JP2012114266A - Ceramic component holder and ceramic component handling method - Google Patents

Ceramic component holder and ceramic component handling method Download PDF

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JP2012114266A
JP2012114266A JP2010262366A JP2010262366A JP2012114266A JP 2012114266 A JP2012114266 A JP 2012114266A JP 2010262366 A JP2010262366 A JP 2010262366A JP 2010262366 A JP2010262366 A JP 2010262366A JP 2012114266 A JP2012114266 A JP 2012114266A
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frame
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ceramic component
inner frame
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JP5456646B2 (en
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Satoshi Odajima
智 小田嶋
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a ceramic component holder and a ceramic component handling method, capable of being still used at a dicing step or the like to speed up an operation.SOLUTION: A ceramic component holder comprises: a holding frame 10 capable of storing a laminated ceramic capacitor array 1 in its hollow portion; and a flexible adhesive holding layer 20 supported by the holding frame 10, for detachably adhering and holding the ceramic capacitor array 1. The holding frame 10 is formed of an endless inner frame 11 partitioning the hollow portion, and an endless outer frame 13 detachably fitted into the inner frame 11. The inner frame 11 and the outer frame 13 each are formed so as to have a thickness of 1.0-2.8 mm, and sandwich a peripheral edge of the adhesive holding layer 20 therebetween. The outer frame 13 is cut out on front, back, right and left sides of an outer peripheral edge thereof.

Description

本発明は、製造工程でセラミック部品を収容、保管、加工、処理、搬送等する際に使用されるセラミック部品用保持具及びセラミック部品の取り扱い方法に関するものである。   The present invention relates to a ceramic component holder and a ceramic component handling method used when a ceramic component is accommodated, stored, processed, processed, conveyed, and the like in a manufacturing process.

従来におけるセラミック部品用保持具は、図示しないが、積層されたセラミックキャパシタアレイを中空部に収容可能な保持フレームと、この保持フレームに支持されてセラミックキャパシタアレイを着脱自在に粘着保持する可撓性の粘着保持層とを備え、セラミックキャパシタの製造工程で使用される（特許文献１参照）。   A conventional ceramic component holder is not shown, but a holding frame that can accommodate a laminated ceramic capacitor array in a hollow portion, and a flexibility that is supported by the holding frame and detachably holds the ceramic capacitor array. It is used in the manufacturing process of a ceramic capacitor (refer patent document 1).

保持フレームは、平面リング形の内フレームと、この内フレームに着脱自在に嵌合する平面リング形の外フレームとを備え、強度を確保する観点から７ｍｍ程度の厚肉に形成されている。これら内フレームと外フレームとの間には、粘着保持層の周縁部が挟持される。粘着保持層は、自己粘着性の材料（例えば、アクリル系やＵＶ系等の材料）により形成され、保持フレームの内フレームと外フレームとの間に挟持されて余剰部がカットされたり、余剰部を有しない所定の大きさの円形に予め形成される。   The holding frame includes a planar ring-shaped inner frame and a planar ring-shaped outer frame that is detachably fitted to the inner frame, and is formed with a thickness of about 7 mm from the viewpoint of ensuring strength. Between the inner frame and the outer frame, the peripheral edge portion of the adhesive holding layer is sandwiched. The adhesive holding layer is formed of a self-adhesive material (for example, acrylic or UV-based material), and is sandwiched between the inner frame and the outer frame of the holding frame to cut or remove the excess part. It is formed in advance in a circular shape of a predetermined size that does not have

特開平０９‐１２９４８５号公報JP 09-129485 A

従来におけるセラミック部品用保持具は、以上のように構成され、保持フレームが厚肉なので、セラミックキャパシタの製造工程、例えばセラミックキャパシタアレイをダイシングするダイシング工程で使用するのに支障を来たし、その場合には、別の治具にセラミックキャパシタアレイを移し替えなければならないので、作業の複雑化や遅延を招くおそれがある。   The conventional ceramic component holder is configured as described above, and the holding frame is thick, which hinders its use in a ceramic capacitor manufacturing process, for example, a dicing process for dicing a ceramic capacitor array. However, since it is necessary to transfer the ceramic capacitor array to another jig, there is a possibility that the work may be complicated and delayed.

本発明は上記に鑑みなされたもので、ダイシング工程等でそのまま使用して作業の迅速化を図ることのできるセラミック部品用保持具及びセラミック部品の取り扱い方法を提供することを目的としている。   The present invention has been made in view of the above, and an object of the present invention is to provide a ceramic component holder and a ceramic component handling method that can be used as they are in a dicing process or the like to speed up the operation.

本発明においては上記課題を解決するため、セラミック部品を中空部に収容可能な保持フレームと、この保持フレームに支持されてセラミック部品を着脱自在に粘着保持する可撓性の粘着保持層とを備えた保持具であって、
保持フレームを、中空部を区画するエンドレスの内フレームと、この内フレームに着脱自在に嵌合するエンドレスの外フレームとから形成するとともに、これら内フレームと外フレームとをそれぞれ１．０〜２．８ｍｍの厚さに形成してその間には粘着保持層の周縁部を挟み、外フレームの外周縁部の前後左右をそれぞれ直線的に切り欠いたことを特徴としている。 In order to solve the above-described problems, the present invention includes a holding frame that can accommodate a ceramic part in a hollow portion, and a flexible adhesive holding layer that is supported by the holding frame and detachably adheres and holds the ceramic part. Holding tool,
The holding frame is formed of an endless inner frame that divides the hollow portion and an endless outer frame that is detachably fitted to the inner frame, and the inner frame and the outer frame are respectively 1.0 to 2. A thickness of 8 mm is formed, and a peripheral edge portion of the adhesive holding layer is sandwiched therebetween, and front, rear, left and right of the outer peripheral edge portion of the outer frame are respectively cut out linearly.

なお、保持フレームの内フレームと外フレームとの相対向する対向壁のいずれか一方に凹部を、他方には凸部をそれぞれ形成し、これら凹部と凸部とを粘着保持層の周縁部を介して嵌合可能とすることが好ましい。   In addition, a concave portion is formed on one of opposing walls of the holding frame facing each other and a convex portion is formed on the other, and the concave portion and the convex portion are formed via the peripheral portion of the adhesive holding layer. It is preferable to enable fitting.

また、本発明においては上記課題を解決するため、請求項１又は２記載のセラミック部品用保持具にセラミック部品を保持させて取り扱う取り扱い方法であって、
保持フレームの内フレームと外フレームとを嵌合してこれらの間には粘着保持層の周縁部を挟み持たせ、この粘着保持層にセラミック部品群を粘着保持させて保持フレームの中空部に位置させ、セラミック部品群をダイシングして複数のセラミック部品を分割形成することを特徴としている。 Further, in the present invention, in order to solve the above-mentioned problem, a handling method in which the ceramic component is held in the ceramic component holder according to claim 1 or 2 and handled.
The inner frame and the outer frame of the holding frame are fitted to each other, and the peripheral portion of the adhesive holding layer is sandwiched between them, and the ceramic component group is adhesively held by the adhesive holding layer and positioned in the hollow portion of the holding frame. In other words, the ceramic component group is diced to form a plurality of ceramic components.

ここで、特許請求の範囲におけるセラミック部品は、少なくともセラミック製の各種電子部品を単数複数含み、一体のグループや群をなしていても良い。このセラミック部品には、例えばセラミック製のキャパシタやチップ等が該当する。また、保持フレームの内フレームと外フレームとは、リング形や枠形等の形状にすることができる。粘着保持層は、透明、不透明、半透明を特に問うものではない。さらに、本発明に係るセラミック部品用保持具は、ダイシング工程の他、各種の加工処理工程やピックアップ工程等でも使用することができる。   Here, the ceramic parts in the claims may include at least one or more ceramic electronic parts and may form an integral group or group. This ceramic component corresponds to a ceramic capacitor or chip, for example. Further, the inner frame and the outer frame of the holding frame can be formed in a ring shape, a frame shape, or the like. The adhesive holding layer is not particularly required to be transparent, opaque or translucent. Furthermore, the ceramic component holder according to the present invention can be used not only in the dicing process but also in various processing processes and pick-up processes.

本発明によれば、保持フレームを薄肉化してその内フレームや外フレームを１．０〜２．８ｍｍの薄さとするので、保持フレームにセラミック部品やセラミック部品群を粘着保持層を介し保持していても、製造途中でセラミック部品やセラミック部品群を移し替える必要が少ない。   According to the present invention, the holding frame is thinned so that the inner frame and the outer frame have a thickness of 1.0 to 2.8 mm. Therefore, the ceramic component and the ceramic component group are held on the holding frame via the adhesive holding layer. However, there is little need to transfer ceramic parts or ceramic parts during production.

本発明によれば、ダイシング工程等で保持フレームをそのまま使用して作業の迅速化を実現することができるという効果がある。   According to the present invention, there is an effect that it is possible to speed up the operation by using the holding frame as it is in a dicing process or the like.

また、請求項２記載の発明によれば、内フレームと外フレームの凹凸部を対向させて嵌め合わせるので、内フレームの表面と外フレームの表面の高さを略面一に揃えたり、粘着保持層の周縁部を容易に挟むことができ、しかも、簡易な構成で内フレーム又は外フレームの脱落を防ぐことができる。
また、請求項３記載の発明によれば、少なくともセラミック部品やセラミック部品群に対する所定の加工処理工程、例えばダイシング工程で保持フレームをそのまま使用することが可能になる。 According to the second aspect of the present invention, since the concave and convex portions of the inner frame and the outer frame are fitted to face each other, the surface of the inner frame and the surface of the outer frame are substantially flush with each other, or the adhesive holding is maintained. The peripheral edge of the layer can be easily sandwiched, and the inner frame or the outer frame can be prevented from falling off with a simple configuration.
According to the third aspect of the present invention, the holding frame can be used as it is at least in a predetermined processing step for the ceramic component or the ceramic component group, for example, a dicing step.

本発明に係るセラミック部品用保持具の実施形態におけるセラミックキャパシタアレイを粘着保持した状態を模式的に示す平面説明図である。It is a plane explanatory view showing typically the state where the ceramic capacitor array in the embodiment of the ceramic component holder according to the present invention was adhesively held. 本発明に係るセラミック部品用保持具の実施形態におけるセラミックキャパシタアレイを粘着保持した状態を模式的に示す断面説明図である。It is a section explanatory view showing typically the state where the ceramic capacitor array in the embodiment of the ceramic component holder according to the present invention was adhered and held. 本発明に係るセラミック部品用保持具の実施形態における内フレームと外フレームの一部を模式的に示す部分断面説明図である。It is a fragmentary sectional view showing typically a part of the inner frame and the outer frame in the embodiment of the ceramic component holder according to the present invention. 本発明に係るセラミック部品用保持具の実施形態における保持フレームを模式的に示す平面説明図である。It is a plane explanatory view showing typically the holding frame in the embodiment of the ceramic component holder according to the present invention. 本発明に係るセラミック部品用保持具の実施形態における保持フレームを模式的に示す裏面説明図である。It is back surface explanatory drawing which shows typically the holding frame in embodiment of the holder for ceramic components which concerns on this invention. 本発明に係るセラミック部品用保持具の実施形態における保持フレームを模式的に示す正面説明図である。It is front explanatory drawing which shows typically the holding frame in embodiment of the holder for ceramic components which concerns on this invention. 本発明に係るセラミック部品用保持具の実施形態における保持フレームを模式的に示す側面説明図である。It is side surface explanatory drawing which shows typically the holding frame in embodiment of the holder for ceramic components which concerns on this invention. 本発明に係るセラミック部品用保持具の実施形態における内フレームを模式的に示す平面説明図である。It is a plane explanatory view showing typically the inner frame in the embodiment of the ceramic component holder according to the present invention. 本発明に係るセラミック部品用保持具の実施形態における内フレームを模式的に示す側面説明図である。It is side surface explanatory drawing which shows typically the inner frame in embodiment of the holder for ceramic components which concerns on this invention. 本発明に係るセラミック部品用保持具の実施形態における外フレームを模式的に示す平面説明図である。It is a plane explanatory view showing typically the outer frame in the embodiment of the ceramic component holder according to the present invention. 本発明に係るセラミック部品用保持具の実施形態における外フレームを模式的に示す説明図である。It is explanatory drawing which shows typically the outer frame in embodiment of the ceramic component holder based on this invention.

以下、図面を参照して本発明の実施形態を説明すると、本実施形態におけるセラミック部品用保持具は、図１ないし図１１に示すように、積層されたセラミックキャパシタアレイ１を中空部に収容可能な保持フレーム１０と、この保持フレーム１０に支持されてセラミックキャパシタアレイ１を着脱自在に粘着保持する可撓性の粘着保持層２０とを備え、保持フレーム１０を、中空部を区画するエンドレスの内フレーム１１と、この内フレーム１１に着脱自在に嵌合するエンドレスの外フレーム１３とから形成し、これら内フレーム１１と外フレーム１３との間に粘着保持層２０を挟持させるようにしている。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. A ceramic component holder in the present embodiment can accommodate stacked ceramic capacitor arrays 1 in a hollow portion as shown in FIGS. A holding frame 10 and a flexible adhesive holding layer 20 that is supported by the holding frame 10 to detachably hold the ceramic capacitor array 1. The holding frame 10 is an endless inner portion defining a hollow portion. The frame 11 and an endless outer frame 13 that is detachably fitted to the inner frame 11 are formed, and an adhesive holding layer 20 is sandwiched between the inner frame 11 and the outer frame 13.

セラミックキャパシタアレイ１は、図１に示すように、小型のセラミックキャパシタ２がＸＹ方向に一体的に複数配列されることで形成される。このセラミックキャパシタアレイ１は、隣接するセラミックキャパシタ２とセラミックキャパシタ２との間にダイシング用の溝３が切り欠かれる。   As shown in FIG. 1, the ceramic capacitor array 1 is formed by arranging a plurality of small ceramic capacitors 2 integrally in the XY direction. In this ceramic capacitor array 1, a dicing groove 3 is notched between adjacent ceramic capacitors 2.

保持フレーム１０は、図１ないし図７に示すように、略同じ高さ（肉厚）の内フレーム１１と外フレーム１３とにより分割可能なリング形の平板に形成され、従来よりも薄い所定の厚さ、具体的には１．０〜２．８ｍｍ、好ましくは１．２〜２．６ｍｍ程度の厚さに調整される。この保持フレーム１０は、強度や剛性に優れる金属製の場合には、１．２〜１．５ｍｍ程度の厚さに調整され、樹脂製の場合には、強度や剛性、軽量化の要請を満たす観点から２．０〜２．６ｍｍの厚さとされる。   As shown in FIGS. 1 to 7, the holding frame 10 is formed as a ring-shaped flat plate that can be divided by an inner frame 11 and an outer frame 13 having substantially the same height (thickness), and is thinner than a conventional one. The thickness is adjusted to a thickness of about 1.0 to 2.8 mm, preferably about 1.2 to 2.6 mm. The holding frame 10 is adjusted to a thickness of about 1.2 to 1.5 mm when it is made of metal having excellent strength and rigidity, and satisfies the demands for strength, rigidity, and weight when made of resin. From the viewpoint, the thickness is set to 2.0 to 2.6 mm.

内フレーム１１は、図３、図８や図９等に示すように、例えばセラミックキャパシタアレイ１よりも大きいリング形の平板に形成され、丸い中空部を区画する。この内フレーム１１は、ステンレス、表面にメッキが施されて錆の発生を防止可能な材料、液晶ポリマー、ポリエーテルイミド、耐熱性を有する特殊なナイロン、熱硬化ポリエステル、エポキシ樹脂等により形成される。また、専用のテーブルや治具等を省略する観点から、１．０〜２．８ｍｍの薄さに形成され、外周面に嵌合用の凸部１２がエンドレスに突出して周設される。   As shown in FIGS. 3, 8, 9, etc., the inner frame 11 is formed, for example, in a ring-shaped flat plate larger than the ceramic capacitor array 1 and defines a round hollow portion. The inner frame 11 is made of stainless steel, a material whose surface is plated to prevent the occurrence of rust, liquid crystal polymer, polyetherimide, heat-resistant special nylon, thermosetting polyester, epoxy resin, or the like. . Further, from the viewpoint of omitting a dedicated table, jig, and the like, it is formed in a thickness of 1.0 to 2.8 mm, and a convex portion 12 for fitting protrudes endlessly on the outer peripheral surface.

外フレーム１３は、図３、図１０や図１１に示すように、例えば内フレーム１１よりも大きい略リング形の平板に形成され、内周面には嵌合用の凹部１４がエンドレスに凹んで周設されており、この凹部１４が対向する内フレーム１１の凸部１２に粘着保持層２０の周縁部を介して嵌合することにより、内フレーム１１にフラットに整合される。   As shown in FIGS. 3, 10, and 11, the outer frame 13 is formed in a substantially ring-shaped flat plate that is larger than the inner frame 11, for example, and a fitting recess 14 is recessed endlessly on the inner peripheral surface. The concave portion 14 is fitted into the convex portion 12 of the inner frame 11 facing the concave portion 14 via the peripheral edge portion of the adhesive holding layer 20, thereby being flatly aligned with the inner frame 11.

外フレーム１３は、例えばステンレス、表面にメッキが施されて錆の発生を防止可能な材料、液晶ポリマー、ポリエーテルイミド、耐熱性を有する特殊なナイロン、熱硬化ポリエステル、エポキシ樹脂等により形成される。また、専用のテーブルや治具等を省略するため、１．０〜２．８ｍｍの薄さに形成され、外周縁部の前後左右がそれぞれ周方向に直線的に切り欠かれており、セラミックキャパシタアレイ１に対する加工処理作業時の位置決めの便宜が確保される。外フレーム１３の外周縁部の表面両側は、半径外方向に向かうに従い徐々に下降するようそれぞれ僅かに傾斜形成される。   The outer frame 13 is formed of, for example, stainless steel, a material whose surface is plated to prevent the occurrence of rust, liquid crystal polymer, polyetherimide, heat-resistant special nylon, thermosetting polyester, epoxy resin, or the like. . Moreover, in order to omit a dedicated table, jig, etc., it is formed as thin as 1.0 to 2.8 mm, and the front, rear, left, and right sides of the outer peripheral edge are respectively cut out linearly in the circumferential direction. Convenient positioning is ensured during processing operations on the array 1. Both sides of the outer peripheral edge of the outer frame 13 are slightly inclined so as to gradually descend toward the outer radial direction.

粘着保持層２０は、図１ないし図３に示すように、セラミックキャパシタアレイ１よりも大きい円形の薄膜に成形され、内フレーム１１と外フレーム１３との間、具体的には内フレーム１１の凸部１２と外フレーム１３の凹部１４とに周縁部が挟持されることにより、内フレーム１１の開口下面を被覆する。この粘着保持層２０は、例えばシリコーンゴム単体やフッ素ゴム等の透明のエラストマーにより形成され、内フレーム１１の開口下面を被覆した被覆部の表面にセラミックキャパシタアレイ１を着脱自在に粘着保持する。   As shown in FIGS. 1 to 3, the adhesive holding layer 20 is formed into a circular thin film larger than the ceramic capacitor array 1, and is formed between the inner frame 11 and the outer frame 13, specifically, the convexity of the inner frame 11. The peripheral edge portion is sandwiched between the portion 12 and the concave portion 14 of the outer frame 13 to cover the opening lower surface of the inner frame 11. The adhesion holding layer 20 is formed of, for example, a transparent elastomer such as silicone rubber alone or fluoro rubber, and detachably holds the ceramic capacitor array 1 on the surface of the covering portion that covers the opening lower surface of the inner frame 11.

上記構成において、製造工程でセラミック部品用保持具にセラミックキャパシタアレイ１を保持させて取り扱う場合には、先ず、保持フレーム１０を形成する内フレーム１１と外フレーム１３とをそれぞれ用意し、内フレーム１１の凸部１２と外フレーム１３の凹部１４とを相互に密嵌してこれらの間に粘着保持層２０の周縁部を挟持させ、保持フレーム１０を組み合わせてその開口下面を粘着保持層２０で被覆する。   In the above configuration, when the ceramic capacitor array 1 is held and handled in the ceramic component holder in the manufacturing process, first, the inner frame 11 and the outer frame 13 that form the holding frame 10 are respectively prepared. The convex portion 12 and the concave portion 14 of the outer frame 13 are closely fitted to each other, the peripheral portion of the adhesive holding layer 20 is sandwiched between them, and the holding frame 10 is combined and the lower surface of the opening is covered with the adhesive holding layer 20 To do.

この際、内フレーム１１と外フレーム１３との間に粘着保持層２０の周縁部を挟持させた後に食み出た余剰部をカットして除去しても良いし、粘着保持層２０を余剰部を有しない所定の大きさの円形に予め裁断しておいても良い。また、内フレーム１１と外フレーム１３とを単に嵌合するのではなく、内フレーム１１の凸部１２と外フレーム１３の凹部１４とを相互に密嵌するので、内フレーム１１と外フレーム１３との表面高さを揃えたり、粘着保持層２０の周縁部を容易に挟むことができ、しかも、簡易な構成で内フレーム１１や外フレーム１３の脱落防止が期待できる。   At this time, the excess portion protruding after the peripheral edge portion of the adhesive holding layer 20 is sandwiched between the inner frame 11 and the outer frame 13 may be cut and removed, or the adhesive holding layer 20 may be removed. Alternatively, it may be cut in advance into a circle having a predetermined size. Further, the inner frame 11 and the outer frame 13 are not simply fitted together, but the convex portion 12 of the inner frame 11 and the concave portion 14 of the outer frame 13 are closely fitted to each other. The peripheral height of the adhesive holding layer 20 can be easily sandwiched, and the inner frame 11 and the outer frame 13 can be prevented from falling off with a simple configuration.

保持フレーム１０の開口下面を粘着保持層２０で被覆したら、粘着保持層２０の表面にセラミックキャパシタアレイ１を粘着保持させて保持フレーム１０の中空部に位置させ、その後、ダイシング工程でセラミックキャパシタアレイ１を溝３に沿ってダイシングし、個々のセラミックキャパシタ２を分割形成すれば、一連の作業を終了することができる。   When the lower surface of the holding frame 10 is covered with the adhesive holding layer 20, the ceramic capacitor array 1 is adhesively held on the surface of the adhesive holding layer 20 to be positioned in the hollow portion of the holding frame 10, and then the ceramic capacitor array 1 is subjected to a dicing process. Is diced along the groove 3 and the individual ceramic capacitors 2 are divided and formed, the series of operations can be completed.

なお、粘着保持層２０が汚れて交換を要する場合には、内フレーム１１と外フレーム１３の嵌合を解除して分離すれば良い。こうすれば、内フレーム１１、外フレーム１３、及び粘着保持層２０の関係が解消されるので、古い粘着保持層２０を取り外して新規の粘着保持層２０に迅速に交換することができる。   When the adhesive holding layer 20 is dirty and needs to be replaced, the inner frame 11 and the outer frame 13 may be released and separated. By doing so, the relationship between the inner frame 11, the outer frame 13, and the adhesive holding layer 20 is eliminated, so that the old adhesive holding layer 20 can be removed and quickly replaced with a new adhesive holding layer 20.

上記構成によれば、保持フレーム１０を従来よりも薄肉化して１．０〜２．８ｍｍの厚さとするので、保持フレーム１０の薄肉化に伴い、保持フレーム１０の厚さで作業に支障を来たすことがなく、ダイシング工程で保持フレーム１０をそのまま使用することができる。したがって、別の治具にセラミックキャパシタアレイ１を移し替える必要が全くなく、作業の複雑化や遅延を抑制防止することができる。また、保持フレーム１０の厚さを吸収する専用のテーブルや治具等を使用する必要がないので、セラミックキャパシタアレイ１に関する加工処理作業の著しい簡素化を図ることができる。   According to the above configuration, the holding frame 10 is made thinner than the conventional one to a thickness of 1.0 to 2.8 mm. Therefore, as the holding frame 10 is made thinner, the thickness of the holding frame 10 hinders work. The holding frame 10 can be used as it is in the dicing process. Therefore, there is no need to transfer the ceramic capacitor array 1 to another jig, and it is possible to suppress and prevent complication of work and delay. In addition, since it is not necessary to use a dedicated table or jig for absorbing the thickness of the holding frame 10, it is possible to significantly simplify the processing operation related to the ceramic capacitor array 1.

また、内フレーム１１と外フレーム１３との間に粘着保持層２０の周縁部を介在するので、粘着保持層２０をやや撓ませて取り付けることが可能となる。したがって、セラミックキャパシタアレイ１を緩やかに保持して破損や損傷のおそれを未然に防ぐことが可能となる。   Further, since the peripheral edge portion of the adhesive holding layer 20 is interposed between the inner frame 11 and the outer frame 13, it is possible to attach the adhesive holding layer 20 while being slightly bent. Therefore, the ceramic capacitor array 1 can be gently held to prevent the possibility of breakage or damage.

さらに、保持フレーム１０に粘着保持層２０を強固に粘着する必要がないので、セラミックキャパシタアレイ１には粘着するものの、保持フレーム１０には粘着しない自己粘着性に乏しい弱粘着性の材料で粘着保持層２０を形成することができる。よって、シリコーンゴム単体等からなる粘着保持層２０を活用することができ、材料選択幅の拡大が大いに期待できる。   Further, since it is not necessary to firmly adhere the adhesive holding layer 20 to the holding frame 10, the adhesive holding layer 20 adheres to the ceramic capacitor array 1, but does not adhere to the holding frame 10 and does not stick to the holding frame 10. Layer 20 can be formed. Therefore, it is possible to utilize the adhesive holding layer 20 made of a silicone rubber alone or the like, and the expansion of the material selection range can be greatly expected.

なお、上記実施形態のセラミックキャパシタアレイ１にハンダペーストを塗布して焼成等する場合には、内フレーム１１、外フレーム１３、及び粘着保持層２０に２００℃以上、好ましくは２５０℃以上の耐熱性をそれぞれ付与して高温の環境下でも使用可能なようにしても良い。また、保持フレーム１０の内フレーム１１の凸部１２と外フレーム１３の凹部１４とを相互に密嵌してこれらの間に粘着保持層２０の周縁部を挟持させ、保持フレーム１０の開口下面を粘着保持層２０で被覆したが、必要に応じ、保持フレーム１０の開口上面を粘着保持層２０で被覆しても良い。   In addition, when apply | coating a solder paste to the ceramic capacitor array 1 of the said embodiment, and baking it, the heat resistance of 200 degreeC or more, preferably 250 degreeC or more to the inner frame 11, the outer frame 13, and the adhesion holding layer 20 is carried out. May be used so that they can be used even in a high-temperature environment. Further, the convex portion 12 of the inner frame 11 of the holding frame 10 and the concave portion 14 of the outer frame 13 are closely fitted to each other so that the peripheral edge portion of the adhesive holding layer 20 is sandwiched between them. Although covered with the adhesive holding layer 20, the upper surface of the opening of the holding frame 10 may be covered with the adhesive holding layer 20 as necessary.

また、上記実施形態では内フレーム１１に凸部１２を、外フレーム１３に凹部１４をそれぞれ形成したが、内フレーム１１の外周面に凹部１４を、外フレーム１３の内周面に凸部１２をそれぞれ形成して着脱自在に嵌合しても良い。また、内フレーム１１の表面外周縁部を、半径外方向に向かうに従い徐々に下降するようそれぞれ僅かに傾斜形成することもできる。また、外フレーム１３の外周縁部の前後左右をそれぞれ周方向に直線的に切り欠いたが、外周縁部の前方両側に位置決め溝をそれぞれ略Ｖ字形にさらに切り欠き、この左右一対の位置決め溝を相互に異なる形に形成することもできる。   In the above embodiment, the convex portion 12 is formed on the inner frame 11 and the concave portion 14 is formed on the outer frame 13. The concave portion 14 is formed on the outer peripheral surface of the inner frame 11, and the convex portion 12 is formed on the inner peripheral surface of the outer frame 13. Each may be formed and detachably fitted. Further, the outer peripheral edge portion of the surface of the inner frame 11 can be slightly inclined so as to gradually descend toward the outer radial direction. In addition, the front, rear, left and right sides of the outer peripheral edge of the outer frame 13 are linearly cut in the circumferential direction, but positioning grooves are further cut into substantially V-shapes on both front sides of the outer peripheral edge. Can be formed in different shapes.

本発明に係るセラミック部品用保持具及びセラミック部品の取り扱い方法は、セラミック部品の製造分野で使用することができる。   The holder for ceramic parts and the method for handling ceramic parts according to the present invention can be used in the field of manufacturing ceramic parts.

１ セラミックキャパシタアレイ（セラミック部品群）
２ セラミックキャパシタ（セラミック部品）
３ 溝
１０ 保持フレーム
１１ 内フレーム
１２ 凸部
１３ 外フレーム
１４ 凹部
２０ 粘着保持層 1 Ceramic capacitor array (Ceramic parts group)
2 Ceramic capacitors (ceramic parts)
3 Groove 10 Holding frame 11 Inner frame 12 Convex part 13 Outer frame 14 Concave part 20 Adhesive holding layer

Claims (3)

セラミック部品を中空部に収容可能な保持フレームと、この保持フレームに支持されてセラミック部品を着脱自在に粘着保持する可撓性の粘着保持層とを備えたセラミック部品用保持具であって、
保持フレームを、中空部を区画するエンドレスの内フレームと、この内フレームに着脱自在に嵌合するエンドレスの外フレームとから形成するとともに、これら内フレームと外フレームとをそれぞれ１．０〜２．８ｍｍの厚さに形成してその間には粘着保持層の周縁部を挟み、外フレームの外周縁部の前後左右をそれぞれ直線的に切り欠いたことを特徴とするセラミック部品用保持具。 A ceramic component holder comprising a holding frame capable of accommodating a ceramic part in a hollow portion, and a flexible adhesive holding layer supported by the holding frame and detachably attached to the ceramic part,
The holding frame is formed of an endless inner frame that divides the hollow portion and an endless outer frame that is detachably fitted to the inner frame, and the inner frame and the outer frame are respectively 1.0 to 2. A ceramic component holder characterized by being formed to a thickness of 8 mm and sandwiching the peripheral edge of the adhesive holding layer between them and cutting the front, rear, left and right of the outer peripheral edge of the outer frame linearly. 保持フレームの内フレームと外フレームとの相対向する対向壁のいずれか一方に凹部を、他方には凸部をそれぞれ形成し、これら凹部と凸部とを粘着保持層の周縁部を介して嵌合可能とした請求項１記載のセラミック部品用保持具。   A concave portion is formed on one of the opposing walls of the holding frame facing each other and a convex portion is formed on the other, and the concave portion and the convex portion are fitted via the peripheral edge portion of the adhesive holding layer. The ceramic component holder according to claim 1, which can be combined. 請求項１又は２記載のセラミック部品用保持具にセラミック部品を保持させて取り扱うセラミック部品の取り扱い方法であって、
保持フレームの内フレームと外フレームとを嵌合してこれらの間には粘着保持層の周縁部を挟み持たせ、この粘着保持層にセラミック部品群を粘着保持させて保持フレームの中空部に位置させ、セラミック部品群をダイシングして複数のセラミック部品を分割形成することを特徴とするセラミック部品の取り扱い方法。 A method for handling ceramic parts, wherein the ceramic parts are held by the holder for ceramic parts according to claim 1 or 2 and handled.
The inner frame and the outer frame of the holding frame are fitted to each other, and the peripheral portion of the adhesive holding layer is sandwiched between them, and the ceramic component group is adhesively held by the adhesive holding layer and positioned in the hollow portion of the holding frame. A method for handling ceramic parts, comprising: dicing a ceramic part group to divide and form a plurality of ceramic parts.
JP2010262366A 2010-11-25 2010-11-25 Ceramic component holder and method of handling ceramic component Expired - Fee Related JP5456646B2 (en)

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JPH09180972A (en) * 1995-12-26 1997-07-11 Rohm Co Ltd Structure of baking jig for terminal electrode film for chip electronic component
JP2000074571A (en) * 1998-09-03 2000-03-14 Toshiba Ceramics Co Ltd Calcination jig
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