JP2009029926A - Resin composition for sealing photo-semiconductor, and photo-semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing a photo-semiconductor capable of ensuring high light-hiding property hardly receiving an influence of a disturbance light, not using an environmental pollutant such as a bromo compound and antimony trioxide, having higher flame-resistant property than conventional ones and ensuring high flame-resistant property even in a molded article of thin thickness. <P>SOLUTION: The resin composition for sealing the photo-semiconductor contains an epoxy resin, a curing agent, titania, a metal hydroxide, and the other inorganic filler other than titania and the metal hydroxide as indispensable components. The epoxy resin having a dicyclopentadiene skeleton is contained in a range of 20-40 wt.% relative to the whole amount of the epoxy resin. A content of titania is in a range of 18-20 wt.% relative to the whole amount of the composition. The metal hydroxide contains both of magnesium hydroxide and aluminum hydroxide, and the content of the metal hydroxide is in a range of 15-18 wt.% relative to the whole amount of the composition. The content of the other inorganic filler is in a range of 45-50 wt.% relative to the whole amount of the composition. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical semiconductor sealing resin composition used for sealing optical semiconductor elements such as LEDs, photoisolators, phototransistors, photodiodes, CCDs, CMOSs, EPROMs, and light produced using the same. The present invention relates to a semiconductor device.

  Conventionally, resin sealing with an epoxy resin composition has been performed as a semiconductor sealing material from the viewpoint of excellent adhesion, moisture resistance, electrical insulation, heat resistance, and the like. Among them, the resin sealing by transfer molding with the epoxy resin composition is excellent in terms of workability and mass productivity.

  In addition, as a molding method, a conventional method using a large tablet and transfer molding of a large number of semiconductor devices in one molding, or a multi-blanger method using a mini tablet for the purpose of pursuing resin utilization efficiency. In addition, a molding method that uses a powdered resin composition and is molded in a stick shape in a molding machine in advance and inserted into a mold and is transfer molded has been introduced. .

  On the other hand, on a semiconductor circuit board, an optical semiconductor device that is optically insulated and optically connected is mounted like an optical semiconductor device such as a photocoupler or a photoisolator. Thereby, it is possible to achieve response connection by light without being affected by electrical noise.

  Also, in order to reduce the cost of the optical semiconductor device, a conventional type called a facing type, that is, two lead frames are faced to each other and bonded together, and a highly light transmissive material and a light blocking material are respectively molded. It can be assembled from a type (double mold) to a type called a reflection type, that is, it can be assembled with a single lead frame, has high internal light reflection efficiency, and has a light shielding effect of external light (disturbance light). A single mold type that can be assembled by molding once using a high resin composition for encapsulating an optical semiconductor has been developed.

  In general, the resin composition for sealing an optical semiconductor having a high light shielding effect as described above is not affected by ambient light and improves the light transmission efficiency of the internal optical semiconductor element. A white pigment having a high light concealment value is added, and thus, it has been intensively studied and commercialized whether or not both disturbance light shielding and internal light reflectance are compatible.

In addition, the resin composition for encapsulating an optical semiconductor also has a problem regarding compatibility between performance as a sealing material and environmental performance. That is, as a basic performance of a semiconductor device, a flame resistance grade is required to be UL94-V0 or higher, and therefore bromine compounds and antimony trioxide have been conventionally used as flame retardants (see Patent Document 1). In order to reduce the use of harmful substances from the viewpoint of increasing global environmental protection, the development of new flame retardants to replace the above flame retardants has been promoted, and organic and inorganic phosphorus compounds, metal oxides, metal hydroxides, etc. It is being considered. However, the use of these new flame retardants has a low flame resistance effect compared to resin compositions using conventional flame retardants (such as bromine compounds and antimony trioxide), so it is possible to ensure flame resistance in thin-walled molded products. It is not sufficient, or moisture resistance reliability, moldability, and physical properties of cured products are likely to be lowered by increasing the amount added to supplement flame resistance, and it is very difficult to achieve compatibility with environmental performance.
Japanese Patent Laying-Open No. 2005-23230 (especially Tables 1 and 2)

  The present invention has been made in view of the above points, and in particular, in a single mold type photocoupler, while ensuring high light concealment that is not easily affected by ambient light, which is the basic performance, it has higher environmental performance. An object of the present invention is to provide a resin composition for encapsulating an optical semiconductor and an optical semiconductor device manufactured using the same, and specifically, use an environmentally regulated substance such as a bromine compound or antimony trioxide. In addition, a resin composition for encapsulating an optical semiconductor, which has higher flame resistance than before, and can ensure excellent flame resistance even in a thin molded product, and this resin composition for encapsulating an optical semiconductor, An object of the present invention is to provide an optical semiconductor device manufactured by using the optical semiconductor device.

The resin composition for optical semiconductor encapsulation according to claim 1 contains an epoxy resin, a curing agent, titania, a metal hydroxide, and an inorganic filler other than the titania and the metal hydroxide as essential components,
Containing an epoxy resin having a dicyclopentadiene skeleton in a range of 20 to 40% by weight based on the total amount of the epoxy resin,
The titania content is in the range of 18 to 20% by weight based on the total amount of the composition,
The metal hydroxide contains both magnesium hydroxide and aluminum hydroxide, and the content of the metal hydroxide is in the range of 15 to 18% by weight based on the total amount of the composition;
The content of the other inorganic filler is in the range of 45 to 50% by weight based on the total amount of the composition.

  The invention according to claim 2 is characterized in that, in claim 1, the weight ratio of the former and the latter of magnesium hydroxide and aluminum hydroxide in the metal hydroxide is in the range of 3: 7 to 7: 3. And

  The invention according to claim 3 is characterized in that, in claim 1 or 2, the metal hydroxide is surface-treated with a silane compound.

  An optical semiconductor device according to a fourth aspect is characterized by being sealed with the resin composition for optical semiconductor sealing according to any one of the first to third aspects.

  According to the first aspect of the present invention, the optical transmission efficiency between the internal optical semiconductor elements 3 can be reduced by using the optical semiconductor for sealing, especially in a single mold type photocoupler, which is not easily affected by disturbance light. In addition to being able to prevent malfunction, it is possible to prevent malfunctions, and without using bromine compounds, antimony trioxide, etc. that adversely affect the environment. It can improve the flame resistance of molded products with thinner thickness without causing deterioration of the physical properties of the cured product, while exhibiting high environmental performance, good flame resistance, moisture resistance reliability, moldability, cured product It can exhibit physical properties.

  According to the second aspect of the present invention, it is possible to obtain a resin composition for encapsulating an optical semiconductor that exhibits the above effects by using readily available magnesium hydroxide and aluminum hydroxide, and the thermal decomposition temperatures are different. By using magnesium hydroxide and aluminum hydroxide in combination, it is possible to achieve a higher flame resistance effect, thereby suppressing the amount of flame retardant added and providing better environmental performance and high moisture resistance reliability. Property, moldability, and cured product physical properties can be exhibited.

  According to the invention of claim 3, the fluidity at the time of molding is improved by the surface-treated metal hydroxide, and the properties such as moldability, bending strength of the cured product, moisture resistance reliability, and reflow resistance are improved. It is possible to improve and exhibit good flame resistance, moisture resistance reliability, moldability, and cured product properties while exhibiting environmental performance.

  According to the invention of claim 4, particularly in a single mold type photocoupler, it is difficult to be influenced by disturbance light, can improve the light transmission efficiency between the internal optical semiconductor elements 3, and prevent malfunction. Without using bromine compounds, antimony trioxide, etc., which have an adverse effect on the environment, and by using a large amount of flame retardants, without causing deterioration of moisture resistance reliability, moldability, and physical properties of cured products. It is possible to improve the flame resistance of a molded product having a thin wall thickness, and to exhibit good flame resistance, moisture resistance reliability, moldability, and cured product properties while exhibiting high environmental performance.

  Hereinafter, the best mode for carrying out the present invention will be described.

  The resin composition for encapsulating an optical semiconductor according to the present invention contains an epoxy resin, a curing agent, titania, a metal hydroxide, and an inorganic filler other than the titania and the metal hydroxide as essential components.

  As an epoxy resin, what contains the epoxy resin which has a dicyclopentadiene frame | skeleton in the range of 20 to 40 weight% with respect to the epoxy resin whole quantity in a composition is used. For this reason, while improving adhesiveness with a lead frame, the moisture absorption rate of hardened | cured material can be reduced and it becomes possible to improve reflow resistance. On the other hand, if the content is less than 20% by weight, sufficient reflow resistance cannot be obtained, and if it exceeds 40% by weight, the hot rigidity at the time of molding deteriorates and the moldability deteriorates. There is a problem that it ends up.

  The other epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, orthocresol novolak Type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanurate, aliphatic epoxy resin and the like can be used. An epoxy resin in which hydrogen is added to the aromatic ring of the epoxy resin can also be used. These other epoxy resins can be used alone or in combination of two or more.

  The curing agent is not particularly limited as long as it reacts with the epoxy resin used, but a curing agent with relatively little color is preferable. Examples thereof include novolak type phenol resins obtained by condensation reaction of acid anhydrides such as hexahydrophthalic anhydride and tetrahydrophthalic anhydride, phenol, cresol, xylenol, resorcin and the like with formaldehyde. In addition, amine-based curing agents are also mentioned, but due to the large discoloration during curing, attention should be paid to the amount added when used. These curing agents can be used alone or in combination of two or more. The stoichiometric equivalent ratio between the epoxy resin and the curing agent is preferably in the range of epoxy resin / curing agent (equivalent ratio) = 0.8 to 2 from the viewpoint of color and properties of the cured product.

  Titania (titanium dioxide) is contained in the range of 18 to 20% by weight based on the total amount of the composition. If the titania content is less than 18% by weight, it may not be possible to obtain both high light concealment and light reflection characteristics. Conversely, if the content exceeds 20% by weight, moldability and moldability may be reduced. The characteristics of the product may be degraded.

  Although this titania is not particularly limited, since impure ions such as sulfate ions and sodium ions are included in the production method, potassium, sodium, sulfate ions in ions eluted when boiled and extracted with ion-exchanged water, In order to obtain good moisture resistance reliability, it is desirable to use a material having a small amount of chlorine ions or the like or a surface-coated material.

  As the metal hydroxide, magnesium hydroxide and aluminum hydroxide which are commercially available at a relatively low price are used. These are not used alone, but are used in combination with both having different thermal decomposition temperatures. Therefore, higher flame resistance can be obtained.

  The ratio of magnesium hydroxide to aluminum hydroxide in this metal hydroxide is appropriately set, but the former to latter content weight ratio is preferably in the range of 3: 7 to 7: 3, and the flame resistance is within this range. There is a marked improvement in sex.

  These metal hydroxides are preferably pretreated with a silane compound such as silicon oxide or γ-glycidoxypropyltriethoxysilane. In this case, by improving the fluidity of the composition, it is possible to improve properties such as formability, bending strength of the cured product, moisture resistance reliability, and reflow resistance, and environment such as bromide compounds and antimony trioxide. By not using a substance that may adversely affect the environment, it is possible to exhibit good flame resistance, moisture resistance reliability, moldability, and cured product properties while exhibiting environmental performance. This surface treatment can be carried out, for example, by putting a predetermined amount of a silane compound into a ball mill or the like together with a metal hydroxide powder made of magnesium hydroxide and aluminum hydroxide and mixing them uniformly.

  Content of the said metal hydroxide shall be 15 to 18 weight% with respect to the composition whole quantity. Within this range, the flame resistance, formability and bending strength of the cured product can be improved. If this content is less than the above range, sufficient flame resistance may not be obtained, and if it is more than the above range, bending strength may be reduced.

  Moreover, the range whose average particle diameter of a metal hydroxide is 0.1-10 micrometers is preferable. If the average particle size is smaller than the above range, there is a risk of causing a decrease in fluidity due to an increase in the melt viscosity of the resin composition due to an increase in specific surface area. If the average particle size is larger than the above range, uniform dispersibility in the resin composition may be caused. There is a risk that it will be lowered and sufficient flame resistance may not be obtained.

  In addition, the maximum particle size of the metal hydroxide is preferably 100 μm or less, and when the maximum particle size exceeds 100 μm, unfilled molded products are likely to occur during molding, and wire deformation and the like are likely to occur. There is a fear.

  Moreover, silica powder can be mentioned as another inorganic filler. Examples of the silica powder include fused silica and crystalline silica. The shape in particular is not restrict | limited, For example, the thing of appropriate shapes, such as spherical shape and crushed shape, can be used.

  The content of other inorganic fillers is in the range of 45 to 50% by weight with respect to the total amount of the composition. For this reason, while reducing the moisture absorption rate of hardened | cured material, the intensity | strength of this hardened | cured material can be improved and also the thermal expansion coefficient of hardened | cured material can be reduced. On the other hand, if the content is less than 45% by weight, the moisture absorption rate of the cured product cannot be sufficiently reduced, and the strength of the cured product cannot be sufficiently obtained, and the reflow resistance is deteriorated. On the other hand, if it exceeds 50% by weight, the fluidity is lowered and the melt viscosity is increased, resulting in problems such as voids in the cured product and defects such as wire deformation.

  The average particle size of the other inorganic filler is preferably in the range of 8 to 15 μm, and the maximum particle size is preferably 150 μm or less, particularly preferably 100 μm or less. If this average particle size is less than 8 μm, molding defects due to resin leakage, resin burrs, etc. may occur at the time of sealing molding, and productivity and yield may be reduced. Conversely, if the average particle size exceeds 15 μm, There is a possibility that the filling property of the resin into the thin portion of the package is deteriorated and causes molding defects such as unfilling. Further, if the maximum particle size of other inorganic fillers exceeds 150 μm, there is a possibility that the light concealment of the thin-walled portion may be deteriorated in addition to molding defects such as gate clogging and unfilling at the time of resin encapsulation.

  Moreover, a hardening accelerator can also be contained in a composition as needed. As the curing accelerator, an appropriate one having an action of accelerating the reaction between the epoxy resin and the curing agent can be used, and is not particularly limited, but it is preferable to use a relatively less colored one, For example, organic phosphine curing accelerators such as triphenylphosphine diphenylphosphine, tertiary amine curing accelerators such as 1,8-diazabicyclo (5,4,0) undecene-7, triethanolamine, benzyldimethylamine and the like Examples thereof include salts, organic acid salts such as tetraphenylphosphonium / tetraphenylborate and tetraphenylphosphonium / bromide, and imidazoles such as 1-benzyl-2-phenylimidazole. These curing accelerators can be used alone or in combination of two or more. Moreover, it is preferable that content of a hardening accelerator is the range of 0.05-5 weight% with respect to the composition whole quantity. When the content of the curing accelerator is less than 0.05% by weight, a sufficient acceleration effect of the reaction between the epoxy resin and the curing agent cannot be obtained, and the molding cycle may be deteriorated. If it is less than% by weight, the gelation time becomes too short, and there is a possibility that deterioration of moldability such as voids and unfilling may be caused.

  Furthermore, in the resin composition for encapsulating an optical semiconductor, in addition to the above components, an appropriate mold release agent, anti-discoloring agent, silane coupling agent, modifier, infrared absorber, plasticizer, diluent as necessary. Etc. may be included.

  In preparing the resin composition for sealing an optical semiconductor, the above components are uniformly dry blended with a mixer, a blender, etc., and then melt-kneaded with a continuous kneader such as a kneader. After cooling and solidifying, the composition can be prepared by pulverizing the solidified product. This composition may be formed into tablets or sticks as necessary.

  FIG. 1 shows an example of an optical semiconductor device 1, and this optical semiconductor device 1 is manufactured by sealing an optical semiconductor element 3 using the resin composition for optical semiconductor sealing prepared as described above. be able to.

  Specifically, the optical semiconductor device 1 shown in FIG. 1A is an example of a counter-type photocoupler, and this photocoupler can be manufactured as follows. That is, as the optical semiconductor element 3, an LED 4 that is a light emitting element and a photodiode 5 that is a light receiving element are mounted on opposing lead frames 6 and 6, respectively. At this time, the periphery of the LED 4 is sealed by casting or the like with light-transmitting silicone 8 or the like. Next, the lead frames 6 and 6 are sealed with a sealing material 9 that transmits light together with the LED 4 and the photodiode 5 in a state where the LED 4 and the photodiode 5 face each other. The sealing material 9 can be formed by transfer molding or the like using an appropriate transparent resin composition such as an epoxy resin composition. Next, by sealing the periphery of the sealing material 9 with a resin composition for sealing an optical semiconductor by transfer molding or the like, the entire surface is covered with a cured product 2 of the resin composition for optical semiconductor sealing, A counter-type photocoupler can be obtained.

  Also, the optical semiconductor device 1 shown in FIG. 1B is a single-channel reflection type photocoupler, and this photocoupler can be manufactured as follows. That is, LED 4 as a light emitting element and photodiode 5 as a light receiving element face each other as optical semiconductor element 3 and are mounted on lead frame 6, and this LED 4 and photodiode 5 are integrally overcoated in a dome shape with silicone 8 or the like. Thereafter, these are sealed by transfer molding or the like with a resin composition for encapsulating an optical semiconductor, thereby covering the entire surface with a cured product 2 of the resin composition for encapsulating an optical semiconductor, and a single-channel reflective photo Couplers can be manufactured.

  FIG. 1B shows the LED 4, the photodiode 5, the silicone 8, and the like. In practice, except for the input / output pin 7 led out from the lead frame 6, it is for optical semiconductor sealing. Since the entire optical semiconductor device 1 is covered with the cured product 2 of the resin composition, the LEDs 4 and the like cannot be visually recognized from the outside.

  In general, a GaAs element that emits near-infrared (900 to 1000 nm) light is used as the LED 4 of the photocoupler. However, the present invention is not limited to this, and is made of compound semiconductors having different emission wavelengths (colors). Various LEDs 4 may be used. When the optical semiconductor element 3 such as the LED 4 or the photodiode 5 is weak against stress, the optical semiconductor element 3 can be protected by overcoating with the silicone 6 having a low elastic modulus as described above. Further, the multi-channel type optical semiconductor device 1 having two or more channels can be manufactured by increasing the combination of the optical semiconductor elements 3 including the LEDs 4 and the photodiodes 5 provided in the optical semiconductor device 1.

  And in the optical semiconductor device 1 shown in FIG. 1, titania is contained in the hardened | cured material 2 of the resin composition for optical semiconductor sealing which seals this optical semiconductor device 1, and the light transmittance of hardened | cured material is shown. Since it is set low, it is possible to prevent disturbance light from adversely affecting the optical semiconductor element 3 such as a photodiode inside the optical semiconductor device 1. In addition, the optical signal can be reliably reflected by the cured product inside the optical semiconductor device 1 to improve the light transmission efficiency between the internal optical semiconductor elements 3.

  In addition, the cured product 2 of the resin composition for encapsulating an optical semiconductor is composed of aluminum hydroxide (thermal decomposition temperature: about 200 ° C.) and magnesium hydroxide (thermal decomposition temperature: about 340 ° C.) having different thermal decomposition temperatures as metal hydroxides. Therefore, it is possible to provide the optical semiconductor device 1 having not only a bromine compound, antimony trioxide and the like that adversely affect the environment, but also excellent flame resistance. Furthermore, by using these metal hydroxides in combination, flame resistance can be greatly improved without containing an organic / inorganic phosphorus compound or the like that causes a decrease in moisture resistance reliability, moldability, and cured material properties. In addition, the surface of the metal hydroxide is treated with a silane compound and coated to further improve properties such as moldability, bending strength of cured products, moisture resistance reliability, and reflow resistance. It is possible to exhibit high flame resistance, moisture resistance reliability, moldability, and cured product properties while exhibiting environmental performance.

  Hereinafter, the present invention will be specifically described by way of examples.

(raw materials)
As the epoxy resin, orthocresol novolak type epoxy resin (“N655EXP-S” manufactured by Dainippon Ink and Chemicals, Inc.), dicyclopentadiene type epoxy resin (“HP-7200L” manufactured by Dainippon Ink and Chemicals, Inc.), and bromine Epoxy resin (“ESB400T” manufactured by Sumitomo Chemical Co., Ltd.) was used.

  Phenol novolak (“DL-65” manufactured by Meiwa Kasei Co., Ltd.) was used as the curing agent.

  Triphenylphosphine (“TPP” manufactured by Hokuko Chemical Co., Ltd.) was used as a curing accelerator.

  As inorganic fillers, spherical silica (average particle size 15 μm, maximum particle size 100 μm) and crushed silica (average particle size 8 μm, maximum particle size 100 μm) were mixed so that the weight ratio of the former to the latter was 2: 8. A thing was used.

  Titania was used as a pigment.

  Examples of the metal hydroxide include aluminum hydroxide that has not been surface-treated (average particle size 1 μm, maximum particle size 10 μm), aluminum hydroxide that has been surface-treated with an epoxysilane compound, “HP-” manufactured by Meiwa Electric Works, Ltd. 360STE)), magnesium hydroxide not subjected to surface treatment (average particle size 1 μm, maximum particle size 10 μm), and magnesium hydroxide subjected to surface treatment with a silane compound (“Kisuma-8SN” manufactured by Kyowa Chemical Industry Co., Ltd.) )).

  Antimony trioxide (“AT-3” manufactured by Suzuhiro Chemical Co., Ltd.) was used as an inorganic flame retardant.

  “KBM403” manufactured by Shin-Etsu Chemical Co., Ltd. was used as the silane coupling agent.

(Preparation of resin composition for optical semiconductor encapsulation)
Each component shown in Table 1 was blended, and this was uniformly dry blended with a mixer, then melted and kneaded with a kneader, then cooled and solidified, and then the solidified product was pulverized. A sealing resin composition was prepared as a sealing material.

(Evaluation of flame resistance)
The resin composition for optical semiconductor encapsulation was transfer molded using a mold under molding conditions of a mold temperature of 175 ° C. and a curing time of 120 seconds, and then post-cured at 175 ° C. for 6 hours to obtain a thickness of 1/16 inch. A test piece (1.59 mm) was produced. The flame resistance of the test piece was measured according to the UL94 test method. The results are shown in Table 1 below.

(Evaluation of light transmittance)
A disk-shaped test piece having a size of 50 mmφ × 0.3 mmt was produced under the same molding conditions as in the evaluation of the flame resistance.

  The test piece was measured for light transmittance and light reflectance at a wavelength of 940 nm using a spectrophotometer with an integrating sphere manufactured by Shimadzu Corporation.

  For light transmittance, a value of less than 0.01% is evaluated as [◎], a value of 0.01 to 0.3% is evaluated as [◯], and a value exceeding 0.3% is evaluated as [×]. did. The results are shown in Table 1 below.

  Further, the light reflectance was evaluated as [×] when it was less than 65%, [◯] when it was 65 to 90%, and [［] when it was over 90%. The results are shown in Table 1 below.

(Measurement of disturbance light shielding properties)
50 single-channel reflection type photocouplers (package shape: 4-pin DIP) as shown in FIG. 1B were manufactured as follows. That is, the LED 4 (GaAs element) and the photodiode 5 are mounted on the lead frame 6 so as to face each other, and the LED 4 and the photodiode 5 are integrally coated with a silicone 8 in a dome shape, and then this is a resin for sealing an optical semiconductor A single-channel reflective photocoupler was produced by transfer molding with the composition and sealing. At this time, the thickness of the thinnest portion of the cured product 2 of the resin composition for sealing an optical semiconductor was set to 0.3 mm.

  Then, the output current on the light receiving side when sunlight (natural light) was irradiated from the outside to the reflection type photocoupler was measured. The smaller the output current on the light receiving side, the more light signals are blocked at the thinnest wall, and the reflective photocoupler is driven without being affected by ambient light. The light receiving side output current of less than 0.1 μA is indicated as [◎], the current from 0.1 μA to 0.1 mA is indicated as [○], and the current exceeding 0.1 mA is indicated as [×]. The disturbance light shielding property of the photocoupler was judged. The results shown in Table 1 below are average evaluations of 50 evaluation reflective photocouplers.

(Liquidity assessment)
For each of the Examples and Comparative Examples, 50 fluidity evaluation packages (18SOP) were produced in the same conditions as in the case of the flame resistance evaluation. About the obtained package, the void which exists in sealing resin was measured using the ultrasonic survey apparatus, and the volume ratio of the void with respect to sealing resin was derived | led-out. The void volume ratio of less than 0.01% was evaluated as [［], the void ratio of 0.01% or more and less than 0.1% was evaluated as [◯], and the void ratio of 0.1% or more was evaluated as [×]. .

(Evaluation of bending strength)
A test piece having a size of 4 mm × 10 mm × 80 mm was molded under the above molding conditions. Next, the breaking strength was measured at a test speed of 2 mm / min using an autograph manufactured by Shimadzu Corporation. At this time, the test conditions were a fulcrum distance of 64 mm and a support base of 2 mmR. Then, evaluation was made by determining that the breaking strength was 120 MPa or more and less than 170 MPa as [O], 100 MPa or more and less than 120 MPa as [[Delta]], and less than 100 MPa as [x].

(Evaluation of reflow resistance)
Ten 18SOPs were produced as evaluation packages under the above molding conditions. This evaluation package was baked at 125 ° C. for 16 hours, then pretreated for moisture absorption under the conditions of 85 ° C./85% RH / 96 hr, and further subjected to IR reflow treatment at a peak temperature of 260 ° C. three times.

  After the reflow treatment, the presence or absence of peeling of the chip surface was determined for each of 10 packages using an ultrasonic probe. Then, evaluation was made by judging that no chip peeling occurred [[]], and one with chip peeling [x]. The results shown in Table 1 below are average evaluations for 10 evaluation packages.

(Evaluation of moisture resistance reliability)
Ten 16DIPs each mounted with a test element on which an aluminum wiring having a circuit width of 3 μm was mounted as an evaluation package under the above molding conditions were produced. This evaluation package was subjected to a high-temperature and high-humidity bias test under the conditions of 85 ° C./85% RH / 25V / 1000 hr. Was evaluated as [×]. The results shown in Table 1 below are average evaluations for 10 evaluation packages.

BRIEF DESCRIPTION OF THE DRAWINGS The optical semiconductor device which concerns on this invention is shown, (a) is a schematic sectional drawing which shows an example of a counter-type photocoupler, (b) is a schematic plan view which shows an example of a reflection type photocoupler.

Explanation of symbols

  1 Optical semiconductor device

Claims (4)

Containing an epoxy resin, a curing agent, titania, a metal hydroxide, and other inorganic fillers other than the titania and the metal hydroxide as essential components,
Containing an epoxy resin having a dicyclopentadiene skeleton in a range of 20 to 40% by weight based on the total amount of the epoxy resin,
The titania content is in the range of 18 to 20% by weight based on the total amount of the composition,
The metal hydroxide contains both magnesium hydroxide and aluminum hydroxide, and the content of the metal hydroxide is in the range of 15 to 18% by weight based on the total amount of the composition;
Content of other inorganic filler is 45 to 50 weight% of range with respect to the composition whole quantity, The resin composition for optical semiconductor sealing characterized by the above-mentioned.   2. The optical semiconductor encapsulation according to claim 1, wherein the weight ratio of the former to the latter of magnesium hydroxide and aluminum hydroxide in the metal hydroxide is in the range of 3: 7 to 7: 3. Resin composition.   The resin composition for optical semiconductor encapsulation according to claim 1 or 2, wherein the metal hydroxide is surface-treated with a silane compound.   An optical semiconductor device, wherein the optical semiconductor device is sealed with the optical semiconductor sealing resin composition according to claim 1.

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