TW200614394A - Thermally controlled fluidic self-assembly method and support - Google Patents

Thermally controlled fluidic self-assembly method and support

Info

Publication number
TW200614394A
TW200614394A TW094130020A TW94130020A TW200614394A TW 200614394 A TW200614394 A TW 200614394A TW 094130020 A TW094130020 A TW 094130020A TW 94130020 A TW94130020 A TW 94130020A TW 200614394 A TW200614394 A TW 200614394A
Authority
TW
Taiwan
Prior art keywords
support
binding sites
fluid
assembly method
micro
Prior art date
Application number
TW094130020A
Other languages
English (en)
Chinese (zh)
Inventor
Daniel Dillon Haas
David Blair Kay
Ravi Sharma
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200614394A publication Critical patent/TW200614394A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83234—Applying energy for connecting using means for applying energy being within the device, e.g. integrated heater
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
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    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
TW094130020A 2004-09-03 2005-09-02 Thermally controlled fluidic self-assembly method and support TW200614394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/849,302 US20060051517A1 (en) 2004-09-03 2004-09-03 Thermally controlled fluidic self-assembly method and support

Publications (1)

Publication Number Publication Date
TW200614394A true TW200614394A (en) 2006-05-01

Family

ID=35759225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130020A TW200614394A (en) 2004-09-03 2005-09-02 Thermally controlled fluidic self-assembly method and support

Country Status (5)

Country Link
US (1) US20060051517A1 (cg-RX-API-DMAC7.html)
EP (1) EP1784862A2 (cg-RX-API-DMAC7.html)
JP (1) JP2008512230A (cg-RX-API-DMAC7.html)
TW (1) TW200614394A (cg-RX-API-DMAC7.html)
WO (1) WO2006029091A2 (cg-RX-API-DMAC7.html)

Cited By (2)

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US8722905B2 (en) 2012-03-28 2014-05-13 Industrial Technology Research Institute Dyes and photoelectric conversion devices containing the same
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers

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US9153163B2 (en) * 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
US8022416B2 (en) * 2005-10-19 2011-09-20 General Electric Company Functional blocks for assembly
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
US8674212B2 (en) * 2008-01-15 2014-03-18 General Electric Company Solar cell and magnetically self-assembled solar cell assembly
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
JP5008776B2 (ja) * 2010-03-19 2012-08-22 パナソニック株式会社 微細構造物を配置する方法
WO2012008253A1 (ja) * 2010-07-14 2012-01-19 シャープ株式会社 微細な物体の配置方法、配列装置、照明装置および表示装置
US20130199831A1 (en) * 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
JP6219929B2 (ja) * 2012-04-20 2017-10-25 レンセレイアー ポリテクニック インスティテュート 発光ダイオード及びそのパッケージング方法
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
TWI664711B (zh) * 2016-09-15 2019-07-01 美商伊樂視有限公司 具有表面貼裝發光元件的顯示器
US10607515B2 (en) * 2018-04-19 2020-03-31 Lg Electronics Inc. Display device using semiconductor light emitting device and method for manufacturing the same
CN111129245B (zh) * 2018-10-31 2022-09-06 成都辰显光电有限公司 一种led芯片、显示面板及显示面板的组装设备
CN111162064B (zh) * 2018-11-08 2022-03-25 成都辰显光电有限公司 Led单元、导引板、led显示器及其制造方法
WO2021054550A1 (en) 2019-09-19 2021-03-25 Lg Electronics Inc. Device for self-assembling semiconductor light-emitting diodes
KR102260638B1 (ko) * 2019-09-26 2021-06-04 엘지전자 주식회사 반도체 발광소자의 자가조립 장치

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8722905B2 (en) 2012-03-28 2014-05-13 Industrial Technology Research Institute Dyes and photoelectric conversion devices containing the same
TWI549316B (zh) * 2014-12-02 2016-09-11 錼創科技股份有限公司 The method of transferring light emitting wafers

Also Published As

Publication number Publication date
WO2006029091A3 (en) 2006-04-27
JP2008512230A (ja) 2008-04-24
WO2006029091A2 (en) 2006-03-16
EP1784862A2 (en) 2007-05-16
US20060051517A1 (en) 2006-03-09

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