JPH11236490A - Epoxy resin composition for sealing and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition hardly generating a package crack after a moisture absorbing reflow, excellent in moisture absorbing solder crack resistant property and useful for semiconductor device, etc., by making the composition contain each specific epoxy resin, curing agent, curing accelerator and filler. SOLUTION: This epoxy resin composition for sealing contains (A) an epoxy resin containing at least a dicyclopentadiene type epoxy resin of formula I [(n) is 0-6 integer], (B) preferably 0.8-1.2 equivalent [based on 1 equivalent of the component (A)] curing agent containing at least a dicyclopentadiene type phenolic resin of formula II [1<=(1+n)<=15; 0.1<=(m)<=15; 1<=(k)<=10; R is H, CH3 or OH], (C) preferably 0.25-5 wt.% (based on the composition) curing accelerator such as triphenylphosphine, (D) 84-93 wt.% filler such as a fused silica as indispensable components. Further, the resin of the formula I is preferably contained in a ratio of 40-100 wt.% based on the total epoxy resin in the composition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition used for protecting and encapsulating electric and electronic parts such as diodes, transistors, and integrated circuits, and semiconductor devices, and a semiconductor device using the same.

[0002]

2. Description of the Related Art As a method for encapsulating electric and electronic parts such as diodes, transistors, and integrated circuits, and semiconductor devices, for example, an encapsulation method using epoxy resin or silicon resin, glass, metal, ceramic, or the like is used. The hermetic sealing method has been adopted, but in recent years, resin sealing by low-pressure transfer molding using epoxy resin, which can be mass-produced with improved reliability and is cost-effective, has become the mainstream. is occupying.

In this encapsulation method using an epoxy resin, a molding material comprising an epoxy resin composition using an o-cresol novolak type epoxy resin as a base resin component and a phenol novolak resin as a curing agent is generally used. Have been. However, IC, LSI, V
With the increase in the density and integration of electronic components such as LSIs and semiconductor devices, the conventional epoxy resin composition cannot always respond satisfactorily to reduce the thickness of the mold resin.

For example, in a device for surface mounting, the device itself is directly immersed in solder at the time of mounting.
Since the device is rapidly exposed to a high temperature and severe environment, the occurrence of package cracks and the like is inevitable. That is, when moisture absorbed during storage after molding is exposed to a high temperature, it rapidly evaporates and expands, and the sealing resin cannot withstand this and cracks occur in the package.

[0005] In order to solve such problems, studies have been made on the epoxy resin composition for encapsulation to improve the heat resistance, adhesion, and the like. In fact, these properties have not been improved. However, the improvement of the resistance to the above-mentioned moisture-absorbing solder crack (the resistance to the moisture-absorbing solder crack) as well as these characteristics, particularly the low stress property, is not yet in a satisfactory state.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sealing epoxy resin composition having improved resistance to cracks in moisture absorption solder and a semiconductor device using the same.

[0007]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have made intensive studies and as a result, have found the following two things, and have completed the present invention. First, when the following specific resins having a dicyclopentadiene ring are used as an epoxy resin and a curing agent, these resins have low hygroscopicity and high adhesiveness, so that package cracking and peeling after moisture reflow are caused. Is prevented.

[0008] Second, when the filler is highly filled into the epoxy resin composition at the following specific ratio, the moisture absorption of the composition is reduced, so that the occurrence of package cracks and peeling after moisture reflow is further prevented. That is to be done. That is, the epoxy resin composition for sealing according to the present invention,
An epoxy resin composition for sealing containing an epoxy resin, a curing agent, a curing accelerator, and a filler as essential components, wherein at least a dicyclopentadiene-type epoxy resin represented by the following chemical formula (A) is contained as the epoxy resin, The curing agent contains at least a dicyclopentadiene-type phenol resin represented by the following chemical formula (B), and the compounding amount of the filler is 84 to 93% by weight based on the total epoxy resin composition in terms of true specific gravity. It is characterized by being a ratio.

[0009]

Embedded image

(In the formula (A), n is an integer of 0 to 6; in the formula (B), 1 ≦ l + n ≦ 40, 1 ≦ m ≦ 15, 1 ≦ k ≦
10, R = H, CH ₃ or OH. The semiconductor device according to the present invention is obtained by sealing a semiconductor element with the sealing epoxy resin composition of the present invention.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Epoxy resin composition) As an epoxy resin, a dicyclopentadiene type epoxy resin represented by the above-mentioned chemical formula (A) is used without fail in order to reduce moisture absorption and increase adhesion. Other epoxy resins may be used in combination.

The epoxy resin which can be used in combination with the dicyclopentadiene type epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule. Those with little coloring are preferred.
Preferred examples include a cresol (novolak) type epoxy resin, a biphenyl type epoxy resin, a bisphenol type (A type, F type, S type etc.) epoxy resin, a triphenylmethane type epoxy resin, a bromine-containing epoxy resin, a naphthalene ring-containing epoxy Resins, alicyclic epoxy resins, triglycidyl isocyanurate, aliphatic epoxy resins, and the like can be used, and only one type or two or more types can be selected from these.

The dicyclopentadiene type epoxy resin represented by the chemical formula (A) is commercially available, for example, from Nippon Kayaku Co., Ltd. in addition to EXA7200 from Dainippon Ink and Chemicals, Inc. The amount of the dicyclopentadiene-type epoxy resin used is preferably 40 to 100% by weight based on all epoxy resins in the epoxy resin composition. If the amount is less than 40% by weight, the effects such as low moisture absorption and high adhesion tend to decrease.

As the curing agent, a dicyclopentadiene-type phenol resin represented by the above-mentioned chemical formula (B) is used without fail to reduce moisture absorption and increase adhesion, but other curing agents may be used in combination. . The curing agent that can be used in combination with the dicyclopentadiene-type phenol resin is not particularly limited as long as it reacts with the epoxy resin.
Preferred examples include those having two or more phenolic hydroxyl groups in one molecule, such as phenol novolak, cresol novolak, phenol aralkyl, naphthol aralkyl, triphenylmethane type phenol, and various other polyhydric phenol compounds. Alternatively, two or more kinds can be used.

[0015] In addition to the above, amine-based curing agents can also be mentioned. However, since discoloration during curing is large, attention must be paid to the amount of addition when used. The use ratio of the dicyclopentadiene-type phenol resin to the entire used curing agent is 40 to 10
It is preferably 0% by weight. If the amount is less than 40% by weight, the effects such as low moisture absorption and high adhesion tend to decrease.

In the epoxy resin composition, the mixing ratio of the curing agent is such that the equivalent of the curing agent is 0.5 to 1 equivalent of the epoxy resin.
It is preferably set to a range of from 1.5 to 1.5, and particularly preferably from 0.8 to 1.2. If the equivalent of the curing agent is less than 0.5, the releasability is poor, and if it exceeds 1.5, the moisture absorption increases, and the reliability tends to deteriorate. In the epoxy resin composition for encapsulation of the present invention, the filler is highly filled in order to reduce the moisture absorption rate. Deterioration may occur and molding defects such as poor package appearance, internal voids, wire sweep, and die shift may occur. In order to prevent this, the viscosity at 150 ° C. of the resin component composed of the epoxy resin and the curing agent is preferably 1 poise or less.

The curing accelerator is not particularly limited as long as it has an action of accelerating the reaction between the epoxy resin and the curing agent, but a relatively less colored one is preferred. Preferred examples include organic phosphorus compounds such as organic phosphines such as triphenylphosphine and diphenylphosphine;
-Methylimidazole, 2-phenylimidazole, 2
-Imidazole compounds such as -phenyl-4-methylimidazole; 1,8-diazabicyclo [5,4,0] undecene-7 (also called "DBU"), diazabicyclononane (also called "DBN"), triethanol Amine,
Tertiary amine compounds such as benzyldimethylamine; and organic salts such as tetraphenylphosphonium / tetraphenylborate can be used. These may be used alone or in combination of two or more.

Here, a composition containing a resin component having a dicyclopentadiene ring, such as the epoxy resin composition of the present invention, generally has a low reactivity due to steric hindrance of the dicyclopentadiene ring. There is. In order to suppress the decrease in reactivity, it is preferable to use a curing accelerator having excellent reactivity which can promote self-polymerization between epoxy resins. As such a curing accelerator, at least one selected from the group consisting of a tertiary amine compound and an imidazole compound is preferable among the curing accelerators exemplified above. Since this curing accelerator has the potential to lower the viscosity of the epoxy resin composition, the use of this latent curing accelerator makes it possible to improve the moldability even when the epoxy resin composition is highly filled with a filler. It is more preferable that the molding becomes good and the occurrence of the molding failure can be prevented. The amount of the latent curing accelerator used is 10 to 1 with respect to the total curing accelerator.
It is preferably 00% by weight.

Among the above tertiary amine compounds, DB
Use of U and / or DBN is preferred, and among the above imidazole compounds, use of 2-methylimidazole and / or 2-phenylimidazole is preferred.
The mixing ratio of the curing accelerator used in the present invention is preferably from 0.25 to 5% by weight based on the entire epoxy resin composition. If the amount of the curing accelerator is less than 0.25% by weight, the gelation time is delayed, and the workability tends to be significantly reduced due to insufficient curing. Conversely, if it exceeds 5% by weight, the curing proceeds rapidly. As a result, heat generation is increased, which may cause cracks, foaming, and molding troubles.

The epoxy resin composition according to the present invention comprises:
A filler is blended in order to exert the effect of increasing the amount or reduce the moisture absorption of the cured resin so that cracks are less likely to occur. The filler is not particularly limited. For example, one or more inorganic fillers such as fused silica, crystalline silica, alumina, and silicon nitride can be used. Among these, fused silica is preferred in terms of lowering the coefficient of linear expansion, increasing the reliability of high humidity resistance, and reducing the rate of moisture absorption.

The amount of the filler is 84 to 93% by weight based on the total epoxy resin composition in terms of true specific gravity. In particular, it is preferable to determine the blending amount so that the coefficient of linear expansion falls within the range of 1.1 to ⁵ (× 10 ⁻⁵ / ° C.). If the compounding amount of the filler is less than 84% by weight, the effect of reducing the moisture absorption rate will be insufficient, and if it exceeds 93% by weight, the viscosity of the epoxy resin composition will increase, and the above-mentioned problem of molding failure tends to occur. There is.

In order to suppress an increase in the viscosity of the epoxy resin composition due to high filling of the filler and to prevent the occurrence of the above-mentioned molding failure, the average particle diameter of the filler before compression molding is set as the filler. It is preferable to use a filler having a net volume percentage φ of 83% or more in the apparent volume of a molded product obtained by compression-molding the filler at a pressure maintained.

In order to suppress an increase in the viscosity of the epoxy resin composition due to high filling of the filler and to prevent the occurrence of the above-mentioned molding failure, a fatty acid having 28 or less carbon atoms and / or
Or a derivative thereof with respect to the entire epoxy resin composition,
It is preferably further contained at a rate of 0.05 to 2% by weight, and more preferably at a rate of 0.05 to 1% by weight. In the epoxy resin composition, the fatty acid and / or the derivative thereof shows compatibility with the resin component and also acts as a plasticizer, so that it contributes to lowering the viscosity of the entire epoxy resin composition and increases the filler height. It suppresses the occurrence of the above-mentioned molding failure which tends to occur in the case of filling. If the amount of the fatty acid and / or the derivative thereof is less than 0.05% by weight, the effect of lowering the viscosity cannot be obtained. If the amount exceeds 2% by weight, the fatty acid and / or the derivative thereof is added to the epoxy resin composition during molding. Tends to bleed out at the interface between the molded body and the lead frame and the chip, resulting in a problem of lowering the adhesion. The addition of the fatty acid and / or its derivative does not adversely affect the reliability of the entire epoxy resin composition, and is therefore preferable.

The fatty acid and / or derivative thereof is not particularly limited as long as it has 28 or less carbon atoms. Examples thereof include stearic acid, palmitic acid, oleic acid and amide derivatives thereof.
Only one species or two or more species can be used. Resin sealing with an epoxy resin composition is usually performed using a mold,
In order to facilitate release from the mold, it is preferable that a release agent is added to the epoxy resin composition according to the present invention. As the release agent, for example, natural carnauba-based, higher fatty acid, polyethylene-based wax and the like can be used, and one type may be used alone or two or more types may be used in combination. Specifically, carnauba wax, stearic acid, stearic acid derivatives, montanic acid, montanic acid derivatives, carboxyl group-containing polyolefin and the like are preferably used. These may be used alone or in combination of two or more. The mixing ratio of the release agent is 0.05 to 1.5% by weight of the whole composition.
It is preferred that

The epoxy resin composition for sealing according to the present invention may optionally contain a coloring agent, a low-stressing agent, a flame retardant, a coupling agent and the like in an appropriate amount. Examples of the coloring agent include pigments such as carbon black and titanium oxide, and dyes such as diazo compounds. Examples of the low stress agent include silicone gel, silicone rubber, silicone oil and the like. Examples of the flame retardant include antimony trioxide, a halogen compound, a phosphorus compound and the like. Examples of the coupling agent include γ-glycidoxypropyltrimethoxysilane, γ
And silane coupling agents such as mercaptopropyltrimethoxysilane. The colorant, the stress reducing agent, the flame retardant, the coupling agent and the like may be used in combination of two or more.

The epoxy resin composition of the present invention can be produced by uniformly mixing the above-mentioned components with a mixer, a blender or the like, and then kneading with a roll, a kneader or the like. The order of compounding the components is not particularly limited. The epoxy resin composition of the present invention, more specifically,
For example, epoxy resin, curing agent, curing accelerator, filler,
Furthermore, if necessary, other components are dissolved and mixed or melt-mixed, then melt-kneaded with three rolls or the like, and the kneaded product is cooled and solidified, pulverized, and tableted if necessary. Can be manufactured. When the property is liquid at room temperature, it can be produced by dissolution mixing or melt kneading. (Encapsulation of a semiconductor device) The epoxy resin composition thus obtained is prepared by transfer molding a tablet in the case of a solid using a mold, and casting, potting, printing in the case of a liquid. By casting and curing by the method, a semiconductor element mounted on a lead frame or a laminate of a semiconductor device such as an optical semiconductor device can be sealed.

As the above-mentioned lead frame, a lead frame made of copper or a copper alloy in terms of electrical conductivity and thermal conductivity (higher function elements and large elements generate more heat). In this respect, a lead frame made of a 42 alloy alloy is generally used. Since these lead frames have low adhesion to bonding wires such as gold wires, the parts of the lead frame to be connected to the bonding wires are pre-plated with silver or gold, and then connected to the bonding wires. We try to improve reliability. Copper-based lead frames are often plated with nickel, silver, or gold.

The above-mentioned copper lead frame is not limited to one using pure copper, but also 194 alloy, EFTE
Copper alloy materials such as C64T are also included. The material of the lead frame is not limited to the above. For example, Cu
A frame formed by plating the alloy with Ni and Pd in order,
A frame formed by sequentially plating a Cu alloy with Ni, Pd, and Au (these are also referred to as “s-Pd plated frames”) can be used.

The epoxy resin composition for encapsulation of the present invention comprises 4
Even with a lead frame made of two alloys, it has good adhesion due to the inherent high adhesion of dicyclopentadiene type resin used as an epoxy resin and a hardening agent, and high filling of a filler. On the other hand, a Cu alloy frame and the above s
Regarding -Pd plating frame, the conventional epoxy resin composition for encapsulation had a remarkable decrease in adhesion, but when the epoxy resin composition for encapsulation of the present invention was used, the inherent dicyclopentadiene-type resin contained therein was used. Due to the high adhesion to the metal and the high filling of the filler, a decrease in the adhesion to these frames can be suppressed. That is, the epoxy resin composition for sealing of the present invention, particularly when applied to the sealing of a semiconductor device using a Cu alloy frame or the s-Pd plating frame, the conventional epoxy resin composition for sealing. A remarkable effect of improving adhesion is exhibited.

[0030]

The present invention will be described in detail below with reference to examples and comparative examples. In addition, this invention is not limited to a following example. <Examples 1 to 11 and Comparative Examples 1 to 5> Epoxy resin compositions were manufactured according to the formulations shown in Tables 1 to 3 (the amount of the blending is based on weight), and the semiconductor device was sealed. In the table, details of each component are as follows.

Filler S1: Amorphous silica (manufactured by Tokuyama Corporation, true specific gravity 2.2, average particle size 40 μm, specific surface area 0.
5 m ² / g). Filler S2: amorphous silica powder (manufactured by Tokuyama Corporation, true specific gravity 2.2, average particle size 8 μm, specific surface area 1.5 m ² /
g). Filler S3: amorphous silica powder (manufactured by Tokuyama Corporation, true specific gravity 2.2, average particle diameter 0.3 μm, specific surface area 15 m ² /
g).

Coupling agent: Epoxysilane-based coupling agent (manufactured by Nippon Unicar Co., Ltd., product number A-187). Epoxy resin A: bifunctional biphenyl type epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., epoxy equivalent 195, 15)
0.1 poise melt viscosity at 0 ° C, part number YX4000
H).

Epoxy resin B: a dicyclopentadiene type epoxy resin represented by the above formula (A) (manufactured by Dainippon Ink and Chemicals, Inc., epoxy equivalent: 264, melt viscosity at 150 ° C .: 0.7 poise, product number HP7200). Epoxy resin C: dicyclopentadiene type epoxy resin of the above formula (A) (manufactured by Dainippon Ink and Chemicals, Inc., epoxy equivalent: 260, melt viscosity at 150 ° C .: 0.3 poise,
Part number EXA7200L).

Epoxy resin D: brominated epoxy resin (manufactured by Sumitomo Chemical Co., Ltd., epoxy equivalent 400, product number ESB)
400T). Curing agent A: Phenol aralkyl type curing agent (manufactured by Mitsui Toatsu Co., Ltd., hydroxyl equivalent 175, melt viscosity at 150 ° C. 2)
Poise, part number XL225-3L). Curing agent B: dicyclopentadiene-type phenol resin of the above formula (B) (manufactured by Nippon Petrochemical Co., Ltd., hydroxyl equivalent: 1)
70, 2 poise melt viscosity at 150 ° C, part number DPP-
M).

Curing agent C: dicyclopentadiene type phenol resin of the above formula (B) (manufactured by Nippon Petrochemical Co., Ltd.)
(Hydroxyl equivalent 168, melt viscosity at 150 ° C. 1.4 poise, product number DPP-L). Curing agent D: phenol novolak type curing agent (manufactured by Gunei Chemical Co., Ltd., hydroxyl equivalent 105, melt viscosity at 150 ° C. 2)
Poise, part number PSM6200).

Curing accelerator A: Triphenylphosphine (TPP, manufactured by Hokuko Chemical Co., Ltd.). Curing accelerator B: 2-phenylimidazole (2PZ, manufactured by Shikoku Chemical Industry Co., Ltd.). Flame retardant: diantimony trioxide (Mitsubishi Materials Corporation)
Manufactured by Sb203-NT).

Release agent: natural carnauba wax. Pigment: carbon black (manufactured by Mitsubishi Materials Corporation, product number 750-B). Fatty acid: Stearic acid (Nippon Oil & Fats Co., Ltd., product number NAA
-174). The net volume percentage φ of the filler was determined as follows. (Calculation method of net volume percentage φ of filler): A cylindrical molded body is obtained by uniaxially pressing the filler at a compression pressure of 100 MPa, and the obtained molded body is crushed to obtain a filler after compression molding. As a result of measuring the average particle size, the average particle size was the same as the average particle size of the filler before molding. Therefore, the compression pressure is 100 MPa
Thus, it can be said that the filler particles are not broken by compression molding. Accordingly, the net compression volume percentage φ of the mixed filler powder in the compact at this compression pressure is calculated from the apparent volume V and weight W of the compact, which is calculated from the diameter and thickness of the compact, and the true specific gravity d of the filler. Was calculated by the following equation.

Compression molding volume percentage of filler φ (%) = W
/ (D · V) × 100 The manufacturing conditions of the epoxy resin composition were as follows. (Production conditions of epoxy resin composition): After uniformly mixing each component for 30 minutes using a mixer, a blender, or the like,
It was treated at a temperature of 85 ° C. by a roll, a kneader or the like, and then cooled and solidified. Then, it was pulverized to a predetermined particle size by a pulverizer to obtain a granular sealing material.

Each of the obtained epoxy resin compositions and molded articles thereof was subjected to a property evaluation test by the following method. (Gel time): Measured at 175 ° C. using a Curastometer V type manufactured by Orientec. (Spiral flow): The flow length of the sample during transfer molding at a mold temperature of 170 ° C. was measured using a mold dedicated to spiral flow in accordance with the EMMI standard. (Moldability): The moldability was evaluated by determining the amount of voids generated in the molded package. The package for performance evaluation has a diameter of 28 mm and a thickness of 3.2 mm.
Using a mold for 60QFP, mold temperature 175 ± 5 ° C, injection time (speed) 10 seconds, pressurization (curing) time 90
The material was subjected to transfer molding under molding conditions of injection pressure of 70 kg / cm ² for ² seconds, and the obtained molded article was subjected to after-curing at 175 ° C. for 6 hours to produce a molded article. Regarding the voids inside the package, the number of void images having a diameter of 0.2 mm or more was counted in a chart obtained by observing the front and back surfaces of the QFP package with an ultrasonic probe M-700II (manufactured by Canon Inc.). For surface pinholes and unfilled,
Observation with a stereomicroscope indicated that the sample had a diameter of 0.1 mm or more. (Moisture reflow resistance): Ni, P on 42 alloy lead frame, Cu alloy lead frame, and Cu alloy
Transfer molding was performed on each of the s-Pd-plated lead frames obtained by plating d and Au in this order (all mounted with silicon chips) using a 160 QFP mold having a diameter of 28 mm and a thickness of 3.2 mm. The molding conditions are a mold temperature of 175 ± 5 ° C., an injection time (speed) of 10 seconds, a pressurization (curing) time of 90 seconds, and an injection pressure of 70 kg / cm ² . The obtained molded article was after-cured at 175 ° C. for 6 hours, thereby obtaining four packages for performance evaluation.
After leaving these packages in an atmosphere of 85 ° C. and 85% RH for 168 hours to absorb moisture, the packages are immersed in a solder bath at 260 ° C. for 10 seconds, and a molded article of the epoxy resin composition, a chip,
The number of packages that have been separated from the frame and die pad,
Further, the number of packages in which cracks occurred in the molded body of the epoxy resin composition was counted and evaluated.

The results are shown in Tables 1 to 3.

[0041]

[Table 1]

[0042]

[Table 2]

[0043]

[Table 3]

[0044]

The sealing epoxy resin composition of the present invention comprises:
As the epoxy resin and the curing agent, the specific resin having a dicyclopentadiene ring having low hygroscopicity and high adhesion is included, and the filler is highly filled at the specific ratio, thereby reducing the moisture absorption of the composition. Therefore, it is excellent in moisture absorption solder crack resistance, hardly causes package cracking and peeling after moisture absorption reflow, and has high moisture resistance reliability.

Since the semiconductor device of the present invention is obtained by sealing a semiconductor element with the epoxy resin composition for sealing of the present invention, the semiconductor device has excellent resistance to moisture-absorbing solder cracks, package cracks after moisture-absorbing reflow, and It does not easily peel off and has high moisture resistance reliability.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI C08K 5/09 C08K 5/09 H01L 23/29 H01L 23/50 D 23/31 23/30 R 23/50

Claims (8)

[Claims] 1. A sealing epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator and a filler as essential components, wherein the epoxy resin is a dicyclopentadiene type epoxy resin represented by the following chemical formula (A): And at least a dicyclopentadiene-type phenolic resin represented by the following chemical formula (B) as the curing agent, and the compounding amount of the filler is 84% based on the total epoxy resin composition in terms of true specific gravity. An epoxy resin composition for encapsulation, characterized in that the proportion is up to 93% by weight. Embedded image (In the formula (A), n is an integer of 0 to 6; in the formula (B), 1 ≦ l
+ N ≦ 40, 1 ≦ m ≦ 15, 1 ≦ k ≦ 10, R = H, C
H ₃ or OH. ) 2. The dicyclopentadiene type epoxy resin is used in an amount of 4% with respect to all epoxy resins in the epoxy resin composition.
2. The dicyclopentadiene-type phenol resin is contained in a proportion of 0 to 100% by weight, and the dicyclopentadiene-type phenol resin is contained in a proportion of 40 to 100% by weight based on all curing agents in the epoxy resin composition. The epoxy resin composition for sealing according to the above. 3. A net volume percentage of the filler in the apparent volume of a molded product obtained by compression-molding the filler at a pressure at which the average particle diameter of the filler before compression molding is maintained after compression molding. The epoxy resin composition for sealing according to claim 1 or 2, wherein φ is 83% or more. 4. A resin component composed of the epoxy resin and the curing agent has a viscosity at 150 ° C. of 1 poise or less.
The epoxy resin composition for sealing according to any one of claims 1 to 3. 5. The sealing epoxy according to claim 1, wherein the curing accelerator contains at least one selected from the group consisting of a tertiary amine compound and an imidazole compound. Resin composition. 6. A method according to claim 1, wherein a fatty acid having 28 or less carbon atoms and / or a derivative thereof is added to the entire epoxy resin composition.
The epoxy resin composition for sealing according to any one of claims 1 to 5, further comprising 0.05 to 2% by weight. 7. A semiconductor device in which a semiconductor element is sealed with the epoxy resin composition for sealing according to any one of claims 1 to 6. 8. The semiconductor device is mounted on a lead frame. The lead frame includes a Cu alloy frame, a frame formed by plating a Cu alloy with Ni and Pd in order, and a Cu alloy formed of Ni, Pd and Au. 8. The semiconductor device according to claim 7, wherein the semiconductor device is selected from the group consisting of a frame formed by plating in order.