|
US10340424B2
(en)
|
2002-08-30 |
2019-07-02 |
GE Lighting Solutions, LLC |
Light emitting diode component
|
|
US7521667B2
(en)
|
2003-06-23 |
2009-04-21 |
Advanced Optical Technologies, Llc |
Intelligent solid state lighting
|
|
US7145125B2
(en)
|
2003-06-23 |
2006-12-05 |
Advanced Optical Technologies, Llc |
Integrating chamber cone light using LED sources
|
|
US7341199B2
(en)
*
|
2003-11-12 |
2008-03-11 |
Siemens Energy & Automation, Inc. |
Material handling system with dynamic source tagging
|
|
KR20060108757A
(ko)
*
|
2003-12-11 |
2006-10-18 |
컬러 키네틱스 인코포레이티드 |
조명 소자를 위한 열 관리 방법 및 장치
|
|
CN100483024C
(zh)
*
|
2004-11-09 |
2009-04-29 |
李学霖 |
发光二极管灯散热结构
|
|
US7285802B2
(en)
*
|
2004-12-21 |
2007-10-23 |
3M Innovative Properties Company |
Illumination assembly and method of making same
|
|
US9070850B2
(en)
|
2007-10-31 |
2015-06-30 |
Cree, Inc. |
Light emitting diode package and method for fabricating same
|
|
GB2422249A
(en)
*
|
2005-01-15 |
2006-07-19 |
Robert John Morse |
Power substrate
|
|
US7121687B2
(en)
*
|
2005-01-25 |
2006-10-17 |
Osram Sylvania Inc. |
Automotive LED bulb
|
|
JP4241658B2
(ja)
*
|
2005-04-14 |
2009-03-18 |
シチズン電子株式会社 |
発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
|
|
JP4410721B2
(ja)
*
|
2005-05-02 |
2010-02-03 |
シチズン電子株式会社 |
バルブ型led光源
|
|
US7703951B2
(en)
*
|
2005-05-23 |
2010-04-27 |
Philips Solid-State Lighting Solutions, Inc. |
Modular LED-based lighting fixtures having socket engagement features
|
|
EP1893912B1
(en)
*
|
2005-05-23 |
2020-12-16 |
Signify North America Corporation |
Modular led-based lighting apparatus for socket engagement, lighting fixtures incorporating same, and methods of assembling, installing and removing same
|
|
US7766518B2
(en)
*
|
2005-05-23 |
2010-08-03 |
Philips Solid-State Lighting Solutions, Inc. |
LED-based light-generating modules for socket engagement, and methods of assembling, installing and removing same
|
|
USD562494S1
(en)
|
2005-05-23 |
2008-02-19 |
Philips Solid-State Lighting Solutions |
Optical component
|
|
KR100764380B1
(ko)
*
|
2005-12-16 |
2007-10-08 |
삼성전기주식회사 |
슬림형 백라이트유닛
|
|
US8044412B2
(en)
|
2006-01-20 |
2011-10-25 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Package for a light emitting element
|
|
JP4997584B2
(ja)
*
|
2006-01-26 |
2012-08-08 |
Nltテクノロジー株式会社 |
液晶表示装置
|
|
KR101347486B1
(ko)
*
|
2006-01-31 |
2014-01-02 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
유연성 포일 구조를 구비한 led 조명 조립체
|
|
EP1988336A4
(en)
*
|
2006-02-22 |
2013-03-06 |
Stanley Electric Co Ltd |
ILLUMINATION DEVICE
|
|
US20070211492A1
(en)
*
|
2006-03-09 |
2007-09-13 |
Gigno Technology Co., Ltd. |
Backlight module and driving circuit board of light emitting diodes
|
|
TWI289947B
(en)
*
|
2006-03-17 |
2007-11-11 |
Ind Tech Res Inst |
Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith
|
|
US7710045B2
(en)
*
|
2006-03-17 |
2010-05-04 |
3M Innovative Properties Company |
Illumination assembly with enhanced thermal conductivity
|
|
US7675145B2
(en)
*
|
2006-03-28 |
2010-03-09 |
Cree Hong Kong Limited |
Apparatus, system and method for use in mounting electronic elements
|
|
US20070252161A1
(en)
*
|
2006-03-31 |
2007-11-01 |
3M Innovative Properties Company |
Led mounting structures
|
|
US7806574B2
(en)
*
|
2006-04-16 |
2010-10-05 |
Albeo Technologies, Inc. |
Thermal management of LED-based lighting systems
|
|
US20070247851A1
(en)
*
|
2006-04-21 |
2007-10-25 |
Villard Russel G |
Light Emitting Diode Lighting Package With Improved Heat Sink
|
|
US8748915B2
(en)
|
2006-04-24 |
2014-06-10 |
Cree Hong Kong Limited |
Emitter package with angled or vertical LED
|
|
EP2021688B1
(en)
*
|
2006-05-05 |
2016-04-27 |
Cree, Inc. |
Lighting device
|
|
USD566323S1
(en)
|
2006-05-23 |
2008-04-08 |
Philips Solid State Lighting Solutions, Inc. |
Lighting apparatus frame
|
|
US20080012035A1
(en)
*
|
2006-07-11 |
2008-01-17 |
Bily Wang |
LED chip package structure and method for manufacturing the same
|
|
US8735920B2
(en)
|
2006-07-31 |
2014-05-27 |
Cree, Inc. |
Light emitting diode package with optical element
|
|
KR101318372B1
(ko)
*
|
2006-08-03 |
2013-10-16 |
삼성디스플레이 주식회사 |
발광 유닛, 이를 갖는 백라이트 어셈블리 및 표시장치
|
|
DE102007004303A1
(de)
|
2006-08-04 |
2008-02-07 |
Osram Opto Semiconductors Gmbh |
Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
|
|
TWI340010B
(en)
*
|
2006-08-04 |
2011-04-01 |
Everlight Electronics Co Ltd |
Circuit board with cooling functionality
|
|
US8367945B2
(en)
*
|
2006-08-16 |
2013-02-05 |
Cree Huizhou Opto Limited |
Apparatus, system and method for use in mounting electronic elements
|
|
JP2008053380A
(ja)
*
|
2006-08-23 |
2008-03-06 |
Hamamatsu Photonics Kk |
レーザ装置
|
|
US8362603B2
(en)
*
|
2006-09-14 |
2013-01-29 |
Luminus Devices, Inc. |
Flexible circuit light-emitting structures
|
|
US8581393B2
(en)
*
|
2006-09-21 |
2013-11-12 |
3M Innovative Properties Company |
Thermally conductive LED assembly
|
|
US20080074881A1
(en)
*
|
2006-09-25 |
2008-03-27 |
Been-Yu Liaw |
Backlight module
|
|
US7794114B2
(en)
*
|
2006-10-11 |
2010-09-14 |
Cree, Inc. |
Methods and apparatus for improved heat spreading in solid state lighting systems
|
|
US20080112162A1
(en)
*
|
2006-11-09 |
2008-05-15 |
Topson Optoelectronics Semi-Conductor Co., Ltd. |
Backlight Structure Having Embedded LEDs and Fabrication Method Thereof
|
|
CN100423257C
(zh)
*
|
2006-12-20 |
2008-10-01 |
黄虎钧 |
具有发光二极管晶片的发光棒
|
|
DE102007004304A1
(de)
|
2007-01-29 |
2008-07-31 |
Osram Opto Semiconductors Gmbh |
Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
|
|
US7806560B2
(en)
*
|
2007-01-31 |
2010-10-05 |
3M Innovative Properties Company |
LED illumination assembly with compliant foil construction
|
|
US9711703B2
(en)
|
2007-02-12 |
2017-07-18 |
Cree Huizhou Opto Limited |
Apparatus, system and method for use in mounting electronic elements
|
|
CN101622907B
(zh)
*
|
2007-02-26 |
2012-06-13 |
皇家飞利浦电子股份有限公司 |
驱动照明设备
|
|
US7841741B2
(en)
*
|
2007-04-02 |
2010-11-30 |
Endicott Interconnect Technologies, Inc. |
LED lighting assembly and lamp utilizing same
|
|
US7898811B2
(en)
*
|
2007-04-10 |
2011-03-01 |
Raled, Inc. |
Thermal management of LEDs on a printed circuit board and associated methods
|
|
US7535030B2
(en)
*
|
2007-05-22 |
2009-05-19 |
Hsiang-Chou Lin |
LED lamp with exposed heat-conductive fins
|
|
EP1998101B2
(en)
|
2007-05-30 |
2019-09-25 |
OSRAM GmbH |
Lighting device
|
|
WO2009000282A1
(en)
*
|
2007-06-22 |
2008-12-31 |
Lioris B.V. |
High voltage led lighting system
|
|
JP5431688B2
(ja)
*
|
2007-06-29 |
2014-03-05 |
ソウル セミコンダクター カンパニー リミテッド |
マルチledパッケージ
|
|
US7922354B2
(en)
*
|
2007-08-13 |
2011-04-12 |
Everhart Robert L |
Solid-state lighting fixtures
|
|
US20090096347A1
(en)
*
|
2007-10-11 |
2009-04-16 |
Xu Chao-Feng |
LED Flat Light and A Manufacturing Method Thereof
|
|
US8866169B2
(en)
|
2007-10-31 |
2014-10-21 |
Cree, Inc. |
LED package with increased feature sizes
|
|
US10256385B2
(en)
|
2007-10-31 |
2019-04-09 |
Cree, Inc. |
Light emitting die (LED) packages and related methods
|
|
DE102007055133A1
(de)
*
|
2007-11-19 |
2009-05-20 |
Osram Gesellschaft mit beschränkter Haftung |
Beleuchtungsvorrichtung mit einem Kühlkörper
|
|
KR101015818B1
(ko)
*
|
2007-11-21 |
2011-02-22 |
크루셜텍 (주) |
카메라 플래시 모듈 및 카메라 플래시 모듈이 구비된 휴대 단말기
|
|
WO2009075753A2
(en)
*
|
2007-12-06 |
2009-06-18 |
Paul Panaccione |
Chip-scale packaged light-emitting devices
|
|
CN101451696A
(zh)
*
|
2007-12-07 |
2009-06-10 |
富准精密工业(深圳)有限公司 |
发光二极管灯具
|
|
CN101556032B
(zh)
*
|
2008-04-09 |
2010-09-29 |
富准精密工业(深圳)有限公司 |
发光二极管灯具
|
|
CN101572990B
(zh)
*
|
2008-04-28 |
2012-12-19 |
鸿富锦精密工业(深圳)有限公司 |
电路板原板
|
|
US7845829B2
(en)
*
|
2008-05-20 |
2010-12-07 |
Abl Ip Holding Llc |
Enclosures for LED circuit boards
|
|
US8177392B2
(en)
*
|
2008-05-29 |
2012-05-15 |
Norm Tarko |
Light strip including a core layer of insulating material receiving spaced apart light emitting diodes
|
|
JP5236366B2
(ja)
*
|
2008-07-01 |
2013-07-17 |
ミネベア株式会社 |
線状光源装置、および面状照明装置
|
|
US9022612B2
(en)
*
|
2008-08-07 |
2015-05-05 |
Mag Instrument, Inc. |
LED module
|
|
US20100038670A1
(en)
*
|
2008-08-18 |
2010-02-18 |
Luminus Devices, Inc. |
Illumination assembly including chip-scale packaged light-emitting device
|
|
US8058659B2
(en)
|
2008-08-26 |
2011-11-15 |
Albeo Technologies, Inc. |
LED chip-based lighting products and methods of building
|
|
US9076951B2
(en)
|
2008-08-26 |
2015-07-07 |
Albeo Technologies, Inc. |
Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
|
|
US8981629B2
(en)
|
2008-08-26 |
2015-03-17 |
Albeo Technologies, Inc. |
Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
|
|
GB2464668A
(en)
*
|
2008-10-20 |
2010-04-28 |
Sensitive Electronic Co Ltd |
Thin light emitting diode circuit substrate and lamp strip
|
|
KR100902631B1
(ko)
*
|
2008-10-24 |
2009-06-12 |
현대통신 주식회사 |
나노스프레더를 이용한 원형구조의 led 발광 조명등
|
|
US8791471B2
(en)
*
|
2008-11-07 |
2014-07-29 |
Cree Hong Kong Limited |
Multi-chip light emitting diode modules
|
|
DE102008056923A1
(de)
*
|
2008-11-12 |
2010-05-27 |
Osram Gesellschaft mit beschränkter Haftung |
Beleuchtungsvorrichtung mit zwei Leiterplatten
|
|
US20100149805A1
(en)
*
|
2008-12-17 |
2010-06-17 |
Fridy Joseph |
Led lighting laminate with integrated cooling
|
|
TW201025675A
(en)
*
|
2008-12-31 |
2010-07-01 |
Jess Link Products Co Ltd |
Light emitting diode light strip and method of making the same
|
|
US8368112B2
(en)
|
2009-01-14 |
2013-02-05 |
Cree Huizhou Opto Limited |
Aligned multiple emitter package
|
|
US20110037083A1
(en)
*
|
2009-01-14 |
2011-02-17 |
Alex Chi Keung Chan |
Led package with contrasting face
|
|
US20100188860A1
(en)
*
|
2009-01-28 |
2010-07-29 |
Been-Yu Liaw |
Lotus blossom heat dissipating device
|
|
JP2011009298A
(ja)
*
|
2009-06-23 |
2011-01-13 |
Citizen Electronics Co Ltd |
発光ダイオード光源装置
|
|
KR20110003792A
(ko)
*
|
2009-07-06 |
2011-01-13 |
주식회사 디지아이 |
칼라 인쇄회로기판의 제조방법
|
|
TW201103170A
(en)
*
|
2009-07-08 |
2011-01-16 |
Paragon Sc Lighting Tech Co |
LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
|
|
JP4746692B2
(ja)
*
|
2009-07-29 |
2011-08-10 |
株式会社タムラ製作所 |
可視光通信用led照明装置
|
|
US20110054263A1
(en)
*
|
2009-08-28 |
2011-03-03 |
Jim-Son Chou |
Replaceable LED illumination assembly for medical instruments
|
|
US8593040B2
(en)
|
2009-10-02 |
2013-11-26 |
Ge Lighting Solutions Llc |
LED lamp with surface area enhancing fins
|
|
TWM379006U
(en)
*
|
2009-10-22 |
2010-04-21 |
Jia-hao ZHANG |
LED light bar
|
|
US8408627B2
(en)
*
|
2009-12-15 |
2013-04-02 |
3M Innovative Properties Company |
Pick up truck, rail cap assembly with lighting system and method of use
|
|
US10240772B2
(en)
*
|
2010-04-02 |
2019-03-26 |
GE Lighting Solutions, LLC |
Lightweight heat sinks and LED lamps employing same
|
|
JP5920213B2
(ja)
*
|
2010-04-13 |
2016-05-18 |
宇部興産株式会社 |
Led用放熱基板
|
|
EP2561265A4
(en)
*
|
2010-04-21 |
2015-03-11 |
Cooper Technologies Co |
REMOVABLE LED PLATE ARCHITECTURE
|
|
JP5537295B2
(ja)
*
|
2010-07-05 |
2014-07-02 |
パナソニック株式会社 |
発光素子実装用配線パターン、発光素子実装用配線パターンを有する発光素子実装用配線基板および発光素子実装用配線基板を用いた発光モジュールならびに発光モジュールを装備した照明器具
|
|
US9548286B2
(en)
*
|
2010-08-09 |
2017-01-17 |
Micron Technology, Inc. |
Solid state lights with thermal control elements
|
|
US9035329B2
(en)
*
|
2010-09-13 |
2015-05-19 |
Epistar Corporation |
Light-emitting device
|
|
AT12736U1
(de)
*
|
2010-09-15 |
2012-10-15 |
Austria Tech & System Tech |
Leiterplatte sowie verfahren zur herstellung einer leiterplatte
|
|
US20120268928A1
(en)
*
|
2010-10-26 |
2012-10-25 |
Sargent Robert L |
Large single chip led device for high intensity packing
|
|
US9674938B2
(en)
|
2010-11-03 |
2017-06-06 |
3M Innovative Properties Company |
Flexible LED device for thermal management
|
|
WO2012091971A1
(en)
|
2010-12-29 |
2012-07-05 |
3M Innovative Properties Company |
Remote phosphor led constructions
|
|
CN103282820B
(zh)
|
2010-12-29 |
2016-10-26 |
3M创新有限公司 |
Led合色器
|
|
JP5740981B2
(ja)
*
|
2011-01-05 |
2015-07-01 |
ソニー株式会社 |
発光装置、照明装置および表示装置
|
|
TWI589021B
(zh)
*
|
2011-02-07 |
2017-06-21 |
晶元光電股份有限公司 |
發光元件及其製法
|
|
US8314566B2
(en)
|
2011-02-22 |
2012-11-20 |
Quarkstar Llc |
Solid state lamp using light emitting strips
|
|
CN102130283B
(zh)
*
|
2011-02-22 |
2012-07-18 |
史杰 |
Led芯片封装支架
|
|
US8888331B2
(en)
*
|
2011-05-09 |
2014-11-18 |
Microsoft Corporation |
Low inductance light source module
|
|
US20140326495A1
(en)
*
|
2011-08-25 |
2014-11-06 |
Amphenol Corporation |
High performance printed circuit board
|
|
CN102983244A
(zh)
*
|
2011-09-05 |
2013-03-20 |
欧司朗股份有限公司 |
Led发光组件以及具有该led发光组件的照明装置
|
|
JP6038175B2
(ja)
*
|
2012-01-03 |
2016-12-07 |
フィリップス ライティング ホールディング ビー ヴィ |
照明アセンブリ、光源、及び照明器具
|
|
TWI481071B
(zh)
*
|
2012-01-12 |
2015-04-11 |
|
Light-emitting device LED 3D surface lead frame
|
|
TWI496323B
(zh)
*
|
2012-04-09 |
2015-08-11 |
台達電子工業股份有限公司 |
發光模組
|
|
US9500355B2
(en)
|
2012-05-04 |
2016-11-22 |
GE Lighting Solutions, LLC |
Lamp with light emitting elements surrounding active cooling device
|
|
CN103426993A
(zh)
*
|
2012-05-16 |
2013-12-04 |
欧司朗股份有限公司 |
电子模块、照明装置和制造该电子模块的方法
|
|
TWI437727B
(zh)
*
|
2012-05-31 |
2014-05-11 |
玉晶光電股份有限公司 |
LED lighting
|
|
DE102013201327A1
(de)
*
|
2013-01-28 |
2014-07-31 |
Osram Gmbh |
Leiterplatte, optoelektronisches Bauteil und Anordnung optoelektronischer Bauteile
|
|
US9601670B2
(en)
|
2014-07-11 |
2017-03-21 |
Cree, Inc. |
Method to form primary optic with variable shapes and/or geometries without a substrate
|
|
US10622522B2
(en)
|
2014-09-05 |
2020-04-14 |
Theodore Lowes |
LED packages with chips having insulated surfaces
|
|
US9989223B1
(en)
*
|
2015-03-09 |
2018-06-05 |
Automated Assembly Corporation |
LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
|
|
US10337717B2
(en)
*
|
2015-03-31 |
2019-07-02 |
Koito Manufacturing Co., Ltd. |
Light source unit, method of manufacturing the same, and vehicle lamp
|
|
US10257932B2
(en)
*
|
2016-02-16 |
2019-04-09 |
Microsoft Technology Licensing, Llc. |
Laser diode chip on printed circuit board
|
|
DE102016115224A1
(de)
*
|
2016-08-17 |
2018-02-22 |
Osram Opto Semiconductors Gmbh |
Elektronische Vorrichtung
|
|
KR102006188B1
(ko)
*
|
2017-12-29 |
2019-08-01 |
엘지전자 주식회사 |
반도체 발광 소자를 이용한 차량용 램프 및 그 제어방법
|
|
JP7260734B2
(ja)
*
|
2018-09-28 |
2023-04-19 |
日亜化学工業株式会社 |
発光装置及びその製造方法
|
|
CN110864268A
(zh)
*
|
2019-11-19 |
2020-03-06 |
深圳市库莱特光电科技有限公司 |
一种cob灯条及其制作方法
|
|
US11047561B1
(en)
*
|
2019-12-31 |
2021-06-29 |
Excellence Optoelectronics Inc. |
Heat sink structure and flexible light-emitting device having heat sink structure
|
|
CN111477649A
(zh)
*
|
2020-04-15 |
2020-07-31 |
深圳市华星光电半导体显示技术有限公司 |
Micro-LED显示面板及其制备方法与邦定材料
|