JP2008309499A5 - - Google Patents

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Publication number
JP2008309499A5
JP2008309499A5 JP2007154796A JP2007154796A JP2008309499A5 JP 2008309499 A5 JP2008309499 A5 JP 2008309499A5 JP 2007154796 A JP2007154796 A JP 2007154796A JP 2007154796 A JP2007154796 A JP 2007154796A JP 2008309499 A5 JP2008309499 A5 JP 2008309499A5
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JP
Japan
Prior art keywords
peripheral surface
electronic component
guide hole
guide pin
guide
Prior art date
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Application number
JP2007154796A
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English (en)
Japanese (ja)
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JP4826810B2 (ja
JP2008309499A (ja
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Application filed filed Critical
Priority to JP2007154796A priority Critical patent/JP4826810B2/ja
Priority claimed from JP2007154796A external-priority patent/JP4826810B2/ja
Publication of JP2008309499A publication Critical patent/JP2008309499A/ja
Publication of JP2008309499A5 publication Critical patent/JP2008309499A5/ja
Application granted granted Critical
Publication of JP4826810B2 publication Critical patent/JP4826810B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007154796A 2007-06-12 2007-06-12 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ Expired - Fee Related JP4826810B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007154796A JP4826810B2 (ja) 2007-06-12 2007-06-12 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007154796A JP4826810B2 (ja) 2007-06-12 2007-06-12 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011200356A Division JP5152379B2 (ja) 2011-09-14 2011-09-14 位置決め装置のメンテナンス方法及びicハンドラの位置決め装置

Publications (3)

Publication Number Publication Date
JP2008309499A JP2008309499A (ja) 2008-12-25
JP2008309499A5 true JP2008309499A5 (https=) 2010-07-08
JP4826810B2 JP4826810B2 (ja) 2011-11-30

Family

ID=40237249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007154796A Expired - Fee Related JP4826810B2 (ja) 2007-06-12 2007-06-12 位置決め装置のメンテナンス方法、位置決め装置及びicハンドラ

Country Status (1)

Country Link
JP (1) JP4826810B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117139198A (zh) * 2023-10-17 2023-12-01 沛顿科技(深圳)有限公司 一种多类型产品并行作业智能芯片分拣机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52141258A (en) * 1976-05-20 1977-11-25 Stanley Electric Co Ltd Device for measuring residual thickness of brake pad
JPH11262820A (ja) * 1998-03-16 1999-09-28 Sodick Co Ltd ワイヤ放電加工機
JP2000221235A (ja) * 1999-02-01 2000-08-11 Nec Eng Ltd 半導体検査装置
JP3823848B2 (ja) * 2002-02-28 2006-09-20 セイコーエプソン株式会社 Ic吸着ハンドおよびicテストハンドラ

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