JP2008512230A - 熱的に制御される流体セルフアセンブリ法及び支持体 - Google Patents

熱的に制御される流体セルフアセンブリ法及び支持体 Download PDF

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JP2008512230A
JP2008512230A JP2007530452A JP2007530452A JP2008512230A JP 2008512230 A JP2008512230 A JP 2008512230A JP 2007530452 A JP2007530452 A JP 2007530452A JP 2007530452 A JP2007530452 A JP 2007530452A JP 2008512230 A JP2008512230 A JP 2008512230A
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energy
support
fluid
energy absorbing
absorbing heat
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JP2008512230A5 (cg-RX-API-DMAC7.html
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ディロン ハース，ダニエル
ブレア ケイ，デイヴィッド
シャーマ，ラヴィ
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イーストマン コダック カンパニー
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83234—Applying energy for connecting using means for applying energy being within the device, e.g. integrated heater
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    • H01L2224/93—Batch processes
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    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
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    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
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    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2007530452A 2004-09-03 2005-09-01 熱的に制御される流体セルフアセンブリ法及び支持体 Pending JP2008512230A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/849,302 US20060051517A1 (en) 2004-09-03 2004-09-03 Thermally controlled fluidic self-assembly method and support
PCT/US2005/031561 WO2006029091A2 (en) 2004-09-03 2005-09-01 Thermally controlled fluidic self-assembly method and support

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Publication Number Publication Date
JP2008512230A true JP2008512230A (ja) 2008-04-24
JP2008512230A5 JP2008512230A5 (cg-RX-API-DMAC7.html) 2008-09-11

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US (1) US20060051517A1 (cg-RX-API-DMAC7.html)
EP (1) EP1784862A2 (cg-RX-API-DMAC7.html)
JP (1) JP2008512230A (cg-RX-API-DMAC7.html)
TW (1) TW200614394A (cg-RX-API-DMAC7.html)
WO (1) WO2006029091A2 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012512522A (ja) * 2010-03-19 2012-05-31 パナソニック株式会社 微細構造物を配置する方法
KR20210088607A (ko) * 2018-10-31 2021-07-14 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. Led 칩, 디스플레이 패널 및 디스플레이 패널의 조립 디바이스

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060202944A1 (en) 2005-03-11 2006-09-14 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Elements for self assembling displays
US8711063B2 (en) * 2005-03-11 2014-04-29 The Invention Science Fund I, Llc Self assembly of elements for displays
US9153163B2 (en) * 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
US8022416B2 (en) * 2005-10-19 2011-09-20 General Electric Company Functional blocks for assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
US8674212B2 (en) * 2008-01-15 2014-03-18 General Electric Company Solar cell and magnetically self-assembled solar cell assembly
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
WO2012008253A1 (ja) * 2010-07-14 2012-01-19 シャープ株式会社 微細な物体の配置方法、配列装置、照明装置および表示装置
US20130199831A1 (en) * 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
TWI434895B (zh) 2012-03-28 2014-04-21 Ind Tech Res Inst 染料與光電轉換裝置
JP6219929B2 (ja) * 2012-04-20 2017-10-25 レンセレイアー ポリテクニック インスティテュート 発光ダイオード及びそのパッケージング方法
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers
TWI664711B (zh) * 2016-09-15 2019-07-01 美商伊樂視有限公司 具有表面貼裝發光元件的顯示器
US10607515B2 (en) * 2018-04-19 2020-03-31 Lg Electronics Inc. Display device using semiconductor light emitting device and method for manufacturing the same
CN111162064B (zh) * 2018-11-08 2022-03-25 成都辰显光电有限公司 Led单元、导引板、led显示器及其制造方法
WO2021054550A1 (en) 2019-09-19 2021-03-25 Lg Electronics Inc. Device for self-assembling semiconductor light-emitting diodes
KR102260638B1 (ko) * 2019-09-26 2021-06-04 엘지전자 주식회사 반도체 발광소자의 자가조립 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09120943A (ja) * 1995-06-07 1997-05-06 Univ California 基板上に微細構造を組み付ける方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4035547A (en) * 1974-02-26 1977-07-12 William C. Heller Bonding element having separate heating and agitating particles
CA1268107A (en) * 1984-07-19 1990-04-24 Alfred Fuller Leatherman Thermoset bonding agent for non-distortion joining of self-supporting thermoset component parts
US4749833A (en) * 1987-08-07 1988-06-07 Tocco, Inc. Induction heating for adhesive bonding
US4983804A (en) * 1989-12-21 1991-01-08 At&T Bell Laboratories Localized soldering by inductive heating
US5605662A (en) * 1993-11-01 1997-02-25 Nanogen, Inc. Active programmable electronic devices for molecular biological analysis and diagnostics
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
JP3376183B2 (ja) * 1994-09-29 2003-02-10 キヤノン株式会社 インクジェット用水性インク、インクジェット記録方法及びブリード緩和方法
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
US6274508B1 (en) * 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6683663B1 (en) * 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6555408B1 (en) * 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
WO2001001475A1 (en) * 1999-06-30 2001-01-04 The Penn State Research Foundation Electrofluidic assembly of devices and components for micro- and nano-scale integration
DE69918551D1 (de) * 1999-09-17 2004-08-12 St Microelectronics Srl Verfahren für die elektrische und mechanische Verbindung von mikroelektronischen Komponenten
US6527964B1 (en) * 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) * 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
AU2427301A (en) * 1999-12-01 2001-06-12 Regents Of The University Of California, The Electric-field-assisted fluidic assembly of inorganic and organic materials, molecules and like small things including living cells
WO2001095375A1 (en) * 2000-06-06 2001-12-13 The Penn State Research Foundation An electro-fluidic assembly process for integration of electronic devices onto a substrate
US20020149107A1 (en) * 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
CA2328578C (en) * 2000-12-15 2010-10-12 Shaw Industries Ltd. Method for inductively heating a substrate and a coating on said substrate
US6417025B1 (en) * 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) * 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US6460966B1 (en) * 2001-08-23 2002-10-08 Hewlett-Packard Company Thin film microheaters for assembly of inkjet printhead assemblies
US7018575B2 (en) * 2001-09-28 2006-03-28 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US7253091B2 (en) * 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US7323757B2 (en) * 2002-01-24 2008-01-29 Massachusetts Institute Of Technology System for field assisted statistical assembly of wafers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09120943A (ja) * 1995-06-07 1997-05-06 Univ California 基板上に微細構造を組み付ける方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN5007015741, Ｃ．Ｒ．ＢＡＲＲＹ, "Ａｐｐｒｏａｃｈｉｎｇ Ｐｒｏｇｒａｍｍａｂｌｅ Ｓｅｌｆ−Ａｓｓｅｍｂｌｙ ｆｒｏｍ Ｎａｎｏｐａｒｔｉｃｌｅ−Ｂａｓｅｄ Ｄｅｖｉｃｅｓ ｔｏ Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔｓ", ＰＲＯＣＥＥＤＯＮＧＳ ＯＦ ＴＨＥ ＦＯＵＮＤＡＴＩＯＮＳ ＯＦ ＮＡＮＯＳＣＩＥＮＣＥ, 20040421 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012512522A (ja) * 2010-03-19 2012-05-31 パナソニック株式会社 微細構造物を配置する方法
KR20210088607A (ko) * 2018-10-31 2021-07-14 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. Led 칩, 디스플레이 패널 및 디스플레이 패널의 조립 디바이스
KR102551554B1 (ko) 2018-10-31 2023-07-06 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. Led 칩, 디스플레이 패널 및 디스플레이 패널의 조립 디바이스

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