JP2008537643A5 - - Google Patents
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- Publication number
- JP2008537643A5 JP2008537643A5 JP2008504746A JP2008504746A JP2008537643A5 JP 2008537643 A5 JP2008537643 A5 JP 2008537643A5 JP 2008504746 A JP2008504746 A JP 2008504746A JP 2008504746 A JP2008504746 A JP 2008504746A JP 2008537643 A5 JP2008537643 A5 JP 2008537643A5
- Authority
- JP
- Japan
- Prior art keywords
- temporary substrate
- foil
- cutting line
- width
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05075792 | 2005-04-06 | ||
| US67628605P | 2005-05-02 | 2005-05-02 | |
| PCT/EP2006/061206 WO2006106072A1 (en) | 2005-04-06 | 2006-03-31 | Process for manufacturing pieces of a foil having an inorganic coating of e. g. tco |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008537643A JP2008537643A (ja) | 2008-09-18 |
| JP2008537643A5 true JP2008537643A5 (enExample) | 2009-05-21 |
Family
ID=35063187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008504746A Pending JP2008537643A (ja) | 2005-04-06 | 2006-03-31 | たとえばｔｃｏの無機コーティングを有する箔片の製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20080190482A1 (enExample) |
| EP (1) | EP1866974B1 (enExample) |
| JP (1) | JP2008537643A (enExample) |
| KR (1) | KR100983838B1 (enExample) |
| CN (1) | CN100568544C (enExample) |
| AR (1) | AR053209A1 (enExample) |
| ES (1) | ES2672648T3 (enExample) |
| TW (1) | TW200723554A (enExample) |
| WO (1) | WO2006106072A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1940989B1 (en) * | 2005-09-29 | 2010-12-15 | Dow Corning Corporation | Method of releasing high temperature films and/or devices from metallic substrates |
| DE102008008726A1 (de) * | 2008-02-12 | 2009-09-24 | Schott Solar Gmbh | Photovoltaisches Modul und Verfahren zu dessen Herstellung |
| TWI423463B (zh) * | 2008-12-12 | 2014-01-11 | Sun Well Solar Corp | 以溶凝膠法合成半導體化合物薄膜層的製造方法 |
| US20140130858A1 (en) * | 2012-11-15 | 2014-05-15 | Samsung Sdi Co., Ltd. | Solar cell |
| FR3017243B1 (fr) * | 2014-02-05 | 2016-02-12 | Nexcis | Procede de fabrication d’un empilement de couches minces decollable de son substrat |
| CN110518079B (zh) * | 2019-09-29 | 2024-05-07 | 信利半导体有限公司 | 一种光电转换率高的薄膜光伏电池及其制备工艺 |
| US11096288B2 (en) * | 2019-12-20 | 2021-08-17 | Xerox Corporation | Flexible conductive printed circuits with printed overcoats |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4484132A (en) * | 1981-03-09 | 1984-11-20 | Crites Nelson A | Crack detecting system |
| US5181968A (en) | 1991-06-24 | 1993-01-26 | United Solar Systems Corporation | Photovoltaic device having an improved collector grid |
| US5637537A (en) * | 1991-06-27 | 1997-06-10 | United Solar Systems Corporation | Method of severing a thin film semiconductor device |
| US5385848A (en) * | 1993-09-20 | 1995-01-31 | Iowa Thin Film Technologies, Inc | Method for fabricating an interconnected array of semiconductor devices |
| US5457057A (en) * | 1994-06-28 | 1995-10-10 | United Solar Systems Corporation | Photovoltaic module fabrication process |
| JP2001501035A (ja) * | 1996-09-26 | 2001-01-23 | アクゾ ノーベル ナムローゼ フェンノートシャップ | 光起電箔の製造法 |
| US6003421A (en) * | 1997-08-15 | 1999-12-21 | Milich; Bruce | Apparatus and method for cutting elongated webs of material |
| JPH11238897A (ja) * | 1998-02-23 | 1999-08-31 | Canon Inc | 太陽電池モジュール製造方法および太陽電池モジュール |
| US6160215A (en) * | 1999-03-26 | 2000-12-12 | Curtin; Lawrence F. | Method of making photovoltaic device |
| US6274458B1 (en) * | 1999-07-07 | 2001-08-14 | Agere Systems Optoelectronics Guardian Corp. | Method of gas cleaving a semiconductor product |
| US6452091B1 (en) * | 1999-07-14 | 2002-09-17 | Canon Kabushiki Kaisha | Method of producing thin-film single-crystal device, solar cell module and method of producing the same |
| JP2002033296A (ja) * | 2000-04-26 | 2002-01-31 | Lintec Corp | シリコンウエハ用の補強材および該補強材を用いたｉｃチップの製造方法 |
| CN100505280C (zh) * | 2003-07-22 | 2009-06-24 | 阿克佐诺贝尔股份有限公司 | 用临时衬底制造太阳能电池薄片的方法和太阳能电池单元 |
-
2006
- 2006-03-31 ES ES06725454.0T patent/ES2672648T3/es active Active
- 2006-03-31 JP JP2008504746A patent/JP2008537643A/ja active Pending
- 2006-03-31 WO PCT/EP2006/061206 patent/WO2006106072A1/en not_active Ceased
- 2006-03-31 KR KR1020077018287A patent/KR100983838B1/ko active Active
- 2006-03-31 US US11/910,871 patent/US20080190482A1/en not_active Abandoned
- 2006-03-31 CN CNB2006800102371A patent/CN100568544C/zh active Active
- 2006-03-31 EP EP06725454.0A patent/EP1866974B1/en active Active
- 2006-04-06 AR ARP060101376A patent/AR053209A1/es not_active Application Discontinuation
- 2006-04-06 TW TW095112133A patent/TW200723554A/zh unknown
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