CN1898811B - 磷光体,使用该磷光体的发光器件及该磷光体的制造方法 - Google Patents

磷光体,使用该磷光体的发光器件及该磷光体的制造方法 Download PDF

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Publication number
CN1898811B
CN1898811B CN2005800013509A CN200580001350A CN1898811B CN 1898811 B CN1898811 B CN 1898811B CN 2005800013509 A CN2005800013509 A CN 2005800013509A CN 200580001350 A CN200580001350 A CN 200580001350A CN 1898811 B CN1898811 B CN 1898811B
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CN
China
Prior art keywords
phosphor
luminescent device
light
light source
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CN2005800013509A
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English (en)
Chinese (zh)
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CN1898811A (zh
Inventor
金昌海
朴晶奎
金相基
金忠烈
崔京在
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Research Institute of Chemical Technology KRICT
LG Innotek Co Ltd
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Korea Research Institute of Chemical Technology KRICT
LG Innotek Co Ltd
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Publication of CN1898811A publication Critical patent/CN1898811A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
CN2005800013509A 2004-10-18 2005-07-26 磷光体,使用该磷光体的发光器件及该磷光体的制造方法 Expired - Lifetime CN1898811B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020040083187 2004-10-18
KR10-2004-0083187 2004-10-18
KR1020040083187A KR20060034055A (ko) 2004-10-18 2004-10-18 형광체 및 이를 이용한 발광소자
PCT/KR2005/002411 WO2006043747A1 (en) 2004-10-18 2005-07-26 Phosphor, light emitting device by using the same and manufacturing method of the same

Publications (2)

Publication Number Publication Date
CN1898811A CN1898811A (zh) 2007-01-17
CN1898811B true CN1898811B (zh) 2010-09-22

Family

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CN2005800013509A Expired - Lifetime CN1898811B (zh) 2004-10-18 2005-07-26 磷光体,使用该磷光体的发光器件及该磷光体的制造方法

Country Status (6)

Country Link
US (1) US7646141B2 (enExample)
EP (1) EP1803162B1 (enExample)
JP (1) JP2008517458A (enExample)
KR (1) KR20060034055A (enExample)
CN (1) CN1898811B (enExample)
WO (1) WO2006043747A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200925247A (en) * 2007-12-12 2009-06-16 Wang yong qi Three spectral band phosphor powder for using in multilayered agricultural film
KR101098006B1 (ko) * 2009-09-29 2011-12-23 한국화학연구원 (할로)실리케이트계 형광체 및 이의 제조방법
WO2012099966A2 (en) * 2011-01-18 2012-07-26 Whiteoptics Llc Color-shifting reflector
CN102709443B (zh) * 2012-05-30 2014-12-24 瑞声声学科技(深圳)有限公司 Led封装及其封装方法
US8890196B2 (en) * 2013-03-14 2014-11-18 Goldeneye, Inc. Lightweight self-cooling light sources
CN105322096A (zh) * 2014-07-30 2016-02-10 财团法人工业技术研究院 有机发光元件
KR102369932B1 (ko) 2014-11-10 2022-03-04 삼성전자주식회사 불화물계 형광체, 발광장치, 불화물계 형광체 제조방법 및 발광장치 제조방법
CN106345357A (zh) * 2016-10-31 2017-01-25 上海市浦东新区人民医院 一种全自动钡剂均匀搅拌的微动装置

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1522291A (zh) * 2002-03-22 2004-08-18 ���ǻ�ѧ��ҵ��ʽ���� 氮化物荧光体,其制造方法及发光装置

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US3651363A (en) * 1968-12-23 1972-03-21 Sylvania Electric Prod Divalent europium-activated barium-magnesium pyrosilicate
WO1998039805A1 (de) 1997-03-03 1998-09-11 Koninklijke Philips Electronics N.V. Weisse lumineszenzdiode
US6252254B1 (en) 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
JP3950543B2 (ja) 1998-02-27 2007-08-01 東芝電子エンジニアリング株式会社 Ｌｅｄランプ
JP4350183B2 (ja) 1998-12-16 2009-10-21 東芝電子エンジニアリング株式会社 半導体発光装置
JP3968933B2 (ja) 1998-12-25 2007-08-29 コニカミノルタホールディングス株式会社 エレクトロルミネッセンス素子
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
KR100923804B1 (ko) * 2001-09-03 2009-10-27 파나소닉 주식회사 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법
JP3985486B2 (ja) * 2001-10-01 2007-10-03 松下電器産業株式会社 半導体発光素子とこれを用いた発光装置
EP1447853B1 (en) 2001-10-01 2012-08-08 Panasonic Corporation Semiconductor light emitting element and light emitting device using this
TWI290329B (en) * 2001-10-30 2007-11-21 Hitachi Ltd Plasma display device, luminescent device and image and information display system using the same
JP4168776B2 (ja) * 2002-02-15 2008-10-22 三菱化学株式会社 発光装置及びそれを用いた照明装置
JP5138145B2 (ja) * 2002-11-12 2013-02-06 日亜化学工業株式会社 蛍光体積層構造及びそれを用いる光源
KR100511562B1 (ko) * 2003-01-29 2005-09-02 한국화학연구원 백색 발광 다이오드 및 능동 발광형 액정 디스플레이에 적용되는 스트론튬실리케이트계 황색 형광체와 이의 제조방법
ATE449426T1 (de) * 2003-09-15 2009-12-15 Koninkl Philips Electronics Nv Weisses licht emittierendes beleuchtungssystem
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Non-Patent Citations (1)

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同上.

Also Published As

Publication number Publication date
WO2006043747A1 (en) 2006-04-27
US7646141B2 (en) 2010-01-12
EP1803162B1 (en) 2012-06-13
EP1803162A4 (en) 2008-12-24
JP2008517458A (ja) 2008-05-22
US20070080363A1 (en) 2007-04-12
KR20060034055A (ko) 2006-04-21
EP1803162A1 (en) 2007-07-04
CN1898811A (zh) 2007-01-17

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Effective date of registration: 20100604

Address after: Seoul, South Kerean

Applicant after: LG INNOTEK Co.,Ltd.

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Applicant before: LG INNOTEK Co.,Ltd.

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Granted publication date: 20100922