JP2008517458A - 蛍光体、その蛍光体を利用した発光素子、及びその蛍光体の製造方法｛Ｐｈｏｓｐｈｏｒ，ｌｉｇｈｔｅｍｉｔｔｉｎｇｄｅｖｉｃｅｂｙｕｓｉｎｇｔｈｅｓａｍｅａｎｄｍａｎｕｆａｃｔｕｒｉｎｇｍｅｔｈｏｄｏｆｔｈｅｓａｍｅ｝ - Google Patents

蛍光体、その蛍光体を利用した発光素子、及びその蛍光体の製造方法｛Ｐｈｏｓｐｈｏｒ，ｌｉｇｈｔｅｍｉｔｔｉｎｇｄｅｖｉｃｅｂｙｕｓｉｎｇｔｈｅｓａｍｅａｎｄｍａｎｕｆａｃｔｕｒｉｎｇｍｅｔｈｏｄｏｆｔｈｅｓａｍｅ｝ Download PDF

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Publication number
JP2008517458A
JP2008517458A JP2007536603A JP2007536603A JP2008517458A JP 2008517458 A JP2008517458 A JP 2008517458A JP 2007536603 A JP2007536603 A JP 2007536603A JP 2007536603 A JP2007536603 A JP 2007536603A JP 2008517458 A JP2008517458 A JP 2008517458A
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Prior art keywords
phosphor
light
light emitting
emitting device
concentration
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Pending
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JP2007536603A
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Japanese (ja)
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JP2008517458A5 (enExample
Inventor
ハエ、キム チャン
キュー、パク ジョン
ジョエ、チョイ キョーン
キー、キム サン
ユル、キム チョーン
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication of JP2008517458A publication Critical patent/JP2008517458A/ja
Publication of JP2008517458A5 publication Critical patent/JP2008517458A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2007536603A 2004-10-18 2005-07-26 蛍光体、その蛍光体を利用した発光素子、及びその蛍光体の製造方法｛Ｐｈｏｓｐｈｏｒ，ｌｉｇｈｔｅｍｉｔｔｉｎｇｄｅｖｉｃｅｂｙｕｓｉｎｇｔｈｅｓａｍｅａｎｄｍａｎｕｆａｃｔｕｒｉｎｇｍｅｔｈｏｄｏｆｔｈｅｓａｍｅ｝ Pending JP2008517458A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040083187A KR20060034055A (ko) 2004-10-18 2004-10-18 형광체 및 이를 이용한 발광소자
PCT/KR2005/002411 WO2006043747A1 (en) 2004-10-18 2005-07-26 Phosphor, light emitting device by using the same and manufacturing method of the same

Publications (2)

Publication Number Publication Date
JP2008517458A true JP2008517458A (ja) 2008-05-22
JP2008517458A5 JP2008517458A5 (enExample) 2011-10-27

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JP2007536603A Pending JP2008517458A (ja) 2004-10-18 2005-07-26 蛍光体、その蛍光体を利用した発光素子、及びその蛍光体の製造方法｛Ｐｈｏｓｐｈｏｒ，ｌｉｇｈｔｅｍｉｔｔｉｎｇｄｅｖｉｃｅｂｙｕｓｉｎｇｔｈｅｓａｍｅａｎｄｍａｎｕｆａｃｔｕｒｉｎｇｍｅｔｈｏｄｏｆｔｈｅｓａｍｅ｝

Country Status (6)

Country Link
US (1) US7646141B2 (enExample)
EP (1) EP1803162B1 (enExample)
JP (1) JP2008517458A (enExample)
KR (1) KR20060034055A (enExample)
CN (1) CN1898811B (enExample)
WO (1) WO2006043747A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200925247A (en) * 2007-12-12 2009-06-16 Wang yong qi Three spectral band phosphor powder for using in multilayered agricultural film
KR101098006B1 (ko) * 2009-09-29 2011-12-23 한국화학연구원 (할로)실리케이트계 형광체 및 이의 제조방법
WO2012099966A2 (en) * 2011-01-18 2012-07-26 Whiteoptics Llc Color-shifting reflector
CN102709443B (zh) * 2012-05-30 2014-12-24 瑞声声学科技(深圳)有限公司 Led封装及其封装方法
US8890196B2 (en) * 2013-03-14 2014-11-18 Goldeneye, Inc. Lightweight self-cooling light sources
CN105322096A (zh) * 2014-07-30 2016-02-10 财团法人工业技术研究院 有机发光元件
KR102369932B1 (ko) 2014-11-10 2022-03-04 삼성전자주식회사 불화물계 형광체, 발광장치, 불화물계 형광체 제조방법 및 발광장치 제조방법
CN106345357A (zh) * 2016-10-31 2017-01-25 上海市浦东新区人民医院 一种全自动钡剂均匀搅拌的微动装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001143869A (ja) * 1998-12-25 2001-05-25 Konica Corp エレクトロルミネッセンス材料、エレクトロルミネッセンス素子及び色変換フィルター
WO2001089001A2 (en) * 2000-05-15 2001-11-22 General Electric Company White light emitting phosphor blends for led devices
WO2003021691A1 (en) * 2001-09-03 2003-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device
JP2003110150A (ja) * 2001-10-01 2003-04-11 Matsushita Electric Ind Co Ltd 半導体発光素子とこれを用いた発光装置
JP2003306675A (ja) * 2002-02-15 2003-10-31 Mitsubishi Chemicals Corp 発光装置及びそれを用いた照明装置
WO2004067677A1 (en) * 2003-01-29 2004-08-12 Korea Research Institute Of Chemical Technology Strontium silicate-based phosphor and method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3651363A (en) * 1968-12-23 1972-03-21 Sylvania Electric Prod Divalent europium-activated barium-magnesium pyrosilicate
WO1998039805A1 (de) 1997-03-03 1998-09-11 Koninklijke Philips Electronics N.V. Weisse lumineszenzdiode
US6252254B1 (en) 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
JP3950543B2 (ja) 1998-02-27 2007-08-01 東芝電子エンジニアリング株式会社 Ｌｅｄランプ
JP4350183B2 (ja) 1998-12-16 2009-10-21 東芝電子エンジニアリング株式会社 半導体発光装置
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
EP1447853B1 (en) 2001-10-01 2012-08-08 Panasonic Corporation Semiconductor light emitting element and light emitting device using this
TWI290329B (en) * 2001-10-30 2007-11-21 Hitachi Ltd Plasma display device, luminescent device and image and information display system using the same
SG155768A1 (en) * 2002-03-22 2009-10-29 Nichia Corp Nitride phosphor and production process thereof, and light emitting device
JP5138145B2 (ja) * 2002-11-12 2013-02-06 日亜化学工業株式会社 蛍光体積層構造及びそれを用いる光源
ATE449426T1 (de) * 2003-09-15 2009-12-15 Koninkl Philips Electronics Nv Weisses licht emittierendes beleuchtungssystem
US7267787B2 (en) 2004-08-04 2007-09-11 Intematix Corporation Phosphor systems for a white light emitting diode (LED)

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001143869A (ja) * 1998-12-25 2001-05-25 Konica Corp エレクトロルミネッセンス材料、エレクトロルミネッセンス素子及び色変換フィルター
WO2001089001A2 (en) * 2000-05-15 2001-11-22 General Electric Company White light emitting phosphor blends for led devices
WO2003021691A1 (en) * 2001-09-03 2003-03-13 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device
JP2003110150A (ja) * 2001-10-01 2003-04-11 Matsushita Electric Ind Co Ltd 半導体発光素子とこれを用いた発光装置
JP2003306675A (ja) * 2002-02-15 2003-10-31 Mitsubishi Chemicals Corp 発光装置及びそれを用いた照明装置
WO2004067677A1 (en) * 2003-01-29 2004-08-12 Korea Research Institute Of Chemical Technology Strontium silicate-based phosphor and method thereof

Also Published As

Publication number Publication date
WO2006043747A1 (en) 2006-04-27
US7646141B2 (en) 2010-01-12
EP1803162B1 (en) 2012-06-13
EP1803162A4 (en) 2008-12-24
US20070080363A1 (en) 2007-04-12
KR20060034055A (ko) 2006-04-21
EP1803162A1 (en) 2007-07-04
CN1898811B (zh) 2010-09-22
CN1898811A (zh) 2007-01-17

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