JPH09180972A - Structure of baking jig for terminal electrode film for chip electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the rate of generating defective products during baking by removably mounting a wire gauze in a frame so as to permit the wire gauze to make contact with the bottom of the frame. SOLUTION: A jig 11 is composed of a frame 12, a wire gauze 13 and a holding frame 14. The frame 12 is formed of a heat resistant metal plate, such as stainless steel, in a box shape with its top plane open, allowing multi-step piling. The wire gauze 13 is flatly formed of heat resistant metal, such as stainless steel, and is removably mounted in the frame 12 so as to make contact with the bottom plate 12a of the frame 12. The holding frame 14 is formed of heat resistant metal, such as stainless steel, and has a shape of a frame so as to make contact with the circumference of the wire gauze 13, and is removably mounted in the frame 12. Thus, the terminal electrode film of each chip-shaped electronic component is prevented from integrally connecting during baking.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a baking jig used for forming a terminal electrode film on an end surface of a chip type electronic component such as a chip capacitor by baking.

[0002]

2. Description of the Related Art Generally, a terminal electrode film in a chip capacitor is formed by applying a conductive paste on both left and right end surfaces of the chip capacitor, and then placing the film in a heating furnace for heating and firing. Then, in the above firing, conventionally, a jig as shown in FIGS. 5 and 6 is used.

That is, in the frame body 2 made of a heat-resistant metal rod made of stainless steel or the like and having an open top, the cage 3 made of a metal mesh made of heat-resistant metal such as stainless steel is made open-top. Using the loaded jig 1, a large number of chip capacitors A each having a left and right end surfaces coated with a conductive paste in advance are placed in a cage 2 of the jig 1 so as not to be in close contact with each other. A plurality of jigs 1 are stacked and stacked in a multi-stage manner, and then placed in a heating furnace in this state to burn the conductive paste.

[0004]

However, the conventional jig 1
As shown in FIG. 5, the wire mesh cage 3 in FIG. 5 is constructed by bending the side plates 3b, 3c, 3d, 3e upward from the periphery of the bottom plate 3a. And the thermal expansion of the bottom plate 3a due to the heating, the side plates 3b, 3c, 3 bent upward from the periphery thereof.
Due to the restriction by d and 3e, the bottom plate 3a is partially deformed as shown by the chain double-dashed line B in FIG.

In other words, in the conventional jig, the bottom plate 3a of the cage 3 made of wire mesh partially deforms due to heat, so that each chip capacitor A placed in the cage 3 is The conductive pastes for the terminal electrode films on the end faces gathering in close contact with each other in the recessed deformation portion are fired in a state where they are integrally connected to each other, and after this firing, they are separated for each chip capacitor. At that time, the terminal electrode film on one or both of the chip capacitors is chipped, so that the incidence of defective products increases.

An object of the present invention is to provide a structure of a firing jig capable of surely reducing the occurrence of this problem.

[0007]

In order to attain this technical object, the present invention provides "a heat-resistant metal frame body having a box-shaped structure with an open top surface so that it can be stacked in multiple stages. Then, a wire mesh made of a heat-resistant metal is detachably loaded into the frame body so that the wire mesh is in contact with the bottom surface of the frame body, and the frame-shaped heat-resistant metal mesh is formed so as to come into contact with the periphery of the wire mesh. The pressing frame of is attached detachably. "

[0008]

Operation and effect of the present invention
The chip-type electronic component placed on the upper surface of the wire mesh is held by a pressing frame that contacts the periphery of the wire mesh so that it does not fall outside the wire mesh. It is heated by the hot air that enters the body.

In this case, since the wire mesh is detachably loaded in the frame body so that the wire mesh is in contact with the bottom surface of the frame body, the wire mesh is freely thermally expanded in the frame body. It is possible to reliably reduce the downward deformation of the wire mesh due to thermal expansion. Therefore, according to the present invention, it is possible to prevent the terminal electrode films of each chip-type electronic component from being integrally connected to each other during firing of the terminal electrode film of the chip-type electronic component, thereby significantly reducing the incidence of defective products. Have an effect.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS. In this figure, reference numeral 11 indicates a jig according to the present invention, and the jig 11 is composed of a frame body 12, a wire mesh 13, and a holding frame 14. The frame body 12 is made of a heat-resistant metal plate such as stainless steel and has a box-like shape with an open top surface so that it can be stacked in multiple stages. The bottom plate 12a has a large number of holes 12a 'formed therein. By forming it, it is formed into a porous surface, and the side plates 12b, 12c,
The notches 12b ', 12 for ventilation are provided in 12d, 12e.
c ′, 12d ′, 12e ′ are provided respectively, and further, of the side plates 12b, 12c, 12d, 12e, the frame body 12 is provided at the upper ends of the two side plates 12b, 12d facing each other.
12f and 12g for easy handling
Are integrally provided so as to project outward.

The wire net 13 is made of a heat-resistant metal such as stainless steel and has a flat shape. The wire net 13 is detachably mounted in the frame 12 so that the wire net 13 contacts the bottom plate 12a of the frame 12. To be done. Furthermore, the pressing body 1
Reference numeral 4 is a heat-resistant metal such as stainless steel, which is configured in a frame shape so as to come into contact with the periphery of the wire mesh 13, and is detachably loaded in the frame body 12.

It is to be noted that the four corners of the pressing body 14 are provided with protrusions 14a which are appropriately protruded from the upper surface of the frame body 12 by the dimension S when the pressing body 14 is loaded into the frame body 12, thereby providing the above-mentioned fixing. When a plurality of the tools 11 are stacked in a multi-step manner, the protrusions 14a are fitted into the holes 12h formed at the four corners of the frame body 12 in the upper step so that they can be stacked without being displaced in the lateral direction. In addition to the configuration, the frame body 12 in the upper stage is configured to press the pressing body 14 in the frame body 12 in the lower stage downward.

In this structure, the frame 12 of each jig 11
On the upper surface of the wire net 13 in the inside, a large number of chip capacitors A each having a left and right end surfaces coated with a conductive paste in advance are placed side by side so as not to be in close contact with each other.
By stacking a plurality of 1's in a multi-stage manner and putting them in the heating furnace in this state, the holes 12a 'in the bottom plate 12a and the side plates 12b, 12c, Notch 1 in 12d and 12e
Since hot air can enter from 2b ', 12c', 12d ', 12e' to heat each chip capacitor A, the conductive paste on both end faces can be fired into the terminal electrode film.

In this case, each chip capacitor A placed on the upper surface of the wire net 13 in each jig 11 has a holding frame 14 contacting the periphery of the wire net 13 and each side plate 12b, 12c, 12d, 12e of the frame 11. Is held so that it does not fall outside. On the other hand, the wire netting 13 is detachably loaded in the frame body 12 so that the wire netting 13 is in contact with the bottom plate 12a of the frame body 12, so that the wire netting 13 is freely thermally expanded in the frame body 12. Therefore, it is possible to reliably reduce the downward deformation of the wire netting 13 due to thermal expansion.

Since the frame 12 of each jig 11 is provided with the handling projections 12f and 12g, the jigs 11 can be easily stacked and handled. Side plates 12b, 12 in
Notches 12b ', 12c', 12 in c, 12d, 12e
By providing the d'and 12e 'respectively, the chip capacitors A in the d'and 12e' can be heated equally at each place, and uneven heating can be prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a jig according to the present invention.

FIG. 2 is a perspective view of a jig according to the present invention in an assembled state.

3 is an enlarged sectional view taken along line III-III of FIG.

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG. 2;

FIG. 5 is an exploded perspective view of a conventional jig.

FIG. 6 is a cross-sectional view of a conventional jig in an assembled state.

[Explanation of symbols]

 11 jig 12 frame 12a bottom plate of frame 13 wire netting 14 pressing body A chip capacitor

Claims (1)

[Claims] 1. A box-shaped heat-resistant metal frame whose upper surface is open so that it can be stacked in multiple stages. The bottom surface of the frame body is made porous, and a wire mesh made of heat-resistant metal is provided in the frame body.
A chip characterized in that the wire mesh is detachably loaded so as to be in contact with the bottom surface of the frame body, and a heat-resistant metal holding frame formed in a frame shape so as to be in contact with the periphery of the wire mesh is detachably loaded. Structure of jig for baking terminal electrode film in mold type electronic parts.