JP2009028923A5 - - Google Patents
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- Publication number
- JP2009028923A5 JP2009028923A5 JP2007192704A JP2007192704A JP2009028923A5 JP 2009028923 A5 JP2009028923 A5 JP 2009028923A5 JP 2007192704 A JP2007192704 A JP 2007192704A JP 2007192704 A JP2007192704 A JP 2007192704A JP 2009028923 A5 JP2009028923 A5 JP 2009028923A5
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- joining method
- polymerized film
- plasma polymerized
- joined body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims 30
- 239000000463 material Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000006116 polymerization reaction Methods 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 3
- 229920001795 coordination polymer Polymers 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000004381 surface treatment Methods 0.000 claims 2
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 230000035699 permeability Effects 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007192704A JP2009028923A (ja) | 2007-07-24 | 2007-07-24 | 接合方法、接合体および配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007192704A JP2009028923A (ja) | 2007-07-24 | 2007-07-24 | 接合方法、接合体および配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009028923A JP2009028923A (ja) | 2009-02-12 |
| JP2009028923A5 true JP2009028923A5 (zh) | 2010-07-22 |
Family
ID=40399997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007192704A Withdrawn JP2009028923A (ja) | 2007-07-24 | 2007-07-24 | 接合方法、接合体および配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009028923A (zh) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5047203B2 (ja) | 2009-02-10 | 2012-10-10 | パナソニック株式会社 | 監視カメラシステム、映像記録装置及び映像記録方法 |
| DE102010044114A1 (de) | 2010-11-18 | 2012-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Verbinden von Substraten und damit erhältliche Verbundstruktur |
| JP5613580B2 (ja) * | 2011-02-09 | 2014-10-22 | 三菱電機株式会社 | 基板の製造方法 |
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
| US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
| EP3071392B1 (de) * | 2013-11-19 | 2019-09-25 | Fraunhofer Gesellschaft zur Förderung der Angewand | Verfahren zum verbinden von silikongummi mit einem substrat |
| KR102353030B1 (ko) | 2014-01-27 | 2022-01-19 | 코닝 인코포레이티드 | 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법 |
| SG11201608442TA (en) | 2014-04-09 | 2016-11-29 | Corning Inc | Device modified substrate article and methods for making |
| KR102573207B1 (ko) | 2015-05-19 | 2023-08-31 | 코닝 인코포레이티드 | 시트와 캐리어의 결합을 위한 물품 및 방법 |
| CN117534339A (zh) | 2015-06-26 | 2024-02-09 | 康宁股份有限公司 | 包含板材和载体的方法和制品 |
| TW201825623A (zh) | 2016-08-30 | 2018-07-16 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| WO2019036710A1 (en) | 2017-08-18 | 2019-02-21 | Corning Incorporated | TEMPORARY BINDING USING POLYCATIONIC POLYMERS |
| JP7431160B2 (ja) | 2017-12-15 | 2024-02-14 | コーニング インコーポレイテッド | 基板を処理するための方法および結合されたシートを含む物品を製造するための方法 |
| JP7200916B2 (ja) * | 2019-12-10 | 2023-01-10 | トヨタ自動車株式会社 | 溶着接合方法および溶着接合体 |
-
2007
- 2007-07-24 JP JP2007192704A patent/JP2009028923A/ja not_active Withdrawn
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