JP2009266590A - Method of manufacturing organic electroluminescent panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an organic EL panel 2, which can improve a sealing property of an organic EL element 9. <P>SOLUTION: The method of manufacturing an organic EL panel 2 includes a step of preparing a base body equipped with an element substrate 4 of which in a central region an organic EL element 9 is arranged, a sealing base plate 8 arranged to face the element substrate 4, an adhesive agent 6 which is positioned between the element substrate 4 and the sealing base plate 8 and provides a gap G in a tip portion of the organic EL element 9 and pastes the element substrate 4 with the sealing base plate 8, a step in which a sealing material 7 is enclosed between the element substrate 4 and the sealing base plate 8 in a decompressed atmosphere, and a step in which the sealing material 7 is cured and seals the organic EL element 9 by the element substrate 4, the sealing base plate 8 and the sealing material 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an organic EL panel.

  In recent years, an organic EL panel having an organic EL (Electroluminescence) element has been developed. An organic EL panel has an organic EL element provided between a pair of substrates (see Patent Document 1).

  The organic EL panel is manufactured by bonding a pair of substrates through an adhesive.

A technique has been proposed in which the adhesive is attached to the entire surface of the substrate or the periphery of the substrate, and the substrates are bonded together (see Patent Documents 2 and 3).
Japanese Patent Laid-Open No. 5-89959 JP 2007-200743 A Japanese Patent No. 3903204

  However, at the time of mass production, a pair of mother substrates is divided into a plurality of parts to produce an organic EL panel. Therefore, if an adhesive is provided at the cutting position when the mother substrate is cut, the mother substrates are smoothly divided into a plurality of substrates. It cannot be divided into individual pieces, which may affect the sealing performance of the organic EL element.

  This invention is made | formed in view of the subject mentioned above, Comprising: It aims at providing the manufacturing method of the organic electroluminescent panel which can improve the sealing performance of an organic electroluminescent element.

  In order to solve the above-described problems, an organic EL panel manufacturing method of the present invention includes an element substrate in which an organic EL element is provided in a central region, a sealing substrate opposed to the element substrate, the element substrate, and the element substrate. A step of providing a base including a gap between the sealing substrate and an end of the organic EL element, and an adhesive for bonding the element substrate and the sealing substrate; and the element substrate Filling the gap between the sealing substrate and the sealing material in a reduced-pressure atmosphere, curing the sealing material, and the organic EL element to the element substrate, the sealing substrate, and And a step of sealing with the sealing material.

  In the method of manufacturing an organic EL panel of the present invention, in the step of filling the gap with the sealing material, the sealing material is applied to an end surface of the sealing substrate, and the base is provided in a reduced-pressure atmosphere. Then, the sealing material enters from the end surface of the sealing substrate to the end surface of the adhesive, and the gap is filled with the sealing material.

  In the organic EL panel manufacturing method of the present invention, the gap between the element substrate and the sealing substrate is provided so as to surround the adhesive covering the organic EL element. In the step of filling the sealing material, the sealing material applied to one end of the sealing substrate enters along the outer periphery of the adhesive material in a reduced pressure atmosphere and surrounds the outer periphery of the adhesive material It is characterized by that.

  Moreover, the manufacturing method of the organic EL panel of the present invention is characterized in that, in the step of curing the sealing material, the sealing material is cured by irradiating the sealing material with ultraviolet rays.

  Further, in the method of manufacturing the organic EL panel of the present invention, in the step of curing the sealing material, the sealing material is cured and contracted more than the adhesive material, thereby bonding the element substrate and the sealing substrate. It is characterized by that.

  In the method for manufacturing an organic EL panel according to the present invention, the adhesive is made of an epoxy resin, and the sealing material is made of solder.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the organic electroluminescent panel which can improve sealing performance can be provided.

  Hereinafter, an organic EL display including an organic EL panel according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an organic EL display. FIG. 2 is a plan view of the mother substrate before being divided into a plurality of organic EL panels. FIG. 3 is a plan view showing a state in which a large number of pixels included in the organic EL panel are arranged in a matrix. 4A is a cross-sectional view of a pixel, and FIG. 4B is a simplified cross-sectional view of an organic EL element included in the pixel. FIG. 5 is a cross-sectional view showing the end of the element substrate and the sealing substrate on the side where the driving IC is mounted.

  As shown in FIG. 1, the organic EL display 1 is used for home appliances such as a television, electronic equipment such as a mobile phone or a computer device, and includes an organic EL panel 2 and a driving IC 3 mounted on the organic EL panel 2. Is included. The organic EL panel 2 includes a flat element substrate 4, a plurality of pixels 5 formed on the element substrate 4, and an adhesive 6 and a sealing material 7 so as to seal the pixels 5. And a sealing substrate 8 formed on the substrate 4.

  The element substrate 4 is made of, for example, glass or plastic, and a plurality of pixels 5 arranged in a matrix are formed in a display area D1 as a central area located at the center of the element substrate 4. A driving IC 3 is mounted on a non-display area D2 that is an end of the element substrate 4 and is positioned at one end of the display area D1.

  As shown in FIG. 4A, the pixel 5 includes a light emitting region R1 and a contact region R2, and an organic EL element 9 capable of emitting light is provided in the light emitting region R1. Each pixel 5 is partitioned by a partition wall 10. Further, the pixel 5 can determine the color to emit light by selecting an organic material constituting the organic EL element 9.

  In addition, a sealing substrate 8 is formed on the element substrate 4 so as to face the element substrate 4. The sealing substrate 8 is made of a transparent substrate, and for example, glass or plastic can be used.

  Next, as shown in FIGS. 4A and 4B, various layers formed between the element substrate 4 and the sealing substrate 8 will be described.

  On the element substrate 4, a circuit layer 11 on which TFTs or electric wirings are formed, and an insulating layer 12 made of silicon nitride or the like for electrically insulating the circuit layer 11 from the outside are formed on the circuit layer 11. ing. A part of the circuit layer 11 and a contact electrode layer 13 to be described later are electrically connected. A planarizing film 14 is formed on the insulating layer 12 to reduce unevenness of the circuit layer 11 and the insulating layer 12. Since the circuit layer 11 is a patterned structure, the surface thereof is uneven, and it is difficult to provide the organic EL element 9 flat on the circuit layer 11 unless the surface of the circuit layer 11 is flattened. . As a result, it is difficult to control the thickness of each layer constituting the organic EL element 9, and the organic EL element 9 cannot emit light of a desired color. This is because the color of light emitted from the organic EL element 9 depends on the thickness of each layer constituting the organic EL element 9. Therefore, by forming the planarizing film 14 on the circuit layer 11, the thickness of the organic EL element 9 formed on the circuit layer 11 can be easily controlled. The planarizing film 14 may be made of an insulating organic material such as a novolac resin, an acrylic resin, an epoxy resin, or a silicon resin. The thickness of the planarizing film 14 is set to 2 μm or more and 5 μm or less, for example.

  Further, a contact hole S penetrating the planarizing film 14 is formed in the planarizing film 14. The contact hole S is formed so that the lower part is narrower than the upper part. Further, a contact electrode layer 13 made of a metal such as aluminum, silver, copper, gold, rhodium or neodymium, or an alloy thereof is formed from the inner peripheral surface of the contact hole S to the upper surface of the planarizing film 14.

  Further, an organic EL element 9 is formed on the planarizing film 14. The organic EL element 9 includes a first electrode layer 15, an organic EL layer 16, and a second electrode layer 17.

  Further, an insulator 18 is formed so as to surround the light emitting region R1 and the contact region R2. A part of the insulator 18 is formed between the first electrode layer 15 and the contact electrode layer 13. The insulator 18 prevents the first electrode layer 15 and the second electrode layer 17 from being short-circuited. The insulator 18 is made of an organic insulating material such as phenol resin, acrylic resin, or polyimide resin, or an inorganic insulating material such as silicon nitride, silicon oxide, or silicon oxynitride.

  Further, a protective layer 19 is formed on the display region D1 so as to cover the organic EL element 9. The protective layer 19 seals the organic EL element 9 and protects the organic EL element from moisture or outside air, and has a light-transmitting function, such as silicon nitride, silicon oxide, or silicon nitride carbide. Made of inorganic material. The thickness of the protective layer 19 is set to, for example, 100 nm or more and 5 μm or less.

  Next, each layer constituting the organic EL element 9 will be described.

  The first electrode layer 15 is formed on the planarization film 14 and is provided side by side with the contact electrode layer 13. The first electrode layer 15 is made of a material having a high light reflectivity such as a metal such as aluminum, silver, copper, gold, rhodium or neodymium, or an alloy thereof. In this manner, by configuring the first electrode layer 15 from a material having a high light reflectance, the light extraction efficiency can be improved in the top emission type organic EL element 9. The thickness of the first electrode layer 15 is set to, for example, 50 nm or more and 500 nm or less.

  The organic EL layer 16 is formed on the first electrode layer 15. As shown in FIG. 4B, the organic EL layer 16 is composed of a plurality of layers. From the lower layer, the hole injection layer 16a, the hole transport layer 16b, the organic light emitting layer 16c, the electron transport layer 16d, and the electron injection layer 16e. It is comprised including.

  The hole injection layer 16a is made of, for example, α-NPD, TPD, nickel oxide, titanium oxide, fluorocarbon, or CuPc. The thickness of the hole injection layer 16a is set to, for example, 5 nm or more and 40 nm or less.

  Further, the hole transport layer 16b is formed of, for example, N, N′-bis (3-methylphenyl)-(1,1′-biphenyl) -4,4′-diamine (TPD), 4,4′-bis [N Aromatic diamine compounds such as-(naphthyl) -N-phenyl-amino] biphenyl (α-NPD), oxazole, oxadiazole, triazole, imidazole, imidazolone, stilbene derivative, pyrazoline derivative, tetrahydroimidazole, polyarylalkane, butadiene , And 4,4 ′, 4 ″ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (m-MTDATA) or other starburst aromatic or aromatic amine compounds can be used. In addition, the hole transport layer 16b is made of 1,4,5,8,9,12-hexaazatriphenylene or it Can be used a heterocyclic compound such as derivatives such as cyano groups attached. The thickness of the hole transport layer 16b is set to, for example, 10nm or 50nm or less.

The organic light-emitting layer 16c, if that emits red light, for example CBP, Alq ₃ or a host material such SDPVBi or DCJTB these host materials, coumarin, quinacridone, perinone derivatives having phenanthrene group, oligothiophene derivatives or What contains dopant materials, such as a perylene derivative, can be used. Further, when emitting green light, for example, host materials such as CBP, Alq ₃ or SDPVBi, or styrylamine, perlin, silole derivatives having a benzene ring in these host materials, perinone derivatives having a phenanthrene group, oligothiophene derivatives, A material containing a dopant material such as a perylene derivative or an azomethine zinc complex can be used. Further, when emitting blue light, for example, a host material such as CBP or SDPVBi, or a styrylamine, perlin, cyclopentadiene derivative, tetraphenylbutadiene, a compound having a triphenylamine structure and a vinyl group bonded to these host materials, A material containing a dopant material such as an oxadiazole derivative, a pyrazoloquinoline derivative, a distyrylarylene derivative, or a silole derivative having a benzene ring can be used. The thickness of the organic light emitting layer 16c is set to 20 nm or more and 40 nm or less, for example.

The electron transport layer 16d is formed of, for example, tris (8-quinolinolato) aluminum (Alq ₃ ), N, N′-bis (3-methylphenyl)-(1,1′-biphenyl) -4,4′-diamine ( TPD), or aromatic diamine compounds such as 4,4′-bis [N- (naphthyl) -N-phenyl-amino] biphenyl (α-NPD), oxazole, oxadiazole, triazole, imidazole, imidazolone, stilbene derivatives , Pyrazoline derivatives, tetrahydroimidazole, polyarylalkane, butadiene, or starburst aroma such as 4,4 ′, 4 ″ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (m-MTDATA) A thickness of the electron transport layer 16d is, for example, 20 nm or more. It is set to 60 nm or less.

  Further, for example, lithium fluoride, cesium fluoride, carbon fluoride, or the like can be used for the electron injection layer 16e. The thickness of the electron injection layer 16e is set to 0.5 nm or more and 2 nm or less, for example.

  The second electrode layer 17 is formed from the organic EL layer 16 to the insulating oxide film 16. The second electrode layer 17 is made of a material that can transmit light emitted from the organic EL layer 16, and uses a light-transmitting conductive material such as an indium tin oxide film (ITO) or a tin oxide film. Formed. The second electrode layer 17 can be made of, for example, a material such as magnesium, silver, aluminum, or calcium. By setting the thickness to 30 nm or less, a light transmissive electrode can be obtained. As a result, the light emitted from the organic EL layer 16 passes through the second electrode layer 17 and is emitted from the organic EL element 9 to the outside.

  A partition 10 is formed on the insulator 18 so as to surround the pixel 5. The partition 10 is narrower at the lower part than at the upper part, and is made of an organic insulating material such as phenol resin, acrylic resin, or polyimide resin. In addition, the thickness of the partition 10 is set to 2 μm or more and 5 μm or less, for example.

  Next, the adhesive 6 that bonds the element substrate 4 and the sealing substrate 8 will be described. The adhesive 6 covers the entire display area D1 of the element substrate 4 and is formed on each pixel 5. The adhesive 6 is formed between the element substrate 4 and the sealing substrate 8 up to the end of the pixel arranged on the outermost periphery. However, there is a region where the adhesive 6 is not formed from the end surfaces of the element substrate 4 and the sealing substrate 8 toward the display region D1.

  The adhesive 6 is made of a material having excellent light transmittance so that the light emitted from the organic EL element 9 is extracted to the outside. For example, the adhesive 6 is a photocurable material such as an acrylic resin, an epoxy resin, a urethane resin, or a silicon resin. Alternatively, a thermosetting resin can be used. Preferably, a photocurable epoxy resin that is cured by irradiation with ultraviolet rays is employed. Because the adhesive is placed directly on the organic EL element, it is necessary to apply and adhere in a low oxygen concentration / low moisture environment. Therefore, it is difficult to increase the frequency of maintenance of the application device, etc., and the pot life is short. This is because productivity can be greatly improved as compared with the thermosetting type. However, for applications where importance is placed on contrast, a black matrix is placed between the pixels in the light emitting area, so that UV light can be cured sufficiently even under insufficient irradiation of UV light under the black matrix. It is more preferable to use a curable resin.

  FIG. 5 is a cross-sectional view of the organic EL panel on the side where the drive IC 3 is mounted, which is an end of the element substrate 4 and the sealing substrate 8. The driving IC 3 is mounted on the mounting unit 20.

  As shown in FIG. 5, the sealing material 7 is formed from the end surface of the sealing substrate 8 to the surface of the adhesive 6 formed between the element substrate 4 and the sealing substrate 8. That is, the sealing material 7 is filled in a region between the element substrate 4 and the sealing substrate 8 where the adhesive 6 is not formed.

  The sealing material 7 is made of a material having an excellent sealing function that prevents oxygen or moisture in the atmosphere from entering the pixel 5 covered with the adhesive 6 and deteriorating the organic EL element 9. For example, a thermosetting resin such as an epoxy adhesive, low melting glass, low melting solder or the like can be used. The organic EL element 9 is sealed from the atmosphere by the element substrate 4, the sealing substrate 8, the adhesive 6 and the sealing material 7.

  As described above, according to the organic EL panel according to the present embodiment, the light emitted from the organic EL element 9 is efficiently taken out to the outside by the adhesive 6 having excellent light transmittance, and the sealing having excellent sealing property is performed. The material 7 can effectively prevent oxygen or moisture from entering the pixel from the atmosphere.

  Below, the manufacturing method of the organic electroluminescent display 1 containing the organic electroluminescent panel 2 which concerns on embodiment of this invention is demonstrated in detail using FIG. 6 (A) to FIG. 6A to 9A is described using a cross section of one pixel. In either case, the element substrate 4 and the sealing substrate 8 are organic EL. This is a state before the panel 2 is cut.

  As shown in FIG. 6A, an element substrate 4 in which a circuit layer 11, an insulating layer 12, and a planarizing film 14 are stacked on top is prepared. The circuit layer 11 and the insulating layer 12 are formed in a predetermined pattern by using a conventionally known thin film forming technique such as a CVD method, a vapor deposition method or a sputtering method, or a thin film processing technique such as an etching method or a photolithography method. Further, the planarizing film 14 is formed on the insulating layer 12 by using, for example, a conventionally known spin coating method.

  Next, the planarizing film 14 is exposed on the planarizing film 14 using an exposure mask, and further developed and baked to expose a part of the circuit layer 11 as shown in FIG. 6B. Then, a planarizing film 14 having a contact hole S whose lower part is narrower than the upper part is formed. Further, a metal film made of, for example, aluminum is formed on the planarizing film 14 in which the contact holes S are formed. Then, as shown in FIG. 6C, the metal film is patterned to form the first electrode layer 15 and the contact electrode layer 13.

  Next, an organic insulating material layer made of, for example, an acrylic resin is formed on the first electrode layer 15, the contact electrode layer 13, and the partially exposed planarizing film 14 by using, for example, a spin coating method. Then, the organic insulating material layer is patterned with respect to the organic insulating material layer using a photolithography method, so that the insulator 18 is formed as shown in FIG.

  Next, as shown in FIG. 7B, a partition wall 10 having a lower width than the upper portion is formed on the insulator 18 by using a well-known photolithography method. The partition wall 10 is formed so as to surround each pixel 5. Then, as shown in FIG. 7C, the organic EL layer 16 is formed in the light emitting region R1 using a vapor deposition method. Note that the color emitted by each pixel can be determined by selecting a material constituting the organic EL layer 16.

  Further, as shown in FIG. 8A, the second electrode layer 17 is formed from the organic EL layer 16 to the contact electrode layer 13 by using a conventionally known vapor deposition method. Therefore, the contact electrode layer 13 whose upper surface is exposed and the second electrode layer 17 can be directly connected. In this way, the organic EL element 9 can be formed.

  Then, as shown in FIG. 8B, a protective layer 19 is formed on the entire surface of the display region D1 using a conventionally known thin film forming technique so as to cover the organic EL element 9.

  Next, as shown in FIG. 9A, the sealing substrate 8 is disposed opposite to the element substrate 4 on which the organic EL element 9 is formed, and both the substrates are bonded via the adhesive 6. Note that the adhesive 6 is attached to a portion corresponding to the display region D1 of each organic EL panel 2 by a screen printing method or the like when the sealing substrate 8 is disposed opposite to the element substrate 4. The formation accuracy of the screen printing method is about several tens of um, and can be controlled within 100 um from the display area D1, and it is possible to prevent adhesion of the adhesive to the cut portion as will be described later. . As the adhesive 6, a UV curable adhesive is used.

  Here, FIG. 9B will be described. The element substrate 4 and the sealing substrate 8 are cut for each organic EL panel 2, and FIG. 9B is a cross-sectional view of a portion to be cut.

  As shown in FIG. 9B, the amount of the adhesive 6 is prevented from adhering to the adhesive substrate 6 before the element substrate 4 and the sealing substrate 8 are bonded to each other at the location where the organic EL panel 2 is cut. Has been adjusted.

  Then, as shown in FIG. 10A, the element substrate 4 and the sealing substrate 8 are bonded to each other with the adhesive 6, and the adhesive 6 is irradiated with UV light and cured. In addition, P1 and P2 have shown the location which cut | disconnects both board | substrates.

  Further, after the adhesive 6 is cured and both the substrates are fixed, the cut portions P1 and P2 are cut by a glass scriber or a divider, and the mother substrate is divided for each organic EL panel 2. When both substrates are cut with a glass breaker, the adhesive 6 is not formed immediately above and below the cut points P1 and P2, and compared with the case where the adhesive 6 is present at the cut point. The rigidity is small, and the sealing substrate and the element substrate are sufficiently bent by the pressing by the glass divider, so that cracks from the glass scribe portion grow smoothly in both substrates, and both substrates are easily cut. In addition, when the adhesive 6 is provided with a sealing function, the adhesive is designed to be disposed in an area where there is no adhesion to the substrate cutting portion. In the present embodiment, it is possible to eliminate the example of the occurrence of defective cutting due to irregularity of glass stress depending on the presence or absence of deposition.

  Then, as shown in FIG. 10B, the cut portions P1 and P2 are cut, and the organic EL panel 2 is cut out. FIG. 10B is a cross-sectional view showing one end of the organic EL panel on which the mounting portion 20 for mounting the driving IC 3 is formed.

  Next, after cutting for each organic EL panel 2, in order to remove a part of the sealing substrate 8 on the mounting portion 20 on which the driving IC 3 is mounted, the cutting portion P3 of the sealing substrate 8 is cut, and FIG. As shown in A), between the element substrate 4 provided with the organic EL element 9 in the central region, the sealing substrate 8 opposed to the element substrate 4, and the element substrate 4 and the sealing substrate 8. A base having the gap G at the end of the organic EL element 9 and the adhesive 6 that covers the organic EL element 9 and bonds the element substrate 4 and the sealing substrate 8 together can be prepared. The gap G is provided so as to surround the adhesive 6 that covers the organic EL element 9. The gap G is such that the distance between the element substrate 4 and the sealing substrate 8 is 2 μm or more and 20 μm or less.

  Then, the gap G between the element substrate 4 and the sealing substrate 8 is filled with a sealing material 7 made of solder in a reduced pressure atmosphere. Here, the reduced pressure atmosphere refers to an atmospheric pressure of 10000 Pa or less in an inert gas such as nitrogen gas or argon gas or in a high vacuum. First, the sealing material 7 is attached to the end face of the prepared substrate and put into the decompression chamber. The pressure in the decompression chamber is adjusted, the air is removed in the gap G by placing the decompression chamber in a decompressed atmosphere, and the sealing material 7 enters from the end surface of the sealing substrate 8 to the end surface of the adhesive material 6 by capillary action. Then, the gap G is filled with the sealing material 7. Moreover, if the sealing material 7 is applied only to at least one end of the substrate, the sealing material 7 enters from the applied portion along the outer periphery of the adhesive material 6 in a reduced-pressure atmosphere, The outer periphery of the adhesive material 6 can be surrounded. The operation of fixing the sealing substrate 8 to the element substrate 4 with the sealing material 7 is performed, for example, in an inert gas such as nitrogen gas or argon gas or in a high vacuum, thereby sealing the element substrate 4 with the element substrate 4. Oxygen or moisture can be suppressed from being contained between the substrate 8 and the substrate 8.

  Next, the sealing material 7 is cured, and the display region D <b> 1 including the organic EL element 9 is sealed with the element substrate 4, the sealing substrate 8, and the sealing material 7. The uncured sealing material 7 is cured by being heated. In the step of curing the sealing material 7, the sealing material 7 cures and shrinks more than the adhesive, so that the element substrate 4 and the sealing substrate 8 can be bonded, without being bound by the adhesive strength of the adhesive 6, The degree of freedom in selecting the material of the adhesive 6 can be ensured. Further, the distance between the element substrate 4 and the sealing substrate 8 is shortened by strengthening and shrinking the sealing material 7, and oxygen or moisture is prevented from entering the pixel 5 from the atmosphere. can do.

  In this way, the organic EL panel 2 can be produced. Then, by mounting the drive IC 3 on the non-display area D2 of the organic EL panel 2, the organic EL display 1 can be manufactured.

  In addition, in this case, the driving IC can be mounted first. When the drive IC is mounted last as in the prior art, it is necessary to consider that the sealing material does not extend to the drive IC mounting portion, which severely limits the control of the coating amount. In this embodiment, application of the sealing material under reduced pressure can be performed after mounting the IC. At that time, even if the sealing material extends to the portion where the IC is mounted, there is no problem in performance. . Further, in order to reinforce the mounting strength of the IC mounting portion, generally, resin is applied from the upper portion of the mounting portion, but the sealing material of this embodiment can also serve as this.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

1 is a plan view of an organic EL display including an organic EL panel according to an embodiment of the present invention. It is a top view of the mother board | substrate which shows the state before dividing | segmenting into an organic electroluminescent panel. It is a top view of the pixel arranged in the matrix form. 4A is a cross-sectional view of one pixel, and FIG. 4B is a simplified cross-sectional view of an organic EL element. FIG. 6 is a cross-sectional view showing the end of the element substrate and the sealing substrate on the side where the driving IC is mounted. 6 (A), 6 (B), and 6 (C) are cross-sectional views of a pixel for explaining a manufacturing process of an organic display including an organic EL panel according to an embodiment of the present invention. FIG. 7A, FIG. 7B, and FIG. 7C are cross-sectional views of a pixel for explaining a manufacturing process of an organic display including an organic EL panel according to an embodiment of the present invention. FIG. 8A and FIG. 8B are cross-sectional views of a pixel for explaining a manufacturing process of an organic display including an organic EL panel according to an embodiment of the present invention. 9A is a cross-sectional view of the element substrate and the sealing substrate showing a state before the element substrate and the sealing substrate are bonded to each other. FIG. 9B is a cross-sectional view of the element substrate and the sealing substrate. It is sectional drawing of the element substrate and sealing substrate which show the state before bonding both substrates. FIG. 10A is a cross-sectional view of both the substrates showing the cut portions of the element substrate and the sealing substrate, and FIG. 10B is an end view of both substrates showing the state after the element substrate and the sealing substrate are cut. It is sectional drawing of a part. FIG. 11A is a cross-sectional view of the element substrate and the end portion of the sealing substrate showing a state after one end of the sealing substrate is cut, and FIG. 11B is sealed at the end portion of the sealing substrate. It is sectional drawing of the edge part of the element substrate and sealing substrate which shows the state which apply | coated the material.

Explanation of symbols

1 Organic EL Display 2 Organic EL Panel 3 Drive IC
DESCRIPTION OF SYMBOLS 4 Element substrate 5 Pixel 6 Adhesive material 7 Sealing material 8 Sealing substrate 9 Organic EL element 10 Partition 11 Circuit layer 12 Insulating layer 13 Contact electrode layer 14 Planarization film 15 1st electrode layer 16 Organic EL layer 17 2nd electrode layer 18 Insulator 19 Protective layer 20 Mounting part D1 Display area D2 Non-display area R1 Light emitting area R2 Contact area S Contact hole M Mother board

Claims (6)

An element substrate provided with an organic EL element in a central region, a sealing substrate facing the element substrate, and a gap between the element substrate and the sealing substrate and at an end of the organic EL element Providing a base comprising: an adhesive that bonds the element substrate and the sealing substrate together; and
Filling the gap between the element substrate and the sealing substrate with a sealing material in a reduced pressure atmosphere;
Curing the sealing material and sealing the organic EL element with the element substrate, the sealing substrate and the sealing material;
A method for producing an organic EL panel, comprising: In the manufacturing method of the organic electroluminescent panel of Claim 1,
In the step of filling the gap with the sealing material, the sealing material is applied to an end surface of the sealing substrate, and the base is provided in a reduced-pressure atmosphere so that the sealing material is an end surface of the sealing substrate. To the end surface of the adhesive material, and the sealing material is filled in the gap. In the manufacturing method of the organic electroluminescent panel of Claim 2,
The gap between the element substrate and the sealing substrate is provided so as to surround the adhesive covering the organic EL element,
In the step of filling the gap with the sealing material, the sealing material applied to one end of the sealing substrate enters along the outer periphery of the adhesive material in a reduced-pressure atmosphere, and the outer periphery of the adhesive material A method for manufacturing an organic EL panel, characterized in that In the manufacturing method of the organic electroluminescent panel of Claim 1,
In the step of curing the sealing material, the sealing material is cured by irradiating the sealing material with ultraviolet rays. In the manufacturing method of the organic electroluminescent panel of Claim 1,
In the step of curing the encapsulating material, the element substrate and the encapsulating substrate are adhered to each other when the encapsulating material cures and shrinks more than the adhesive material. In the manufacturing method of the organic electroluminescent panel of Claim 1,
The method for manufacturing an organic EL panel, wherein the adhesive material is made of an epoxy resin, and the sealing material is made of solder.

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