JP2008308572A5 - - Google Patents
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- Publication number
- JP2008308572A5 JP2008308572A5 JP2007157107A JP2007157107A JP2008308572A5 JP 2008308572 A5 JP2008308572 A5 JP 2008308572A5 JP 2007157107 A JP2007157107 A JP 2007157107A JP 2007157107 A JP2007157107 A JP 2007157107A JP 2008308572 A5 JP2008308572 A5 JP 2008308572A5
- Authority
- JP
- Japan
- Prior art keywords
- general formula
- repeating unit
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007157107A JP5115045B2 (ja) | 2007-06-14 | 2007-06-14 | ポリイミドワニス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007157107A JP5115045B2 (ja) | 2007-06-14 | 2007-06-14 | ポリイミドワニス |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008308572A JP2008308572A (ja) | 2008-12-25 |
JP2008308572A5 true JP2008308572A5 (ko) | 2010-07-29 |
JP5115045B2 JP5115045B2 (ja) | 2013-01-09 |
Family
ID=40236465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007157107A Expired - Fee Related JP5115045B2 (ja) | 2007-06-14 | 2007-06-14 | ポリイミドワニス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5115045B2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10809619B2 (en) * | 2013-06-26 | 2020-10-20 | Nissan Chemical Industries, Ltd. | Resist underlayer film-forming composition containing substituted crosslinkable compound |
CN107429058B (zh) * | 2015-04-24 | 2020-08-07 | 东丽株式会社 | 树脂组合物、使用其的半导体元件的制造方法及半导体器件 |
JP7097803B2 (ja) * | 2018-12-20 | 2022-07-08 | 信越ポリマー株式会社 | 導電性高分子含有液及びその製造方法、並びに導電性フィルム及びその製造方法 |
CN115826360B (zh) * | 2022-12-23 | 2023-09-12 | 江苏艾森半导体材料股份有限公司 | 感光性聚酰亚胺组合物、图形的制造方法、固化物和电子部件 |
CN115947648A (zh) * | 2022-12-28 | 2023-04-11 | 北京彤程创展科技有限公司 | 一种交联剂及其制备方法、光刻胶 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003252991A (ja) * | 2002-02-28 | 2003-09-10 | Dow Corning Toray Silicone Co Ltd | アクリルもしくはメタクリル官能性シリコーン変性ポリイミド樹脂、その製造方法および感光性樹脂組成物 |
JP4374840B2 (ja) * | 2002-08-30 | 2009-12-02 | 東レ株式会社 | ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置 |
JP4834949B2 (ja) * | 2003-07-24 | 2011-12-14 | 東レ株式会社 | 熱硬化性樹脂組成物およびそれを用いた電子部品 |
JP4677887B2 (ja) * | 2004-11-24 | 2011-04-27 | 東レ株式会社 | 感光性樹脂組成物 |
JP4826415B2 (ja) * | 2005-10-12 | 2011-11-30 | 東レ株式会社 | 感光性樹脂組成物 |
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2007
- 2007-06-14 JP JP2007157107A patent/JP5115045B2/ja not_active Expired - Fee Related