JP5551457B2 - Support medium and support frame for adhesive sheet - Google Patents

Description

  The present invention relates to a support medium for an adhesive sheet that can be used for a support frame that supports an adherend via an adhesive sheet, and a support frame including the support medium for an adhesive sheet.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a mounting apparatus that integrates a wafer (adhered body) and a ring frame (support frame) through an adhesive sheet such as a mounting sheet is known to facilitate handling of a semiconductor wafer. (For example, refer to Patent Document 1). A dicing frame (support frame) used in such a mounting apparatus is disclosed in, for example, Patent Document 2.

JP 2008-66684 A JP 2007-53162 A

  Incidentally, as in Patent Document 1, in an apparatus that mounts a wafer on a ring frame by pressing an adhesive sheet that has been previously attached to the ring frame with an application roller, for example, as shown in FIG. The wafer W with the protective sheet HS attached to the WA is supported on the table T from the protective sheet HS side, the support frame F with the adhesive sheet S attached in advance is placed on the table T, and the wafer W is attached through the opening FO. Then, the adhesive sheet S is pressed against the lower wafer back surface WB using the pressing roller R. Thereby, the adhesive sheet S is affixed to the back surface WB, and the wafer W and the support frame F are integrated via the adhesive sheet S.

  However, as shown in FIG. 5A, when there is a step between the upper surface FA of the support frame F and the wafer rear surface WB while being supported by the table T, the adhesive sheet S is pressed by the elastic pressure roller R. At this time, since the adhesive sheet S is always attached to the wafer back surface WB in a state where tension is applied, the adhesive sheet S is attached to the wafer W in a state where the stress remains. Therefore, as shown in FIG. 5B, when the wafer W is cut from the front surface WA side by the dicing apparatus D and separated into individual chips C, the portion of the adhesive sheet S where the stress remains is released. , The intervals between the separated chips C become non-uniform. For this reason, there is a possibility that the pickup device cannot accurately pick up after dicing. In particular, in recent years, with the thinning of the wafer W and the miniaturization of the chip C, in the situation where the accuracy and speed of the pickup are required, the pick-up failure due to the misalignment of the chip C becomes a problem because the manufacturing efficiency is greatly reduced. The improvement is desired.

  An object of the present invention is to provide a support medium for an adhesive sheet and a support frame that can improve manufacturing efficiency by reducing the residual stress of the adhesive sheet and supporting the adherend on the support frame.

To achieve the above object, the adhesive sheet support medium of the present invention is an adhesive sheet support medium inserted between the adhesive sheet and a frame body that supports the adherend via the adhesive sheet, An adhesive surface that is attached to the frame main body by bonding; and a bonding surface that is provided facing away from the bonding surface and to which the adhesive sheet is attached. The adhesive surface is attached to the frame main body by bonding. the when the adhesive sheet is adhered to a landing surface, the depending tension from the adhesive sheet is configured to be elastic deformation, the elastic deformation amount the adhesive sheet against the tension of the adhesive sheet It is set so that it may become larger than the amount of elongation deformation.

On the other hand, the support frame of the present invention is a support frame including a frame main body that supports an adherend via an adhesive sheet, and an adhesive sheet support medium that is interposed between the frame main body and the adhesive sheet. The adhesive sheet support medium has an adhesive surface that is attached to the frame main body by adhesion, and a surface to be adhered to which the adhesive sheet is affixed and provided facing away from the adhesive surface, together with the adhesive surface is attached to the frame body by an adhesive, wherein when the adhesive sheet is adhered to a landing surface, it is configured to be elastic deformation by the tension from the adhesive sheet, from the adhesive sheet characterized in that the elastic deformation amount against the tension is set to be greater than the elongation deformation amount of the adhesive sheet.

In this case, the support frame of the present invention, prior SL frame body, the adhesive sheet from the adhesive surface of the adhesive sheet for the support medium has a step portion of a depth equal to the distance to the application surface, this step portion It is preferable that a supporting medium is attached.

  According to the present invention as described above, since the support medium for the adhesive sheet can be elastically deformed by the tension from the adhesive sheet, there is a step between the surface to be adhered and the surface to which the adhesive sheet is adhered on the adherend. Even in such a case, the adhesive sheet support medium is elastically deformed, so that the residual stress of the adhesive sheet can be reduced and the adherend can be supported by the support frame. As a result, even when the adherend is separated after being integrated with the support frame, the portion where the stress remains in the adhesive sheet is released, so that the intervals between the separated chips become uneven. Can be minimized. Therefore, even when the adherend is a semiconductor wafer and chips are picked up in a subsequent process, pick-up failure due to positional deviation of each chip can be prevented and manufacturing efficiency can be improved.

Further, if the elastic deformation amount of the adhesive sheet support medium with respect to the tension from the adhesive sheet is set to be larger than the elongation deformation amount of the adhesive sheet, the residual stress of the adhesive sheet can be more reliably suppressed. .
Furthermore, if a step having a depth equal to the distance from the adhesive surface of the adhesive sheet support medium to the application surface is formed on the frame body, and the adhesive sheet support medium is attached to the step section, the frame main body and the adhesive sheet The surface to which the support medium is to be attached can be configured to be flush (flat). Therefore, if the thickness of the frame main body is set to the same thickness as that of the conventional frame, the support frame of the present invention can be handled as a support frame similar to the conventional one without changing the mechanism of a conventionally used apparatus or the like. And versatility is improved. Furthermore, since the surface of the support frame is flat and the support medium for the adhesive sheet does not protrude, handling when the adherend and the support frame are transported or reversed in an integrated state becomes easy. When the support frame and the adherend are supported from the adhesive sheet side in the dicing process, the pick-up process, and the like, the support medium for the adhesive sheet can be prevented from getting in the way, and the manufacturing efficiency can be further improved.

The perspective view of the state which supported the adherend with the support frame concerning one embodiment of the present invention. FIG. Operation | movement explanatory drawing of the support frame of FIG. Sectional drawing of the support frame which concerns on the modification of this invention. The figure which shows the example of a conventional malfunction.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
The support frame 1 of the present embodiment is a ring frame that supports the wafer W by being integrated with the wafer W as an adherend via an adhesive sheet S such as a mounting sheet. The adhesive sheet S is stuck to the back surface WB of the wafer W by a sheet sticking device M1 or the like indicating the part. The support frame 1 includes a frame main body 2 that can be disposed so as to surround the outer periphery of the wafer W, and a ring member 3 as an adhesive sheet support medium attached to the frame main body 2 and to which an adhesive sheet S is attached. Has been.

  The frame body 2 is formed of metal, resin, or the like, has an opening 21 inside, and is formed in an annular shape, and has a circular shape in plan view perpendicular to the surface 22 on the surface 22 side located on the upper side in FIG. An overall annular step portion 23 formed of a side surface 26 and a bottom surface 25 continuous from the lower end portion in FIG. 2 of the side surface 26 in FIG. 2 to the opening 21 is formed. A notch 24 is formed for positioning the support frame 1 when it is transported and placed on various devices. Note that a surface facing away from the front surface 22 is a back surface 27.

  The ring member 3 includes a ring member main body 3A formed of a suitable elastic material such as rubber, urethane, sponge, etc., in a ring shape and a rectangular cross section, and an adhesive layered on the lower surface of the ring member main body 3A in FIG. Layer 3B. Note that the lower surface of the adhesive layer 3B in FIG. 2 serves as an adhesive surface 31 and is bonded to the bottom surface 25 of the frame main body 2, and the ring member main body 3A provided facing the adhesive surface 31 in FIG. The upper surface is a surface 32 to which the adhesive sheet S is attached. The ring member 3 has an inner peripheral surface 33 that is positioned flush with the upper edge of the opening 21 of the frame body 2 and an outer peripheral surface 34 that faces the inner side of the side surface 26 with a predetermined gap. And is configured. And the thickness dimension (distance) from the adhesion surface 31 to the to-be-bonded surface 32 in the ring member 3 is equal to the dimension of the side surface 26 of the step part 23, ie, the to-be-bonded surface 32 in the state to which the ring member 3 was adhere | attached. And the surface 22 of the frame body 2 are formed flush with each other. In the present embodiment, the frame body 2 has a thickness T1 of 1.5 mm, the ring member 3 has a thickness T2 of 0.8 mm, the ring member 3 has an outer diameter D1 of 372 mm, and the ring member 3 has an inner diameter D2 of However, these dimensions can be appropriately changed in consideration of the thickness and diameter of the support frame to be used, the diameter of the adhesive sheet S, and the like.

Next, a procedure for mounting the wafer W on the support frame 1 using the sheet sticking apparatus M1 and a procedure for dicing the wafer W using the dicing apparatus M2 will be described with reference to FIG.
First, the adhesive sheet S is affixed to the adherend surface 32 of the ring member 3 in the support frame 1, and as shown in FIG. 3A, the wafer W having the protective sheet HS affixed to the surface WA is protected. It mounts on the table T1 of the sheet sticking apparatus M1 from the HS side. Then, the support frame 1 is placed on a predetermined position of the table T1 from the back surface 27 side of the frame body 2 so as to surround the wafer W by the opening 21, and the wafer W and the support frame 1 are sucked and held by the suction means of the table T1 (not shown). . Next, the adhesive sheet S is pushed down by the elastically deformable pressing roller R of the sheet sticking apparatus M1, and the adhesive sheet S is pressed and stuck to the back surface WB of the wafer W. At this time, the adherend surface 32 is pulled inward by the tension of the adhesive sheet S pushed downward, whereby the ring member 3 is elastically deformed and absorbs the tension of the adhesive sheet S. At this time, since the elastic deformation amount of the ring member 3 with respect to the tension from the adhesive sheet S is set to be larger than the elongation deformation amount of the adhesive sheet S, the radial extension of the adhesive sheet S is suppressed, The residual stress of the adhesive sheet S can be reduced and the wafer W can be supported on the support frame 1.

  When the wafer W is mounted on the support frame 1 via the adhesive sheet S as described above, the support frame 1 is supported by a transport unit (not shown) and is unloaded from the sheet sticking apparatus M1. Then, as shown in FIG. 3B, the wafer W is supported by the support frame 1 in a state where the elastic restoring force of the ring member 3 and the tension of the adhesive sheet S straddling the wafer W and the ring member 3 are balanced. The Rukoto. Next, the protective sheet HS is peeled from the wafer W surface WA by a peeling means (not shown), and the support frame 1 is inverted so that the adhesive sheet S is positioned downward, and then the support frame 1 and the wafer W are conveyed to the dicing apparatus M2. And adsorbed and held (see FIG. 3C).

  Next, the wafer W is cut into a plurality of chips C by cutting means CT from the surface WA side. At the time of this cutting, almost no stress remains in the adhesive sheet S, so that the movement of each chip C can be suppressed and the distance between the chips C can be made uniform. Thereafter, the support frame 1 and the wafer W (divided chips C) are transferred to a pickup process and a die bonding process, which are subsequent processes, by a transfer means (not shown). It will be bonded to.

According to this embodiment as described above, the following effects are obtained.
That is, when the adhesive sheet S is adhered to the back surface WB of the wafer W by the sheet affixing device M1, the ring member 3 is elastically deformed to absorb the tension of the adhesive sheet S, whereby the residual stress of the adhesive sheet S can be reduced. The movement of the chip C when the wafer W is cut in the dicing process can be minimized. Therefore, when picking up the separated chips C, it is possible to prevent the pick-up failure accompanying the positional deviation of each chip C and improve the manufacturing efficiency.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, in the above-described embodiment, the case where the adherend is the semiconductor wafer W is shown, but the adherend is not limited to the wafer W, and other plates such as a glass plate, a steel plate, or a resin plate are used. A member other than a plate-like member or the like can also be targeted. Examples of the semiconductor wafer include a silicon wafer and a compound wafer. And the adhesive sheet stuck to such a to-be-adhered body is not restricted to a mounting sheet, and an adhesive sheet having an arbitrary use and shape such as a protective sheet, other arbitrary sheets, films, tapes, and the like can be applied. That is, when various adhesive sheets are applied to the adherend, such as when the adherend such as a plate-like member is extremely thin or brittle, if the residual stress occurs in the adhesive sheet, the adherend The adherend may be deformed or damaged due to the stress applied to the substrate, but the stress on the adherend is suppressed by reducing the residual stress of the adhesive sheet using the support frame of the present invention. be able to.

  Moreover, in the said embodiment, although the structure which adhere | attaches the ring member 3 on the step part 23 formed in the frame main body 2 was employ | adopted as a frame main body not only having the step part 23 but shown in FIG. In addition, a frame body 2A using a general support frame can be used. That is, in FIG. 4, the frame main body 2A has a flat surface 22 and a back surface 27, respectively, and is formed in an annular shape, and the ring member 3 is bonded to the surface 22 via the adhesive layer 3B. ing. According to such a configuration, a special frame main body can be obtained by using a support frame generally used conventionally as the frame main body 2A and attaching the ring member 3 which is a support medium for the adhesive sheet to the frame main body 2A. Thus, the support frame 1 can be configured at low cost, and the residual stress of the adhesive sheet S can be reduced and the manufacturing efficiency can be improved as described above.

  Furthermore, in the above-described embodiment, the ring member 3 that is continuous in an annular shape is used as the support medium for the adhesive sheet. However, the support medium for the adhesive sheet is not limited to an annular continuous medium, and is divided into a plurality of parts in the circumferential direction. It may be configured. Furthermore, the support medium for the adhesive sheet is not limited to a single elastic material formed in a rectangular cross section, and may be configured by laminating a plurality of materials. It is preferable to use a low-elasticity material that does not easily deform as a material constituting the surface to be bonded and a support medium for the adhesive sheet by laminating a high-elasticity material that easily elastically deforms between them.

DESCRIPTION OF SYMBOLS 1 Support frame 2 Frame main body 3 Ring member (support medium for adhesive sheets)
3B Adhesive layer 23 Step 31 Adhesive surface 32 Surface to be bonded S Adhesive sheet W Wafer (Substrate)

Claims (3)

A support medium for an adhesive sheet inserted between the frame main body and the adhesive sheet that supports the adherend through the adhesive sheet,
An adhesive surface attached to the frame body by adhesion;
Provided with a surface to be adhered to the adhesive surface and to which the adhesive sheet is affixed,
Together with the adhesive surface is attached to said frame body by an adhesive, wherein when the adhesive sheet is adhered to a landing surface, is configured to be elastic deformation by the tension from the adhesive sheet from the adhesive sheet adhesive sheet for supporting medium elastic deformation amount against the tension, characterized in that it is set to be greater than the elongation deformation amount of the adhesive sheet. A frame body that supports the adherend through an adhesive sheet;
A support frame comprising an adhesive sheet support medium interposed between the frame body and the adhesive sheet,
The adhesive sheet support medium has an adhesive surface that is attached to the frame main body by adhesion, and a surface to be adhered to which the adhesive sheet is affixed so as to face the adhesive surface, and the adhesive surface is together attached to the frame body by an adhesive, wherein when the adhesive sheet is adhered to a landing surface, it is configured to be elastic deformation by the tension from the adhesive sheet, against the tension from the adhesive sheet a support frame that elastic deformation amount is characterized in that it is set to be greater than the elongation deformation amount of the adhesive sheet.   The frame main body has a step portion having a depth equal to the distance from the bonding surface of the adhesive sheet support medium to the surface to be pasted, and the adhesive sheet support medium is attached to the step portion. The support frame according to claim 2.

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