel 3 includes a light emitting region R1 and a contact region R2, and an organic EL element 5 capable of emitting light is provided in the light emitting region R1. Each pixel 3 is partitioned by a partition wall 6. The pixel 3 can emit any one of red, green, and blue colors. This can determine the light emission color by selecting an organic material constituting the organic EL element 5 as will be described later.

  In addition, a sealing substrate 7 is formed on the element substrate 2 so as to face the element substrate 2. The sealing substrate 7 is made of a transparent substrate, and for example, glass or plastic can be used. Further, a sealing material 8 is formed in the display area D1 of the element substrate 2 so as to cover the display area D1, and a plurality of pixels 3 are formed by the element substrate 2, the partition wall 6, the sealing substrate 7, and the sealing material 8. Sealed. Note that the sealing material 8 can be made of, for example, a photocurable or thermosetting resin such as an acrylic resin, an epoxy resin, a urethane resin, or a silicon resin. Preferably, a photocurable epoxy resin that is cured by irradiation with ultraviolet rays is employed.

  Next, as shown in FIG. 3, various layers formed between the element substrate 2 and the sealing substrate 7 will be described.

  On the element substrate 2, a circuit layer 9 on which TFTs and electric wirings are formed, and an insulating layer 10 made of silicon nitride or the like for electrically insulating the circuit layer 9 from the outside are formed on the circuit layer 9. ing. A part of the circuit layer 9 and a contact electrode layer 11 to be described later are electrically connected. A planarizing film 12 is formed on the insulating layer 10 to reduce the unevenness of the circuit layer 9 and the insulating layer 10. For the planarizing film 12, an organic material having an insulating property such as a novolac resin, an acrylic resin, an epoxy resin, or a silicon resin can be used. The thickness of the planarizing film 12 is set to, for example, 2 μm or more and 5 μm or less.

  Further, a contact hole 13 penetrating the planarizing film 12 is formed in the planarizing film 12. The contact hole 13 is formed in a reverse taper shape in which the lower part is narrower than the upper part. Further, a contact electrode layer 11 made of a conductive material such as copper or aluminum is formed from the inner peripheral surface of the contact hole 13 to the upper surface of the planarizing film 12.

  Further, an organic EL element 5 is formed on the planarizing film 12.

  The organic EL element 5 includes a first electrode layer 14, a charge injection layer 15 formed on the first electrode layer 14, an organic light emitting layer 16 formed on the charge injection layer 15, and the organic light emitting layer 16. And the formed second electrode layer 17.

  Further, a protective layer 18 is formed on the display region D1 so as to cover the organic EL element 5. The protective layer 18 seals the organic EL element 5 and protects the organic EL element from moisture and outside air, and has a light-transmitting function, such as silicon nitride, silicon oxide, or silicon nitride carbide. Made of inorganic material. The thickness of the protective layer 18 is set to, for example, 100 nm or more and 5 μm or less.

  The first electrode layer 14 is formed on the planarizing film 12 and is provided side by side with the contact electrode layer 11. The first electrode layer 14 is made of a material having a high light reflectance such as a metal such as aluminum, silver, copper, gold, or rhodium, or an alloy thereof. In this way, by configuring the first electrode layer 14 from a material having a high light reflectance, the light extraction efficiency can be improved in the top emission type organic EL element 5. The thickness of the first electrode layer 14 is set to, for example, 50 nm or more and 500 nm or less.

  Further, the first electrode layer 14 is provided side by side with the contact electrode layer 11, and an insulator 19 is formed from the end portion of the first electrode layer 14 to the end portion of the contact electrode layer 11. In the insulator 19, a part of the end of the insulating layer 19 is interposed between the first electrode layer 14 and the second electrode layer 17 to prevent a short circuit therebetween. Note that the end portion of the first electrode layer 14 and the end portion of the contact electrode layer 11 refer to locations where at least part of the insulating layer 19 can be formed.

  In addition, a gap G is formed in the insulator 19 so as to be spaced from the contact electrode layer 11. The height of the gap G is set to, for example, 30 nm or more and 70 nm or less, and is further cut, for example, by 500 nm or more from the contact region R2 side toward the light emitting region R1 side. The insulator 19 is made of an organic insulating material such as phenol resin, acrylic resin or polyimide resin, or an inorganic insulating material such as silicon nitride.

  The insulator 19 is formed so as to surround the contact region R2, and the gap G formed in the insulator 19 is provided along the contact region R2. As a result, a sufficiently large region of the gap G can be secured, and as will be described later, most of the material constituting the charge injection layer 15 deposited on the contact electrode layer 11 can be caused to flow into the gap G. The contact electrode layer 11 can be effectively exposed.

  A partition wall 6 is formed on the insulator 19.

  The partition wall 6 is formed on the insulator 19 and is disposed so as to surround the pixel 3. The lower part of the partition wall 6 is narrower than the upper part, and is made of, for example, an organic insulating material such as phenol resin, acrylic resin, or polyimide resin.

  The charge injection layer 15 is formed from the central region of the first electrode layer 14 to the contact electrode layer 11 via the insulator 19. The charge injection layer 15 is provided without covering the entire top surface of the contact electrode layer 11. The central region of the first electrode layer 14 where the charge injection layer 15 is formed refers to a region where the organic light emitting layer 16 is formed.

  The charge injection layer 15 is formed of, for example, N, N′-bis (3-methylphenyl)-(1,1′-biphenyl) -4,4′-diamine (TPD), 4,4′-bis [N- ( Aromatic diamine compounds such as naphthyl) -N-phenyl-amino] biphenyl (α-NPD), oxazole, oxadiazole, triazole, imidazole, imidazolone, stilbene derivative, pyrazoline derivative, tetrahydroimidazole, polyarylalkane, butadiene, and Starburst aromatics and amine compounds such as 4,4 ′, 4 ″ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (m-MTDATA) can be used. The thickness of the charge injection layer 15 formed immediately above the electrode layer 14 is, for example, 10 nm or more and 50 nm or less. It has been set.

The organic light-emitting layer 16, for example CBP, can be used Alq ₃ or SDPVBi like luminescent resin or DCJTB to, coumarin, quinacridone, those containing an additive such as styrylamine or Perurin. Note that a transport layer such as α-NPD or TPD, and an injection layer such as nickel oxide, titanium oxide, fluorocarbon, or CuPc can be interposed between the organic light emitting layer 16 and the second electrode layer 17. .

  The second electrode layer 17 extends from the light-transmitting conductive material to the insulator 19 from the organic light emitting layer 16, and the extending portion is directly connected to the contact electrode layer 11. The second electrode layer 17 is made of, for example, a transparent electrode such as ITO or IZO, platinum, gold, nickel, silver, copper, or an alloy thereof.

  Below, the manufacturing method of the organic electroluminescent display 1 which concerns on embodiment of this invention is demonstrated in detail using FIGS. 4-8.

  First, the element substrate 2 having the circuit layer 9 and the insulating layer 10 on the upper surface is prepared. The circuit layer 9 and the insulating layer 10 are formed in a predetermined pattern by using a conventionally known thin film processing technique such as a CVD method, a sputtering method, or a photolithography method.

  Then, as shown in FIG. 4A, an organic resin film 12a is formed using, for example, a conventionally known spin coating method so as to cover the circuit layer 9 and the insulating layer 10. The organic resin film 12a becomes the planarizing film 12 after curing.

  Next, the organic resin film 12a is exposed on the organic resin film 12a by using an exposure mask, and further developed and baked to expose a part of the circuit layer 9 as shown in FIG. 4B. Then, the planarization film 12 having the contact hole 13 whose lower part is narrower than the upper part is formed. Then, as shown in FIG. 4C, a metal film 14a made of, for example, aluminum is formed. The metal film 14a becomes the first electrode layer 14 and the contact electrode layer 11 after patterning as will be described later.

  Further, as shown in FIG. 5A, the exposed metal film 14a is patterned by performing a conventionally known etching process to form the first electrode layer 14 and the contact electrode layer 11.

  Next, as shown in FIG. 5B, an organic insulating material that can become the insulator 19 is formed on the first electrode layer 14, the contact electrode layer 11, and the exposed planarizing film 12 by using, for example, a spin coating method. The organic insulating material layer 19a is formed by deposition. Further, as shown in FIG. 5C, a photomask M is disposed on the organic insulating material layer 19a so as to face each other. The photomask M covers the region immediately above the region that can become the insulator 19, and has openings M1 and M2 in regions corresponding to the light emitting region R1 and the contact region R2. The openings M1 and M2 are set such that the taper angle of M1 is set to be gentler than the taper angle of M2 in order to adjust the range in which the organic insulating material layer 19a is exposed.

  Then, as shown in FIG. 6A, the organic insulating material layer 19a is irradiated with light through a photomask M using an exposure apparatus. The region B irradiated with light is removed by development as described later. Then, as shown in FIG. 6B, the photomask M is removed from the organic insulating material layer 19a.

  Then, as shown in FIG. 6C, the region B of the organic insulating material layer 19a irradiated with light is penetrated to remove the region B. Since the contact region R2 has a steeper angle of light than the contact region R1, side etching is easily applied, and the insulator 19 having the gap G can be formed. The insulator 19 is formed to cover the outer periphery of the contact electrode layer 11 so that a part of the surface of the contact electrode layer 11 is exposed.

  In addition, as a method of manufacturing the insulator 19 having another gap G, for example, an intermediate layer made of molybdenum or a molybdenum alloy is formed on the contact electrode layer 11 in advance, and after the insulator 19 is formed, nitric acid, A mixed acid composed of acetic acid or phosphoric acid is infiltrated into the intermediate layer to etch the intermediate layer. Then, by selectively removing the intermediate layer, it is possible to form the gap G at the location where the intermediate layer was formed.

  Next, as shown in FIG. 7A, the partition wall 6 having a lower width than the upper portion is formed on the insulator 19 by using a conventionally known thin film processing technique. The partition wall 6 is formed so as to surround each pixel 3.

  Then, as shown in FIG. 7B, the charge injection layer 15 is formed on the entire display region D1, specifically, on the light emitting region R1 and the contact region R2 by using a conventionally known vapor deposition method. Then, as shown in FIG. 7C, the charge injection layer 15 is heated by applying heat at a temperature higher than the glass transition point of the material constituting the charge injection layer 15 and lower than the sublimation point. The layer 15 is melted, and the material constituting the charge injection layer 15 melted in the gap G is poured. In such a case, the material constituting the charge injection layer 15 deposited on the contact electrode layer 11 flows toward the gap G of the insulator 19 due to surface tension after melting. As a result, as shown in FIG. 14, when the charge injection layer 15 is formed, a part of the upper surface of the contact electrode layer 11 can be exposed without covering the contact region R2 with the mask m. The process can be simplified and productivity can be improved.

  Next, as shown in FIG. 8A, an organic light emitting layer 16 is formed on the charge injection layer 15 by using a conventionally known vapor deposition method. Further, as shown in FIG. 8B, a second electrode layer 17 is formed from the organic light emitting layer 16 to the contact electrode layer 11 by using a conventionally known vapor deposition method. Therefore, the contact electrode layer 11 whose upper surface is exposed and the second electrode layer 17 are directly connected to each other, and an impurity layer is not formed between the two. The electrical connection between the electrode layer 11 and the second electrode layer 17 can be stabilized.

  In this way, the organic EL element 5 can be formed. Further, as shown in FIG. 8C, a protective layer 18 is formed using a conventionally well-known thin film forming technique so as to cover the organic EL element 5. Then, the sealing substrate 7 is disposed opposite to the element substrate 2 on which the organic EL element is formed, and both are bonded via the sealing material 8. The operation of fixing the sealing substrate 7 to the element substrate 2 with the sealing material 8 is performed in an inert gas such as nitrogen gas or argon gas or in a high vacuum, for example, so that the element substrate 2 and the sealing substrate are fixed. It is possible to suppress oxygen and moisture from being contained between the two.

  And the organic EL display 1 can be manufactured by mounting the drive IC 4 in the non-display area D2.

  As described above, according to the embodiment of the present invention, when the gap 19 is provided in the insulator 19, the charge injection layer 15 is temporarily deposited on the light emitting region R 1. Even if the material constituting the charge injection layer 15 is deposited on the contact electrode layer 11, the material constituting the charge injection layer 15 deposited on the contact electrode layer 11 can be melted and allowed to flow into the gap G of the insulator 19. . As a result, the upper surface of the contact electrode layer 11 can be exposed, the second electrode layer 17 to be formed later can be directly connected to the contact electrode layer 11, and the electrical connection between them can be stabilized.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  As a second embodiment of the present invention, as shown in FIGS. 9 and 10, the insulator 19 may have a groove H cut out on the contact electrode layer side. The groove H can be formed by adjusting the etching pattern of the organic insulating material layer 19a by using a conventionally known thin film processing technique. When the groove H is formed, the charge injection layer 15 is deposited on the element substrate 2 using, for example, vapor deposition, and then heat is applied to the charge injection layer 15 deposited on the contact electrode layer 11. The material constituting the melted charge injection layer 15 is flowed to the groove H through the side surface of the insulator 19 by capillary action. As a result, the contact electrode layer 11 can be exposed and the contact electrode layer 11 and the second electrode layer 17 can be directly connected.

  Further, as a third embodiment of the present invention, as shown in FIG. 11, a recess 11a may be formed in the contact electrode layer 11 in the contact region R2. The recess 11a can be formed, for example, by forming a depression in the planarization film 12 corresponding to the contact region R2 in advance and forming the contact electrode layer 11 on the planarization film 12. The recess 11a is formed on the surface of the metal film 14a with respect to the surface of the metal film 14a corresponding to the contact region R2, for example, when the metal film 14a that can be the first electrode layer 14 and the contact electrode layer 11 is etched. It can also form by etching so that may become a recessed part and may become a recessed part. The concave portion 11a is a depression of the surface of the contact electrode layer 11, and the material constituting the molten charge injection layer 15 is accumulated in the concave portion 11a. As a result, the contact electrode layer 11 can be exposed and the contact electrode layer 11 and the second electrode layer 17 can be directly connected.

  Further, as a fourth embodiment of the present invention, as shown in FIG. 12, a convex portion 11b may be formed on the contact electrode layer 11 in the contact region R2. The convex portion 11b can be formed by adjusting the photomask M and exposing and developing so that a part of the organic insulating material layer 19a corresponding to the contact region R2 remains. When the charge injection layer 15 deposited on the contact region R2 is melted, the charge injection layer 15 can be agglomerated on the protrusions 11b, and the contact electrode layer 11 in the contact region R2 can be exposed. As a result, the second electrode layer 17 can be directly connected to the exposed contact electrode layer 11.

  Further, as a fifth embodiment of the present invention, as shown in FIG. 13, the insulator 19 x is an exposed region between the first electrode layer 14 and the contact electrode layer 11 from the end on the first electrode layer 14. It is formed over F and is provided to be spaced from the contact electrode layer 11. That is, the edge of the insulator 19x in the contact region R2 is provided with a space from the contact electrode layer 11. Therefore, since the upper surface of the planarizing film 12 in the contact region R2 is exposed, a material constituting the molten charge injection layer 15 can be poured into the exposed portion. Specifically, after the charge injection layer 15 is formed by being deposited over the light emitting region R1 and the contact region R2, the material constituting the charge injection layer 15 deposited on the contact electrode layer 11 in the contact region R2 is melted. And flow to the exposed area F. As a result, the upper surface of the contact electrode layer 11 can be exposed, and the contact electrode layer 11 and the second electrode layer 17 can be directly connected. The insulator 19x can be formed by exposing and developing the organic insulating material layer 19a by using a well-known photolithography technique so that a part of the upper surface of the planarizing film 12 in the contact region R2 is exposed. it can.

  Further, as a sixth embodiment of the present invention, as shown in FIG. 14, a recessed portion 20 is formed in the exposed region F in the fifth embodiment. After the charge injection layer 15 is deposited on the element substrate 2 by using, for example, a vapor deposition method, the charge injection layer 15 deposited on the contact electrode layer 11 is melted by applying heat to the melted charge injection layer 15. Is poured into the recess 20. Since the recess 20 is recessed further below the lower surface of the contact electrode layer 11, the material constituting the molten charge injection layer 15 can be concentrated in the recess 20. As a result, the contact electrode layer 11 can be exposed and the contact electrode layer 11 and the second electrode layer 17 can be directly connected. The recess 20 is formed by the following method. For example, when the organic insulating material layer 19a described above is developed with a developer, the upper surface of the planarizing film 12 is also developed, whereby the recess 20 can be formed in the exposed region F.

It is a top view of the organic electroluminescent display which concerns on embodiment of this invention. It is an enlarged plan view of a pixel according to an embodiment of the present invention. It is an expanded sectional view of the organic EL element concerning the embodiment of the present invention. It is sectional drawing of the pixel explaining the manufacturing process of the organic electroluminescent display which concerns on embodiment of this invention. It is sectional drawing of the pixel explaining the manufacturing process of the organic electroluminescent display which concerns on embodiment of this invention. It is sectional drawing of the pixel explaining the manufacturing process of the organic electroluminescent display which concerns on embodiment of this invention. It is sectional drawing of the pixel explaining the manufacturing process of the organic electroluminescent display which concerns on embodiment of this invention. It is sectional drawing of the pixel explaining the manufacturing process of the organic electroluminescent display which concerns on embodiment of this invention. It is an expanded sectional view of the organic EL element concerning a 2nd embodiment of the present invention. It is a top view of the organic EL element which concerns on the 2nd Embodiment of this invention. It is an expanded sectional view of the organic EL element concerning a 3rd embodiment of the present invention. It is an expanded sectional view of the organic EL element concerning a 4th embodiment of the present invention. It is an expanded sectional view of the organic EL element concerning a 5th embodiment of the present invention. It is an expanded sectional view of the organic EL element concerning a 6th embodiment of the present invention. It is a top view which shows the state which coat | covered the contact area | region with the mask.

Explanation of symbols

1 Organic EL Display 2 Element Substrate 3 Pixel 4 Drive IC
DESCRIPTION OF SYMBOLS 5 Organic EL element 6 Partition 7 Sealing substrate 8 Sealing material 9 Circuit layer 10 Insulating layer 11 Contact electrode layer 12 Planarization film 13 Contact hole 14 1st electrode layer 15 Charge injection layer 16 Organic light emitting layer 17 2nd electrode layer 18 Protection Layer 19 Insulator 20 Recess D1 Display area D2 Non-display area R1 Light emitting area R2 Contact area F Exposed area G Gap

Claims (6)

An element substrate;
A first electrode layer formed on the element substrate;
A contact electrode layer formed on the element substrate and provided side by side with the first electrode layer;
An insulator formed from an end of the first electrode layer to an end of the contact electrode layer;
A charge injection layer formed from a central region of the first electrode layer to an end of the contact electrode layer via the insulator;
An organic light emitting layer formed on the charge injection layer and on a central region of the first electrode layer;
A second electrode layer formed on the organic light emitting layer over the insulator over the contact electrode layer and directly connected to the contact electrode layer;
An organic EL display comprising: The organic EL display according to claim 1,
A gap is formed between the insulator and the contact electrode layer,
An organic EL display, wherein the gap is partially filled with the charge injection layer. The organic EL display according to claim 1 or 2,
The insulator is formed so as to surround a central region of the contact electrode layer,
The organic EL display, wherein the gap is formed along a central region of the contact electrode layer. Preparing a substrate having a first electrode layer and a contact electrode layer provided to be spaced apart from the first electrode layer;
Forming an insulator from the end of the first electrode layer to the end of the contact electrode layer;
Forming a charge injection layer from a central region of the first electrode layer over the insulator over the contact electrode layer;
Applying heat to the charge injection layer, melting and removing the charge injection layer on the contact electrode layer, exposing the contact electrode layer;
A method for producing an organic EL display, comprising: In the manufacturing method of the organic electroluminescent display of Claim 4,
A gap is formed between the insulator and the contact electrode layer,
A method for producing an organic EL display, comprising melting the charge injection layer deposited on the contact electrode layer and pouring the melt into the gap between the insulator and the contact electrode layer. In the manufacturing method of the organic electroluminescent display of Claim 4 or Claim 5,
An intermediate layer made of molybdenum is formed between the contact electrode layer and the insulator,
After forming the insulator, the intermediate layer is etched and removed, thereby forming a gap between the insulator and the contact electrode layer.

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