JP2008545997A - プロジェクタ - Google Patents
プロジェクタ Download PDFInfo
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- JP2008545997A JP2008545997A JP2008510393A JP2008510393A JP2008545997A JP 2008545997 A JP2008545997 A JP 2008545997A JP 2008510393 A JP2008510393 A JP 2008510393A JP 2008510393 A JP2008510393 A JP 2008510393A JP 2008545997 A JP2008545997 A JP 2008545997A
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- Prior art keywords
- light
- optical element
- sin
- luminescence diode
- diode chip
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- 230000003287 optical effect Effects 0.000 claims abstract description 250
- 238000004020 luminiscence type Methods 0.000 claims abstract description 146
- 230000005855 radiation Effects 0.000 claims abstract description 29
- 230000008878 coupling Effects 0.000 claims abstract description 27
- 238000010168 coupling process Methods 0.000 claims abstract description 27
- 238000005859 coupling reaction Methods 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims description 68
- 239000010409 thin film Substances 0.000 claims description 33
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 230000005670 electromagnetic radiation Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 230000003595 spectral effect Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 238000000407 epitaxy Methods 0.000 description 6
- 239000012778 molding material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- -1 carbon fiber compound Chemical class 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- GTDCAOYDHVNFCP-UHFFFAOYSA-N chloro(trihydroxy)silane Chemical compound O[Si](O)(O)Cl GTDCAOYDHVNFCP-UHFFFAOYSA-N 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- BLNMQJJBQZSYTO-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu][Mo][Cu] BLNMQJJBQZSYTO-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052605 nesosilicate Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000004762 orthosilicates Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical class [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0977—Reflective elements
- G02B27/0983—Reflective elements being curved
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/315—Modulator illumination systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Led Device Packages (AREA)
- Projection Apparatus (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (25)
- 1つの光変調器と少なくとも1つの光源とを備えており、該光変調器は面積AMおよび入射光の最大受容角αの受光面を備えた光受信領域を有し、該光源は駆動により光受信領域の受光面を照明するコーンビームを形成しかつそれぞれ面積ADおよび最大放射角βの光出力面を備えたN個のルミネセンスダイオードチップを有する、
プロジェクタにおいて、
ルミネセンスダイオードチップと光変調器とのあいだの光路に少なくとも1つの光学素子が配置されており、該光学素子とルミネセンスダイオードチップとの間の光路に所定のガスの充填された空隙が存在しており、
ルミネセンスダイオードチップの光出力面に結合媒体が存在しない場合、式0.7*(AM*sin2(α))/(AD*sin2(β)*n2)≦N≦1.3*(AM*sin2(α))/(AD*sin2(β)*n2)が成り立ち、n=1である
ことを特徴とするプロジェクタ。 - 1つの光変調器と少なくとも1つの光源とを備えており、該光変調器は面積AMおよび入射光の最大受容角αの受光面を備えた光受信領域を有し、該光源は駆動により光受信領域の受光面を照明するコーンビームを形成しかつそれぞれ面積ADおよび最大放射角βの光出力面を備えたN個のルミネセンスダイオードチップを有する、
プロジェクタにおいて、
ルミネセンスダイオードチップと光変調器とのあいだの光路に少なくとも1つの光学素子が配置されており、
ルミネセンスダイオードチップの光出力面に結合媒体が存在する場合、式0.7*(AM*sin2(α))/(AD*sin2(β)*n2)≦N≦1.3*(AM*sin2(α))/(AD*sin2(β)*n2)が成り立ち、nは結合媒体の材料の屈折率に等しい
ことを特徴とするプロジェクタ。 - ルミネセンスダイオードチップは電磁放射を発光する活性領域を含む薄膜層列を有しており、該薄膜層列は成長基板から分離されており、該薄膜層列の主発光面の反対側にリフレクタが設けられている、請求項1または2記載のプロジェクタ。
- 光変調器の光受信領域の受光面は面積AM、長さlMおよび幅bMを有しており、ルミネセンスダイオードチップはx行y列のマトリクス状に配置されており、ルミネセンスダイオードチップの薄膜層列の主発光面は長さlDおよび幅bDを有しており、ここで0.7*(lM*sin(α))/(lD*sin(β)*n)≦x≦1.3*(lM*sin(α))/(lD*sin(β)*n)および0.7*(bM*sin(α))/(bD*sin(β)*n)≦y≦1.3*(bM*sin(α))/(bD*sin(β)*n)が成り立つ、請求項3記載のプロジェクタ。
- 個数Nまたはxまたはyの値は商(AM*sin2(α))/(AD*sin2(β)*n2),商(lM*sin(α))/(lD*sin(β)*n)または商(bM*sin(α))/(bD*sin(β)*n)を最も近い整数へ切り上げるか切り下げたものである、請求項1から4までのいずれか1項記載のプロジェクタ。
- 個数Nまたはxまたはyの値は前記商を最も近い偶数に切り上げるかまたは切り下げたものである、請求項5記載のプロジェクタ。
- ルミネセンスダイオードチップの主発光面はほぼ長方形の形状を有する、請求項1から6までのいずれか1項記載のプロジェクタ。
- 複数のルミネセンスダイオードチップに共通に1つの光学素子が対応する、請求項1から7までのいずれか1項記載のプロジェクタ。
- 複数のルミネセンスダイオードチップが少なくとも2つのグループに分割されており、該グループごとに1つの光学素子が対応する、請求項1から7までのいずれか1項記載のプロジェクタ。
- 少なくとも一部のルミネセンスダイオードチップの後方にルミネセンス変換素子が配置されている、請求項1から9までのいずれか1項記載のプロジェクタ。
- 各ルミネセンスダイオードチップの後方に種々の材料から成る各ルミネセンス変換素子が配置されている、請求項10記載のプロジェクタ。
- 光学素子は、通常とは反対方向に光を透過する非結像型の光コンセントレータの形態に構成されている、請求項1から11までのいずれか1項記載のプロジェクタ。
- 光コンセントレータはCPC状、CEC状またはCHC状の集光器である、請求項12記載のプロジェクタ。
- 光学素子の反射面は部分的にまたは完全に自由形状面として形成されている、請求項12または13記載のプロジェクタ。
- 光学素子の光入力側と光出力側とを接続する側壁は、該光入力側と該光出力側とを結ぶ接続線がほぼ直線状に延在するように形成されている、請求項12記載のプロジェクタ。
- 光学素子は中空室を有するベースボディを有しており、該ベースボディの中空室を定義する内壁は光源から発光される光のスペクトル領域の少なくとも一部に対して反射性である、請求項12から14までのいずれか1項記載のプロジェクタ。
- 光学素子は誘電性光コンセントレータの形態に構成されており、該誘電性光コンセントレータのベースボディは適切な屈折率を有する誘電性材料から成る中実体であり、光学素子へ入力される光はベースボディの光入力側と光出力側とを接続する側面と周囲媒体との界面で全反射により反射される、請求項12から14までのいずれか1項記載のプロジェクタ。
- 光学素子はレンズ状の曲面である界面を備えた光出力側を有する、請求項12から17までのいずれか1項記載のプロジェクタ。
- 一定の断面積を有するかまたは光出力側へ向かって増大する断面積を有する光混合のための光導波体として光学素子を構成するか、または、光学素子の後方の光路に少なくとも1つのこの種の光導波体を配置する、請求項1から11までのいずれか1項記載のプロジェクタ。
- 光学素子を光出力側へ向かって低下する断面積を有する光混合のための光導波体として構成するか、または、光学素子の後方の光路に少なくとも1つのこの種の光導波体を配置する、請求項1から11までのいずれか1項記載のプロジェクタ。
- 一部の隣接するルミネセンスダイオードチップ間または全ての隣接するルミネセンスダイオードチップ間に0μm以上300μm以下の間隔が設けられている、請求項1から20までのいずれか1項記載のプロジェクタ。
- 一部の隣接するルミネセンスダイオードチップ間または全ての隣接するルミネセンスダイオードチップ間に0μm以上100μm以下の間隔が設けられている、請求項21記載のプロジェクタ。
- 光学素子は光出力側を有する一方の側にほぼ長方形の断面を有する、請求項1から22までのいずれか1項記載のプロジェクタ。
- 光学素子は第1の面に沿って第1の最大放射角を有し、第2の面に沿って第1の最大放射角とは異なる第2の最大放射角を有する、請求項1から23までのいずれか1項記載のプロジェクタ。
- 第1の最大放射角は10°以上13°以下であり、第2の最大放射角は13°以上18°以下である、請求項24記載のプロジェクタ。
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WO2006119723A1 (de) | 2006-11-16 |
US20080192153A1 (en) | 2008-08-14 |
US8189123B2 (en) | 2012-05-29 |
KR20080012964A (ko) | 2008-02-12 |
DE102005031336A1 (de) | 2006-11-16 |
KR101210366B1 (ko) | 2012-12-10 |
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