JP2008500447A5 - - Google Patents

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Publication number
JP2008500447A5
JP2008500447A5 JP2007527460A JP2007527460A JP2008500447A5 JP 2008500447 A5 JP2008500447 A5 JP 2008500447A5 JP 2007527460 A JP2007527460 A JP 2007527460A JP 2007527460 A JP2007527460 A JP 2007527460A JP 2008500447 A5 JP2008500447 A5 JP 2008500447A5
Authority
JP
Japan
Prior art keywords
temperatures
hot melt
less
temperature
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2007527460A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008500447A (ja
Filing date
Publication date
Priority claimed from US10/851,584 external-priority patent/US7148284B2/en
Application filed filed Critical
Publication of JP2008500447A publication Critical patent/JP2008500447A/ja
Publication of JP2008500447A5 publication Critical patent/JP2008500447A5/ja
Ceased legal-status Critical Current

Links

JP2007527460A 2004-05-21 2005-05-20 ホットメルト接着剤 Ceased JP2008500447A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/851,584 US7148284B2 (en) 2004-05-21 2004-05-21 Hot melt adhesive
PCT/US2005/017663 WO2005113698A2 (en) 2004-05-21 2005-05-20 Hot melt adhesive

Publications (2)

Publication Number Publication Date
JP2008500447A JP2008500447A (ja) 2008-01-10
JP2008500447A5 true JP2008500447A5 (cg-RX-API-DMAC7.html) 2011-12-15

Family

ID=35134670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007527460A Ceased JP2008500447A (ja) 2004-05-21 2005-05-20 ホットメルト接着剤

Country Status (10)

Country Link
US (1) US7148284B2 (cg-RX-API-DMAC7.html)
EP (1) EP1747253B1 (cg-RX-API-DMAC7.html)
JP (1) JP2008500447A (cg-RX-API-DMAC7.html)
CN (1) CN101001932B (cg-RX-API-DMAC7.html)
AT (1) ATE407187T1 (cg-RX-API-DMAC7.html)
CA (1) CA2565356A1 (cg-RX-API-DMAC7.html)
DE (1) DE602005009522D1 (cg-RX-API-DMAC7.html)
ES (1) ES2314704T3 (cg-RX-API-DMAC7.html)
PL (1) PL1747253T3 (cg-RX-API-DMAC7.html)
WO (1) WO2005113698A2 (cg-RX-API-DMAC7.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005030431A1 (de) * 2005-06-30 2007-01-11 Henkel Kgaa Schmelzklebstoff mit Duftstoffen
ES2622738T3 (es) * 2005-12-07 2017-07-07 The Procter & Gamble Company Composiciones poliméricas para la liberación sostenida de materiales volátiles
US7579394B2 (en) * 2007-01-16 2009-08-25 Xerox Corporation Adhesion promoter
US7910794B2 (en) * 2007-03-05 2011-03-22 Adherent Laboratories, Inc. Disposable diaper construction and adhesive
US20100323134A1 (en) * 2009-06-23 2010-12-23 Appleton Papers Inc. Laminate with Aroma Burst
US8829105B2 (en) 2012-01-18 2014-09-09 Eastman Chemical Company Low molecular weight polystyrene resin and methods of making and using the same
AU2013211519B2 (en) 2012-08-08 2017-11-02 Bissell Inc. Solid fragrance carrier and method of use in a vacuum cleaner
US10342886B2 (en) 2016-01-26 2019-07-09 S.C. Johnson & Son, Inc. Extruded wax melt and method of producing same
CN105733473A (zh) * 2016-04-14 2016-07-06 金猴集团威海鞋业有限公司 一种基于eva纳米改性抗菌功能热熔胶材料
US10010638B2 (en) 2016-06-14 2018-07-03 S. C. Johnson & Son, Inc. Wax melt with filler
US20230046550A1 (en) * 2019-12-04 2023-02-16 Exxonmobil Research And Engineering Company Adhesive compositions
BR112022025137A2 (pt) * 2020-06-09 2022-12-27 Dow Global Technologies Llc Artigo com camada de espuma reticulada aderida ao substrato

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825705B2 (ja) * 1975-10-09 1983-05-28 日石三菱株式会社 ネツヨウユウセイセツチヤクザイソセイブツ
US4060569A (en) * 1975-12-24 1977-11-29 Petrolite Corporation Hydrocarbon polymers
US4146521A (en) * 1977-09-02 1979-03-27 Eastman Kodak Company Polyethylene containing hot melt adhesives
US4345349A (en) * 1981-07-30 1982-08-24 National Starch And Chemical Corporation Adhesive for perfect bound books and method of using same
US4816306A (en) * 1987-06-19 1989-03-28 National Starch And Chemical Corporation Hot melt adhesives based on ethylene-n-butyl acrylate
US5220388A (en) 1987-10-08 1993-06-15 Fuji Photo Film Co., Ltd. Method of and apparatus for transferring toner images
US5414039A (en) * 1993-02-16 1995-05-09 Petrolite Corporation Repulpable hot melt adhesive for packaging materials containing an ethylene vinyl acetate copolymer having 40-60 weight percent of vinyl acetate units, a tackifier and a high molecular weight oxygen-containing polymer
US5604268A (en) * 1995-02-22 1997-02-18 Minnesota Mining And Manufacturing Company Glue crayons
JP3469384B2 (ja) * 1995-12-14 2003-11-25 株式会社クラレ 接着剤組成物
US6107430A (en) * 1996-03-14 2000-08-22 The Dow Chemical Company Low application temperature hot melt adhesive comprising ethylene α-olefin
US6221448B1 (en) * 1996-07-22 2001-04-24 H. B. Fuller Licensing & Financing, Inc. Cold seal compositions comprising homogeneous ethylene polymers
JPH10130610A (ja) * 1996-10-30 1998-05-19 Nippon Unicar Co Ltd ホットメルト接着剤およびホットメルト接着剤組成物
US5827913A (en) * 1997-02-05 1998-10-27 H.B. Fuller Licensing & Financing, Inc. Hot melt adhesive comprising an encapsulated ingredient
EP0977820B1 (en) * 1997-04-30 2004-07-14 Ato Findley Inc Hot melt adhesive with high peel and shear strengths for nonwoven applications
EP1025173B1 (en) * 1997-10-21 2003-09-24 Dow Global Technologies Inc. Thermoplastic marking compositions
US6262153B1 (en) * 1998-10-12 2001-07-17 Clariant Finance (Bvi) Limited Colored wax articles
US6329468B1 (en) * 2000-01-21 2001-12-11 Bostik Findley, Inc. Hot melt adhesive based on semicrystalline flexible polyolefins
JP5217071B2 (ja) * 2000-05-15 2013-06-19 東亞合成株式会社 粘着剤組成物
JP2002003804A (ja) * 2000-06-19 2002-01-09 Nippon Nsc Ltd ホットメルト接着剤
US20030195272A1 (en) 2001-02-01 2003-10-16 Michael Harwell Scented hot melt adhesives
JP2003061714A (ja) * 2001-08-29 2003-03-04 Ykk Corp 繊維製面ファスナーの仕上げ方法と繊維製面ファスナー
US20040045666A1 (en) * 2002-09-06 2004-03-11 Lie-Zhong Gong Hot melt adhesive and use thereof
US20060014901A1 (en) * 2003-05-19 2006-01-19 Aziz Hassan Novel wax-like polymer for use in hot melt adhesive applications
US20050003197A1 (en) * 2003-07-03 2005-01-06 Good David J. Hot melt adhesive

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