JP2008311386A - Baking jig for terminal electrode film in chip-type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a baking jig for a terminal electrode film in a chip-type electronic component that can evenly bake a terminal electrode film, which is low in cost, comparatively robust, and enabled in effective heating. <P>SOLUTION: In the baking jig for a terminal electrode film in a chip-type electronic component, the bottom surface of a frame 1 is made to be a multi-porous surface, the frame 1 formed of a refractory metal and formed into a box with its top surface open for a multistage pile, and a metal gauze 6 formed of a refractory metal is arranged into this frame so as to contact with the bottom surface a plurality of cut-out windows 5 for ventilation are installed in a row at a rising part 4 of each side surface of the frame, the top side of the rising part of each side surface of the frame is around in around the metal gauze, and the end of metal gauze 6a is fixed 7 to the metal gauze at this side of the around part in the cut-out windows. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  In the present invention, a bottom surface of a heat-resistant metal frame configured in a box shape with an open top surface is formed as a porous surface so that it can be stacked in a multi-stage shape, and a metal net made of heat-resistant metal is formed on the bottom surface of the frame body The present invention relates to a firing jig for a terminal electrode film in a chip-type electronic component disposed so as to be in contact with the chip-type electronic component.

  Conventionally, the bottom surface of a heat-resistant metal frame configured in a box shape with an open top surface is made porous so that it can be stacked in multiple stages, and a metal net made of heat-resistant metal is in contact with the bottom surface of the frame in this frame In the firing tool for the terminal electrode film in the chip-type electronic component placed on the metal mesh placed so as to be in contact with the bottom surface of the frame body, the periphery thereof is held by a holding frame, and the side plate of the frame body configured in a box shape Some have a notch for hot air ventilation (see, for example, Patent Document 1).

Japanese Patent No. 3438846

  By the way, in the jig for firing the terminal electrode film in the chip-type electronic component of the above-described conventional example, the wire mesh disposed so as to be in contact with the bottom surface of the frame body is held by the holding frame around the periphery, so The presser frame is required and the cost is high, and the wire mesh is not sufficiently held. The wire mesh may be kept unstable, and the side plate that is a rising part of the box-shaped frame body is formed with a notch. In such a ventilation path, the strength of the side plate is not reinforced, and there is a risk that hot air cannot pass evenly.

  The present invention has been made in view of such problems of the prior art, and the object of the present invention is to allow uniform firing of the terminal electrode film, which is inexpensive and relatively robust and effective. An object of the present invention is to provide a firing tool for a terminal electrode film in a chip-type electronic component that can be heated.

  To achieve the above object, the terminal electrode film firing jig in the chip-type electronic component according to the present invention is a refractory metal frame configured in a box shape with an open top so that it can be stacked in multiple stages. The bottom surface is a porous surface, and a heat-resistant metal wire mesh is arranged in this frame so as to be in contact with the bottom surface of the frame, and a plurality of ventilation windows are arranged in a row on each side rising portion of the frame, The upper end side of each side rising portion of the frame body is wound around the wire mesh, and the end portion of the wire mesh is fixed to the wire mesh in front of the winding portion in the cutout window.

  According to the present invention, the periphery of the wire mesh is a structure in which the upper end side of each side rising portion of the frame body is wound, so that the steel plate material of the frame body can be relatively thick, and thereby the upper surface of the wire mesh The flatness can be maintained for a long time, and a large number of mounted chip capacitors can be stably placed and maintained, but since the cut-out windows are arranged on each side, the hot air can pass almost uniformly, It is a jig for firing terminal electrode films in chip-type electronic components that is inexpensive and relatively robust and capable of effective heating.

  A plurality of ventilation windows are arranged in a row on each side rising portion of the frame body, the upper end side of each side surface rising portion of the frame body is wound around the wire mesh, and the end portion of the wire mesh is wound in the cutout window. A jig for firing a terminal electrode film in a chip-type electronic component fixed to a wire mesh in front of the part.

A first embodiment of the present invention will be described with reference to FIGS. 1 to 3 of the accompanying drawings.
1 is a plan view of a firing jig according to the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a cross-sectional view taken along line AA of FIG.

  1 to 3, reference numeral 1 denotes a frame made of a heat-resistant metal such as stainless steel, for example, having a plate thickness of 1 mm, which is configured in a box shape with an open top so that it can be stacked in a multi-stage shape. Are formed in a porous surface, and a plurality of cutout windows 5, 4 are formed by punching or the like on each of the side surface rising portions 4, 4 ... of the frame 1 constituting the box shape. 5 ... are arranged in a row. The hole 3 and the window 5 constitute a hot air passage.

  6 is a metal mesh plain-woven with a heat-resistant metal wire such as stainless steel, and the metal mesh 6 is arranged so as to be in contact with the bottom surface 2 of the frame 1, and the periphery of the metal mesh 6 is raised on each side surface of the frame 1. Are raised along the inner surfaces of the portions 4, 4... And the upper end sides of the side surface rising portions 4, 4... Of the frame body are wound, and the end portions 6a thereof are positioned in the cutout windows 5, 5.

  The end 6a of the wire mesh 6 is fixed 7 in the cutout window 5 by spot welding or the like, as shown in FIG. Then, the fixing part is made to have a pitch of, for example, an interval of 8 to 10 mm in the cutout window 5, so that the cause of hindrance of passing hot air through the metal mesh 6 can be further reduced. Thus, the frame 1 is securely held by the frame 1.

  8 and 8 are stepped stoppers / handles disposed at the four corners of the side surface rising parts 4, 4 ... of the frame body 1, and the operation of stacking or removing a plurality of frame bodies 1 is easy. It helps to ensure.

  With the configuration as described above, a large number of chip capacitors having conductive paste applied in advance to the left and right end faces are placed on the upper surface of the wire mesh 6 in the frame 1 so as not to be in close contact with each other. Are introduced into the heating furnace in a stacked state, so that hot air is introduced into each frame body 1 from the through holes 3, 3... Of the bottom surface 2 and the cut windows 5, 5. Since each chip capacitor can be heated by passing through, the conductive paste can be fired into the terminal electrode film.

  At this time, since the periphery of the wire mesh 6 is wound around the upper end side of each side surface rising portion 4 of the frame body 1 and fixed at the portion of the cutout window 5, the frame body 1 is relatively thick. As a result, the flatness of the upper surface of the wire mesh 6 can be maintained for a long time, and a large number of chip capacitors can be stably placed and maintained. Therefore, the hot air can be passed almost uniformly, and the chip capacitor is effectively heated.

FIG. 1 is a plan view of a firing jig according to the present invention. FIG. 2 is a side view thereof. FIG. 3 is a sectional view taken along the line AA in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 2 Bottom face of frame 4 Side surface rising part of frame 5 Cutout window 6 Wire mesh 7 Adhering part

Claims (1)

The bottom surface of the heat-resistant metal frame configured in a box shape with an open top surface is made porous so that it can be stacked in multiple stages, and the heat-resistant metal wire mesh is placed in contact with the bottom surface of the frame in this frame In the jig for firing the terminal electrode film in the chip-type electronic component, a plurality of ventilation windows are arranged in a row on each side rising portion of the frame body, and the upper end of each side surface rising portion of the frame body around the wire mesh A jig for firing a terminal electrode film in a chip-type electronic component, wherein the side is wound and the end of the wire mesh is fixed to the wire mesh in front of the wind-up portion in the cutout window.