JP2008309499A5 - - Google Patents
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- Publication number
- JP2008309499A5 JP2008309499A5 JP2007154796A JP2007154796A JP2008309499A5 JP 2008309499 A5 JP2008309499 A5 JP 2008309499A5 JP 2007154796 A JP2007154796 A JP 2007154796A JP 2007154796 A JP2007154796 A JP 2007154796A JP 2008309499 A5 JP2008309499 A5 JP 2008309499A5
- Authority
- JP
- Japan
- Prior art keywords
- peripheral surface
- electronic component
- guide hole
- guide pin
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 35
- 238000007689 inspection Methods 0.000 claims 12
- 238000012423 maintenance Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 239000000615 nonconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007154796A JP4826810B2 (ja) | 2007-06-12 | 2007-06-12 | 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007154796A JP4826810B2 (ja) | 2007-06-12 | 2007-06-12 | 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011200356A Division JP5152379B2 (ja) | 2011-09-14 | 2011-09-14 | 位置決め装置のメンテナンス方法及びicハンドラの位置決め装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008309499A JP2008309499A (ja) | 2008-12-25 |
| JP2008309499A5 true JP2008309499A5 (https=) | 2010-07-08 |
| JP4826810B2 JP4826810B2 (ja) | 2011-11-30 |
Family
ID=40237249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007154796A Expired - Fee Related JP4826810B2 (ja) | 2007-06-12 | 2007-06-12 | 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4826810B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117139198A (zh) * | 2023-10-17 | 2023-12-01 | 沛顿科技(深圳)有限公司 | 一种多类型产品并行作业智能芯片分拣机 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52141258A (en) * | 1976-05-20 | 1977-11-25 | Stanley Electric Co Ltd | Device for measuring residual thickness of brake pad |
| JPH11262820A (ja) * | 1998-03-16 | 1999-09-28 | Sodick Co Ltd | ワイヤ放電加工機 |
| JP2000221235A (ja) * | 1999-02-01 | 2000-08-11 | Nec Eng Ltd | 半導体検査装置 |
| JP3823848B2 (ja) * | 2002-02-28 | 2006-09-20 | セイコーエプソン株式会社 | Ic吸着ハンドおよびicテストハンドラ |
-
2007
- 2007-06-12 JP JP2007154796A patent/JP4826810B2/ja not_active Expired - Fee Related
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