JP2008507851A - 光保護層を有するチップ - Google Patents

光保護層を有するチップ Download PDF

Info

Publication number
JP2008507851A
JP2008507851A JP2007523208A JP2007523208A JP2008507851A JP 2008507851 A JP2008507851 A JP 2008507851A JP 2007523208 A JP2007523208 A JP 2007523208A JP 2007523208 A JP2007523208 A JP 2007523208A JP 2008507851 A JP2008507851 A JP 2008507851A
Authority
JP
Japan
Prior art keywords
chip
integrated circuit
dielectric
mirror coating
dielectric mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007523208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008507851A5 (https=
Inventor
クリスティアン、ツェンツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2008507851A publication Critical patent/JP2008507851A/ja
Publication of JP2008507851A5 publication Critical patent/JP2008507851A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Formation Of Insulating Films (AREA)
  • Light Receiving Elements (AREA)
JP2007523208A 2004-07-26 2005-07-20 光保護層を有するチップ Withdrawn JP2008507851A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04103562 2004-07-26
PCT/IB2005/052426 WO2006013507A1 (en) 2004-07-26 2005-07-20 Chip with light protection layer

Publications (2)

Publication Number Publication Date
JP2008507851A true JP2008507851A (ja) 2008-03-13
JP2008507851A5 JP2008507851A5 (https=) 2008-09-04

Family

ID=35423325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007523208A Withdrawn JP2008507851A (ja) 2004-07-26 2005-07-20 光保護層を有するチップ

Country Status (6)

Country Link
US (1) US20080093712A1 (https=)
EP (1) EP1774592A1 (https=)
JP (1) JP2008507851A (https=)
KR (1) KR20070039600A (https=)
CN (1) CN101027774B (https=)
WO (1) WO2006013507A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9230852B2 (en) 2013-02-25 2016-01-05 Texas Instruments Incorporated Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads
DE102014100469A1 (de) * 2013-11-29 2015-06-03 Epcos Ag Elektronisches Bauelement und Verwendung desselben
US9697455B2 (en) * 2014-12-26 2017-07-04 Avery Dennison Retail Information Services, Llc Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress
EP3353125B1 (en) 2015-09-25 2023-09-20 Materion Corporation High optical power light conversion device using an optoceramic phosphor element with solder attachment
US11610846B2 (en) 2019-04-12 2023-03-21 Adeia Semiconductor Bonding Technologies Inc. Protective elements for bonded structures including an obstructive element
US11373963B2 (en) 2019-04-12 2022-06-28 Invensas Bonding Technologies, Inc. Protective elements for bonded structures
US11205625B2 (en) 2019-04-12 2021-12-21 Invensas Bonding Technologies, Inc. Wafer-level bonding of obstructive elements
US11385278B2 (en) 2019-05-23 2022-07-12 Invensas Bonding Technologies, Inc. Security circuitry for bonded structures
WO2021196039A1 (zh) * 2020-03-31 2021-10-07 深圳市汇顶科技股份有限公司 安全芯片、安全芯片的制造方法和电子设备
US12278255B2 (en) * 2021-06-11 2025-04-15 Raytheon Company Thin film obscurant for microelectronics
JP2024530539A (ja) * 2021-07-16 2024-08-22 アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド 接合構造のための光学的妨害保護素子
KR20240036698A (ko) 2021-08-02 2024-03-20 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 결합 구조체를 위한 보호 반도체 소자

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2228298B1 (https=) * 1973-05-03 1978-01-06 Ibm
US5468990A (en) * 1993-07-22 1995-11-21 National Semiconductor Corp. Structures for preventing reverse engineering of integrated circuits
JPH07301824A (ja) * 1994-05-09 1995-11-14 Seiko Instr Inc 光弁用半導体装置
FR2735437B1 (fr) * 1995-06-19 1997-08-14 Sevylor International Vehicule roulant, notamment robot de nettoyage en particulier de piscine, a changement automatique de direction de deplacement devant un obstacle
US5917202A (en) * 1995-12-21 1999-06-29 Hewlett-Packard Company Highly reflective contacts for light emitting semiconductor devices
US5711987A (en) * 1996-10-04 1998-01-27 Dow Corning Corporation Electronic coatings
DE19840251B4 (de) * 1998-09-03 2004-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltungschip, insbesondere Transponder mit Lichtschutz
US6515304B1 (en) * 2000-06-23 2003-02-04 International Business Machines Corporation Device for defeating reverse engineering of integrated circuits by optical means
US6686977B2 (en) * 2001-07-24 2004-02-03 Three-Five Systems, Inc. Liquid crystal on silicon device
WO2003098692A1 (en) * 2002-05-14 2003-11-27 Hrl Laboratories, Llc Integrated circuit with reverse engineering protection
US6933013B2 (en) * 2003-10-14 2005-08-23 Photon Dynamics, Inc. Vacuum deposition of dielectric coatings on volatile material

Also Published As

Publication number Publication date
WO2006013507A1 (en) 2006-02-09
CN101027774A (zh) 2007-08-29
EP1774592A1 (en) 2007-04-18
US20080093712A1 (en) 2008-04-24
CN101027774B (zh) 2011-10-26
KR20070039600A (ko) 2007-04-12

Similar Documents

Publication Publication Date Title
EP2128665B1 (en) Optical filter that uses localized plasmons
CN101730857B (zh) 滤光器和受光元件
US7142363B2 (en) Diffraction element and optical device
US9726794B2 (en) High index contrast grating structure for light manipulation and related method
JP2008507851A (ja) 光保護層を有するチップ
US11933940B1 (en) Materials for metalenses, through-waveguide reflective metasurface couplers, and other metasurfaces
JP2025143488A (ja) 受光素子
JP6559208B2 (ja) フィルターコリメータおよびその形成方法
US10451483B2 (en) Short wave infrared polarimeter
US20140054462A1 (en) Device and Method for Increasing Infrared Absorption in MEMS Bolometers
CN109931817A (zh) 抗激光损伤自适应防护装置和应用该装置的光学探测系统
CN102356343A (zh) 摄像装置
US20210271148A1 (en) High-Efficiency End-Fire 3D Optical Phased Array Based On Multi-Layer Platform
US7508567B1 (en) Metal etalon with enhancing stack
US20100208346A1 (en) Multilayer Dielectric Transmission Gratings Having Maximal Transmitted Diffraction Efficiency
US9606266B2 (en) Optical element, optical element array, and solid-state image-pickup apparatus
JP6895494B2 (ja) 光フィルター構造
US20250176288A1 (en) Photodetector
KR20230120905A (ko) 광학 필터 캐리어, 광학 필터를 갖는 이미지 센서 패키지, 광학 필터 캐리어를 제조하는 방법, 및 이미지 센서 패키지를 제조하는 방법
KR19990015314A (ko) 적외선 차단용 코팅 박막
US20150115384A1 (en) Light receiving device
JP2001015774A (ja) 光センサ

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20080522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080717

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080717

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20091102