JP2009016430A - Holding jig and peeling method for thin plate body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding jig and a peeling method for a thin plate body, wherein the thin plate body which is adhesively held can be peeled in a deformation-free state with simple constitution or without requiring a complicated device. <P>SOLUTION: The holding jig 1 has a projection member 12 having atop an adhesive portion 14 where the thin plate body 5 can be adhesively held and a plate member 30 having a non-adhesive portion 32 on a surface, and the plate member 30 is disposed to move relatively to and away from the projection member 12. When the thin plate body 5 adhesively held by the holding jig 1 is peeled, the plate member 30 is moved relatively to the projection member 12 along the axis thereof and the thin plate body 5 is peeled off the adhesive portion 14 of the projection member 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a holding jig and a thin plate-like material peeling method, and more specifically, a holding jig capable of peeling an adhesively held thin plate-like material without deforming it with a simple configuration, and a complicated apparatus It is related with the peeling method of the thin plate-shaped object which can be peeled without deform | transforming the thin plate-shaped material with which adhesion was hold | maintained.

  Conventionally, thin plate-like materials such as silicon wafers, flexible printed boards, glass plates for large screen display devices, films, etc. are generally difficult to hold or easily damaged, so they are fixed to holding jigs, etc. For example, manufacturing processes such as a polishing process, a pattern forming process, and a dicing process, conveyance between manufacturing processes, and / or storage are performed.

  These thin plate-like materials are held by the holding jig during the manufacturing process, during the transportation between the manufacturing processes, and / or during storage, etc., while the manufacturing process is finished, after the transportation, and / or After storage, it is removed from the holding jig. Therefore, the holding jig is required to have a characteristic of sticking and holding a thin plate-like object as desired and a characteristic of easily removing the thin plate-like object when necessary.

  As such a holding jig, for example, “in a substrate holding chuck for holding a substrate by vacuum suction, a wall that forms a negative pressure when the substrate is vacuum-sucked, and a deformation of the substrate during the vacuum suction” A substrate holding chuck characterized in that a plurality of auxiliary supports that suppress the above-described problem, and at least an auxiliary support of the wall body and the auxiliary support is formed to protrude on the surface of the glass substrate (Patent Document). 1).

  Further, as another holding jig, for example, “a device for peeling a flexible substrate attached to a pressure-sensitive adhesive sheet in which a plurality of holes are formed from the pressure-sensitive adhesive sheet, and a blowing means for blowing compressed air into the holes. A flexible substrate peeling apparatus characterized in that it is provided "(see Patent Document 2).

  However, the substrate holding chuck described in Patent Document 1 may be deformed due to the substrate being damaged or broken by the auxiliary support. Further, since this substrate holding chuck fixes the substrate by vacuum suction, it is necessary to always perform vacuum suction during the manufacturing process, during transportation between the manufacturing processes, and / or during storage, especially the substrate. When the mass of is large, it is necessary to increase the degree of vacuum. Therefore, this substrate holding chuck requires a high voltage, and electric charges may remain on the thin plate-like object removed from the holding device, and the structure and manufacturing method of the holder itself are complicated and expensive. . Furthermore, since the substrate holding chuck fixes the substrate by vacuum suction, it cannot be used in a reduced pressure environment or a vacuum environment, and its application may be limited. For example, as a method of applying various compositions such as a liquid crystal composition on a substrate, in order to prevent bubbles or the like from entering the inside or the surface of the applied various compositions, A method of applying various compositions may be employed. When this method is employed, the substrate holding chuck described in Patent Document 1 cannot be used as a jig for holding the substrate.

  Moreover, since the peeling apparatus described in Patent Document 2 attaches a flexible substrate to an adhesive sheet, even if it can prevent the flexible substrate from being damaged or broken to some extent, a film or the like can be used instead of the flexible substrate. When a thin plate-like material having high flexibility is used, the thin plate-like material may be deformed due to the undulation phenomenon of the thin plate-like material on the pressure-sensitive adhesive sheet due to the blown-out compressed air. Moreover, this peeling apparatus requires a blowing means in addition to the adhesive sheet, and the structure of the peeling apparatus itself is complicated and expensive. Moreover, since this peeling apparatus peels a flexible substrate by blowing a compressed air, it also has the fault that the use may be limited.

JP 2000-286329 A JP 2006-156793 A

  It is an object of the present invention to provide a holding jig that can be peeled off without deforming a thin plate-like object that is adhesively held with a simple configuration.

  It is another object of the present invention to provide a method for peeling a thin plate-like material that does not require a complicated device and can peel the thin plate-like material held by adhesion without causing deformation.

As means for solving the problems,
The first aspect includes a protruding member having an adhesive portion on the top surface capable of sticking and holding a thin plate-like object and a plate-like member having a non-adhesive portion on the surface, and the plate-like member is attached to the protruding member. It is a holding jig characterized by being arranged so as to be able to move forward and backward relatively,
A second aspect of the present invention is the holding jig according to the first aspect, wherein the plate-like member is formed with a through hole through which the protruding member passes.
A third aspect of the present invention relates to a method for peeling a thin plate-like object adhered and held by the protruding member in the holding jig according to claim 1 or 2, wherein the plate-like member is relative to the protruding member. In addition, the thin plate-like object peeling method is characterized in that the thin plate-like object is moved forward in the axial direction to separate the thin plate-like object from the projecting member.

  Since the holding jig according to the present invention includes the protruding member and the plate-like member, the structure is simple, but has a non-adhesive portion on the surface of the plate-like member. The thin plate-like object that is adhesively held by the sticking part of the protruding member can be uniformly peeled from the sticking part of the protruding member by the smooth non-sticking part. As a result, when the thin plate-like object is peeled from the holding jig, it is possible to effectively prevent deformation due to bending, breakage or damage of the thin plate-like material. Therefore, according to the present invention, with a simple configuration, a holding jig that can be peeled off without deforming an adhesively held thin plate-like object, and a thin plate-like object that is adhesively held without requiring a complicated device. It is possible to provide a method for peeling a thin plate that can be peeled without being deformed.

  The holding jig according to the present invention includes a protruding member and a plate-like member. For example, a thin plate-like object is adhered and held on the adhesive portion, and the thin plate-like object is manufactured, transported, and / or stored. Used when The thin plate-like object held by the holding jig according to the present invention is a thin plate-like object that needs to be held by the holding jig according to the present invention, and is easily damaged or damaged, or broken. It is advantageous to use a thin plate or the like that is easily deformed by the above. Examples of the thin plate-like material include a silicon wafer, a flexible printed board, a glass plate for a large screen display device, a film, a glass epoxy substrate, and a resin substrate. The thin plate is preferably a highly flexible film in that the object of the present invention can be satisfactorily achieved. Examples of such a highly flexible film include a polyester film and a polyimide film used for a flexible printed circuit board, a film for a large screen display device, and the like. In the present invention, the thin plate-like object may be held by sticking alone on the holding jig, or a plurality of thin plate-like objects may be held by sticking simultaneously.

  A holding jig 1 as an embodiment of the holding jig according to the present invention will be described with reference to the drawings. As shown in FIG. 3A, the holding jig 1 includes a substrate 10 on which a plurality of projecting members 12 having an adhesive portion 14 on the top surface capable of sticking and holding a thin plate is disposed, and a non- The plate-shaped member 30 having the adhesive portion 32 on the surface and the reinforcing member 20 are provided.

  The board | substrate 10 is shape | molded by the disk-shaped body which comprises a square, as FIG. 1 shows. The substrate 10 can be formed into an arbitrary shape according to the shape of the thin plate-like object, its manufacturing process, handleability, etc., for example, a polygon such as a quadrangle, a pentagon, a hexagon, a circle, an ellipse, etc. , An indefinite shape, or a combination of these.

  As shown in FIG. 1, a plurality of projecting members 12 projecting from one surface of the substrate 10 are arranged on the one surface of the substrate 10 at approximately equal intervals in the longitudinal direction and the lateral direction, respectively. In this example, as shown in FIG. 1B, eleven protruding members 12 are arranged in each of the vertical direction and the horizontal direction. Each of the projecting members 12 preferably has their axes parallel to each other in that a thin plate-like object can be adhered and held as desired, and the non-adhesive portion 32 of the plate-like member 30 to be described later. On the other hand, it is preferable that the lengths in the axial direction are the same in that the thin plate-like object can be adhered and held in parallel. The length in the axial direction of the protruding member 12 may be adjusted to such a length that the plate-like member 30 described later can be moved forward and backward relative to the protruding member 12. It is adjusted to a length longer than the thickness.

  The protruding member 12 only needs to be formed so as to protrude from the surface of the substrate 10, and the cross-sectional shape when cut along a plane perpendicular to the axial direction is not particularly limited. For example, as shown in FIG. As shown, it may be a square, a polygon such as a triangle, pentagon, or hexagon, a circle, an ellipse, an indeterminate shape, or a cross-sectional shape combining these. The cross-sectional area of the cross section of the protruding member 12 is adjusted to a cross-sectional area that can hold the thin plate-like object in a desired manner when the adhesive portion 14 is formed on the top surface of the protruding member 12, for example. Is done.

  The protruding member 12 has an adhesive portion 14 at least on the top surface. When the adhesive member 14 is provided on at least the top surface of the protruding member 12, the thin plate-like object can be uniformly adhered and held by a plurality of flat top surfaces. The adhesion part 14 should just be formed in the at least top surface (tip surface) of the protrusion member 12 so that a thin plate-shaped object can be adhesively held, and it forms in a part or whole surface of the top surface in the protrusion member 12. Moreover, the adhesion part 14 may be formed in the whole protrusion member 12 (top surface and side surface). The adhesive portion 14 is the entire surface of the top surface of the projecting member 12 because it is easy to manufacture, can hold the thin plate-like material in a desired manner, and can easily and reliably peel the thin-plate material. Is preferably formed. The adhesion part 14 should just be formed in the dimension which can carry out adhesion holding | maintenance of a thin plate-shaped object, the adhesive force of the adhesive material which forms the adhesion part 14, the number of arrangement | positioning of the protrusion member 12, the axial direction in the protrusion member 12 For example, the contact area in contact with the thin plate-like object is appropriately adjusted according to the cross-sectional area and the like.

The adhesive part 14 only needs to have an adhesive force sufficient to hold the thin plate-like object. For example, the holding jig 1 is inclined at least 90 degrees in a state where the thin plate-like object is adhesively held on the adhesive part 14. It is preferable that the adhesive has sufficient adhesive strength to hold the thin plate. In particular, when the holding jig 1 is rotated 180 degrees so that the adhesive portion 14 faces downward, the adhesive force sufficient to hold the thin plate-like object, that is, the own weight per unit area of the thin plate-like material. (g / mm ²⁾ preferably has a large adhesive strength (g / mm ²⁾ than. When the adhesive portion 14 has such an adhesive force, the thin plate-like object can be reliably held on the holding jig 1. Although the specific adhesive force of the adhesion part 14 is determined according to the self-weight, size, etc. of a thin plate-shaped object, it is preferable that it is 1-60 (g / mm < ² >), for example, 2-40 (g / Mm ² ) is more preferable, and 4 to 20 (g / mm ² ) is particularly preferable.

Here, the adhesive strength of the adhesive portion 14 is obtained as follows. First, a smooth pressure-sensitive adhesive sheet is prepared in the same manner using the pressure-sensitive adhesive material that forms the pressure-sensitive adhesive portion 14. An adsorption fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for horizontally fixing the adhesive sheet, and a column having a diameter of 10 mm are formed at the tip of the measurement unit. A load measuring device equipped with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) to which a contact made of stainless steel (SUS304) is attached is prepared. An adhesive sheet is fixed on this test stand, and the measurement environment is set to 21 ± 1 ° C. and humidity 50 ± 5%. Next, the contact attached to the load measuring device is lowered until it comes into contact with the measurement site of the adhesive sheet at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the measurement site. Press vertically for 3 seconds against the site. Here, the predetermined load is set to 25 g / mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of measurement sites, and the obtained plurality of separation loads are arithmetically averaged, and the obtained average value is used as the adhesive strength of the adhesive portion 14. This measurement method may be performed manually, for example, using a test stand (for example, trade name: VERTICAl MODEL MOTORIZED STAND series, manufactured by Imada Co., Ltd.) or the like. .

  The pressure-sensitive adhesive part 14 should have a certain degree of elasticity while adhering and holding a thin plate-like object, and preferably has a hardness of 5 to 60 (JIS K6253 [durometer E]), for example. Particularly preferred is a hardness of 15 to 45.

  Examples of the adhesive material forming the adhesive portion 14 include various elastomers such as silicone rubber, fluorine rubber, urethane elastomer, natural rubber, and styrene-butadiene copolymer elastomer, but silicone having excellent strength and weather resistance. Rubber, fluorine rubber, etc. are preferable. As said silicone rubber, the silicone rubber composition containing hardening | curing agents, such as organopolysiloxane, a silica type filler, and a peroxide, is mentioned, for example. As such a silicone rubber composition, for example, trade names “KE-520U”, “KE-530U” and the like are available from Shin-Etsu Chemical Co., Ltd. Examples of the fluorine rubber include a fluorine rubber containing a vinylidene fluoride / hexafluoropropylene copolymer, a filler such as carbon, a crosslinking aid such as trialisocyanate, and a curing agent such as peroxide. A composition. As such a fluorinated rubber composition, for example, trade names “DC-2050”, “DC-2260” and the like are available from Daikin Industries, Ltd.

  As shown in FIG. 1, the substrate 10, the protruding member 12, and the adhesive portion 14 are integrally formed of the adhesive material. That is, the substrate 10, the protruding member 12, and the adhesive portion 14 all have the adhesive force. Thus, when the board | substrate 10, the protrusion member 12, and the adhesion part 14 are integrally formed, the surface of the board | substrate 10 also becomes an adhesion part, and the plate-shaped member 30 mentioned later is adhesively hold | maintained on the surface of the board | substrate 10. Unnecessary movement of the plate member 30 can be suppressed. The substrate 10, the projecting member 12, and the adhesive portion 14 are produced by molding the above material by a known molding method or the like and curing it.

  The reinforcing member 20 supports the substrate 10 flatly. As shown in FIG. 1B, the reinforcing member 20 is a disk-like body that has a square shape like the substrate 10. However, if the substrate 10 can be supported flatly, the reinforcing member 20 has a shape different from that of the substrate 10. It may be formed. The reinforcing member 20 is formed of a material having a strength capable of supporting the substrate 10 flatly. Examples of such a material include metals such as carbon steel, stainless steel, aluminum alloy, and nickel alloy, polystyrene, and epoxy. Examples thereof include resins such as resin, polyvinyl chloride, methacrylic resin, polyimide, polyethylene terephthalate, and polyamide. The reinforcing member 20 is manufactured by, for example, various molding methods such as vacuum molding, injection molding, and die molding, and various metal processing methods such as rolling, cutting, grinding, and welding.

  As shown in FIG. 2, the plate-like member 30 is a disk-like body having a square shape, like the substrate 10. When the plate-shaped member 30 is the holding jig 1, the through holes 34 through which the protruding members 12 of the substrate 10 penetrate are arranged in the vertical direction at substantially equal intervals so that the arrangement is the same as the arrangement of the protruding members 12. And it is drilled in the state arranged in the horizontal direction. These through holes 34 are formed so as to have an opening area equal to or larger than the cross-sectional area of the cross section of the protruding member 12.

Then, the surface of the plate-like member 30 (the surface other than the opening of the through-hole 34, that is, in the plate-like member 30, between the peripheral portion surrounding the aggregate of the plurality of through-holes 34 and the plurality of through-holes 34. The existing lattice-like surface) is the non-adhesive portion 32. The non-adhesive part 32 includes a case where it does not have an adhesive force and a case where it has an adhesive force to such an extent that it cannot stick and hold a thin plate by itself. For example, the adhesive strength to such an extent that the thin plate-like material cannot be adhesively held by itself is less than 1 (g / mm ² ) in the measurement method.

  As described above, when the surface of the plate-like member 30 is the non-adhesive portion 32, the plurality of non-adhesive portions 32 are on the same plane even if the plate-like member 30 is moved relatively in the axial direction of the protruding member 12. Therefore, even if the thin plate attached to the adhesive portion 14 of the protruding member 12 is a thin plate, the thin plate can be uniformly peeled from the adhesive portion 14 in the same plane. The shape is not deformed.

  The thickness of the plate-like member 30 only needs to be large enough to move back and forth in the axial direction of the protruding member 12 when the holding jig 1 is used. The thickness is adjusted to be smaller than the length in the axial direction. The plate-like member 30 is a material having a strength that can maintain smoothness when peeling a thin plate-like object, and is manufactured by the various forming methods or the various metal processing methods. As such a material, for example, various materials mentioned in the reinforcing member 20 can be cited.

  As shown in FIG. 3A, in the holding jig 1, the reinforcing member 20 is fixed to the surface of the substrate 10 on the side where the protruding member 12 is not disposed by the adhesive force of the substrate 10 and / or an adhesive or the like. The plate-like member 30 is arranged on the surface of the substrate 10 on the side where the protruding member 12 is arranged so that each protruding member 12 passes through each through hole 34. Thus, when the board | substrate 10 and the plate-shaped member 30 are arrange | positioned, the plate-shaped member 30 will be able to move back and forth relatively with respect to the protrusion member 12, and the thin plate-shaped object currently adhere | attached and hold | maintained at the adhesion part 14 Can be peeled off as desired.

  Next, a method of handling the silicon wafer 5 as a thin plate using the holding jig 1 will be described. Before handling the silicon wafer 5, the substrate 10, the reinforcing member 20, and the plate-like member 30 are arranged in the initial state shown in FIG. In order to adhere and hold the silicon wafer 5 to the holding jig 1, the silicon wafer 5 is placed on the adhesive portions 14 of the plurality of protruding members 12 in the holding jig 1 and, if necessary, the placed silicon wafer 5 is adhered. Press against part 14. Then, since the adhesive portion 14 has the adhesive force, the silicon wafer 5 is uniformly and flatly held on the adhesive portion 14 as shown in FIG.

  In order to peel the silicon wafer 5 from the holding jig 1 after the silicon wafer 5 adhered and held by the holding jig 1 in this way is subjected to a desired manufacturing process or after being transferred, the surface of the substrate 10 is separated. The plate-like member 30 adhered to the substrate 10 is separated from the surface of the substrate 10 and moved forward relative to the protruding member 12 in the axial direction thereof, that is, in the direction of the arrow A shown in FIG. To move forward. In other words, the substrate 10 and the reinforcing member 20 are moved backward in the direction of moving backward relative to the plate member 30 in the axial direction of the protruding member 12, that is, in the direction opposite to the arrow A shown in FIG. Let Then, the plate-like member 30 moves forward relative to the protruding member 12 in the axial direction, and is in a state shown in FIG. When the plate-like member 30 is continuously advanced along the axial direction of the protruding member 12, the non-adhesive portion 32 of the plate-like member 30 comes into contact with the bottom surface of the silicon wafer 5 held by the adhesive portion 14 of the protruding member 12. When the plate-shaped member 30 is further advanced, the silicon wafer 5 is peeled from the adhesive portion 14 of the protruding member 12 by the non-adhesive portion 32 in contact with the bottom surface thereof as shown in FIG. In the state shown in FIG. 3D, the silicon wafer 5 is only located on the surface of the non-adhesive portion 32, so that the silicon wafer 5 is held if the holding jig 1 is tilted or inverted. Detach from the jig 1. In this way, the silicon wafer 5 can be peeled from the holding jig 1.

  Thus, since the holding jig 1 does not require the vacuum suction mechanism or the blowing means for blowing out the compressed air in order to peel off the silicon wafer 5, its configuration is simple. Nevertheless, the holding jig 1 uniformly peels the silicon wafer 5 adhered and held on the adhesive part 14 of the protruding member 12 from the adhesive part 14 in the same plane by the non-adhesive part 32 of the plate-like member 30. Therefore, even a highly flexible thin plate can effectively prevent deformation due to breakage, breakage, or damage of the thin plate when peeling from the holding jig 1. . In addition, when the silicon wafer 5 is held and peeled, there is no need to forcibly and irreversibly increase or decrease the adhesive force of the adhesive portion 14, so that a thin plate can be repeatedly held by sticking. . Furthermore, the holding jig 1 does not require a special device, and enables the adhesive holding and peeling of the silicon wafer 5 by simply moving the plate-like member 30 relative to the protruding member 12. The use environment of the holding jig 1 is not particularly limited, and can be used not only in a normal pressure environment but also in a reduced pressure environment or a pressurized environment. Therefore, according to the holding jig 1, the silicon wafer 5 can be adhesively held as desired, and a thin plate shape without causing deformation due to bending, breakage, damage or the like at the time of peeling. Objects can be easily peeled off.

  As shown in FIG. 4, the holding jig 2, which is another embodiment of the holding jig according to the present invention, has a plurality of protrusions having an adhesive portion 15 on the top surface capable of sticking and holding a thin plate. It comprises a substrate (not shown in FIG. 4) on which the member 13 is disposed, a plate-like member 31 having a non-adhesive portion 33 on its surface, and a reinforcing member (not shown in FIG. 4).

  As shown in FIG. 4, this substrate has a wall-like protruding member 13 that protrudes from one surface of the substrate and extends in one direction of the substrate. The structure is basically the same as that of the substrate 10.

  Further, the reinforcing member disposed on the side of the substrate on which the protruding member 13 is not formed is basically the same as the reinforcing member 20.

  As shown in FIG. 4, when the plate-shaped member 31 is a holding jig 2, a through-hole 35 through which the protruding member 13 of the substrate penetrates extends in one direction of the plate-shaped member 31. The plate member 30 is basically the same as the plate member 30 except that it is perforated.

  The holding jig 2 can hold and peel a thin plate-like object in the same manner as the holding jig 1. Therefore, according to the holding jig 2, the silicon wafer 5 can be adhesively held as desired, and a thin plate shape without causing deformation due to bending, breakage, damage or the like at the time of peeling. Objects can be easily peeled off.

  A substrate 11, which is another embodiment of the substrate used in the holding jig according to the present invention, is provided with a plurality of protruding members 13 having an adhesive portion 16 on the top surface capable of adhesively holding a thin plate. Become. The substrate 11 is formed of the metal or the resin that forms the reinforcing member 20, and the adhesive portion 16 that is formed by curing the adhesive material that forms the adhesive portion 14 on the top surface of each protruding member 13. Except for being formed, the substrate 10 is basically configured in the same manner.

  Therefore, since this board | substrate 11 can support the protrusion member 13 by itself flat and parallel, when this board | substrate 11 is employ | adopted as a board | substrate of a holding jig, a reinforcement member is not especially required.

  The adhesive portion 16 is basically formed in the same manner as the adhesive portion 14 except that the adhesive portion 16 is formed separately from the material different from the substrate 11. Therefore, the adhesion part 16 should just be formed in the at least top surface of the protrusion member 13, and may be formed in a part of the top surface in the protrusion member 13, or the whole surface. The adhesive part 16 preferably has a flat surface, and preferably has a thickness of about 0.05 to 2 mm. If the thickness of the adhesive portion 16 is less than 0.05 mm, the mechanical strength of the adhesive portion 16 is lowered, and the durability of the adhesive portion 16 may not be sufficient. On the other hand, if the thickness exceeds 2 mm, a plurality of adhesive portions In some cases, the top surfaces of the plurality of adhesive portions 16 cannot be flattened by uniformly adjusting the thickness at 16.

  For example, the adhesive portion 16 can be applied to the top surface of the protruding member 13 and cured to form the adhesive material on the top surface of the protruding member 13. A cured body formed by curing into a shape can be formed on the top surface of the projecting member 13 by being brought into close contact with the top surface of the projecting member 13 with its adhesive force and / or adhesive.

  If this substrate 11 is adopted, even if the adhesive portion 16 is deteriorated or damaged, the substrate 11 can be regenerated by replacing only the deteriorated or damaged adhesive portion 16.

  The holding jig in the present invention is not limited to the above-described embodiments, and various modifications can be made as long as the object of the present invention can be achieved. For example, the holding jigs 1 and 2 adhere and hold one silicon wafer 5 as shown in FIG. 3, for example. In the present invention, one thin plate-like object is held by a plurality of holding jigs. Adhesive holding may be performed, and a plurality of thin plate-like objects may be adhesively held with one holding jig.

  The substrates 10 and 11 each have a plurality of protruding members 12 arranged at substantially equal intervals in the vertical and horizontal directions, and the substrate of the holding jig 2 has a plurality of protruding members 13 substantially equal. 11 are arranged at intervals in the horizontal direction in FIG. 4, but in this invention, the arrangement pattern and the number of protruding members arranged on the substrate are not particularly limited, and the size, number, etc. of the thin plate-like objects to be adhesively held According to the above, it is adjusted appropriately. For example, the arrangement pattern of the projecting member may be a concentric or radial pattern.

  Further, the plate-like members 30 and 31 are formed of a non-adhesive material, and the surfaces themselves are non-adhesive portions 32 and 33. In the present invention, the non-adhesive portion of the plate-like member is, for example, The surface of the plate-like member may be formed by cross-linking or curing non-adhesive materials such as various resins or various rubbers, or applying a release agent or the like.

FIG. 1 is a schematic view showing a substrate and a reinforcing member in a holding jig which is an embodiment of the holding jig according to the present invention, and FIG. 1A is an embodiment of the holding jig according to the present invention. It is a schematic top view which shows the board | substrate and reinforcement member in a certain holding jig, FIG.1 (b) is a schematic fragmentary sectional view which shows a part of cross section in the AA line of Fig.1 (a). FIG. 2 is a schematic view showing a plate-like member in a holding jig which is an embodiment of the holding jig according to the present invention, and FIG. 2A is an embodiment of the holding jig according to the present invention. It is a schematic top view which shows the plate-shaped member in a holding jig, FIG.2 (b) is a general | schematic fragmentary sectional view which shows a part of cross section in the BB line of Fig.2 (a). FIG. 3 is a partial explanatory view for explaining a method of using a holding jig which is an embodiment of the holding jig according to the present invention. FIG. 3A is an embodiment of the holding jig according to the present invention. It is explanatory drawing explaining the initial state of a certain holding jig, FIG.3 (b) is explanatory drawing explaining the state which adhered and hold | maintained the silicon wafer to the holding jig which is one Example of the holding jig which concerns on this invention. FIG. 3C is an explanatory view for explaining a state in which the plate-like member in the holding jig which is an embodiment of the holding jig according to the present invention is moved relative to the protruding member. 3 (d) is an explanatory view for explaining a state in which the silicon wafer adhered and held by the holding jig which is an embodiment of the holding jig according to the present invention is peeled off. FIG. 4 is a schematic top view showing a holding jig which is another embodiment of the holding jig according to the present invention. FIG. 5 is a schematic cross-sectional view for explaining a modification of the substrate in the holding jig according to the present invention.

Explanation of symbols

1, 2 Holding jig 5 Silicon wafer 10, 11 Substrate 12, 13 Protruding member 14, 15, 16 Adhesive part 20 Reinforcing member 30, 31 Plate-like member 32, 33 Non-adhesive part 34, 35 Through hole

Claims (3)

  A projecting member having an adhesive portion on the top surface capable of adhering and holding a thin plate-like object; and a plate-like member having a non-adhesive portion on the surface thereof, wherein the plate-like member is relative to the projecting member. A holding jig which is arranged so as to be able to move forward and backward.   The holding jig according to claim 1, wherein the plate-like member has a through-hole through which the protruding member passes.   It is a method of peeling the thin plate-shaped object adhere | attached and hold | maintained at the said protrusion member in the holding jig of Claim 1 or 2, Comprising: The said plate-like member is the axial direction relatively with respect to the said protrusion member. The method for peeling a thin plate-like object is characterized in that the thin plate-like object is moved away from the projecting member.

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