JP2008304460A - 非金属閉鎖容器を持つディジタルx線検出器のemi遮蔽 - Google Patents
非金属閉鎖容器を持つディジタルx線検出器のemi遮蔽 Download PDFInfo
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- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/10—Safety means specially adapted therefor
- A61B6/102—Protection against mechanical damage, e.g. anti-collision devices
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- A—HUMAN NECESSITIES
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Abstract
【解決手段】EMIシールド(50)は、第1の非導電性材料(52)内に一体に形成された第1の複数の導電性要素(54)を持つ第1の材料を含み、且つ一般に非導電性の外面(52)を含む。方法は、EMI遮蔽閉鎖容器(70)を設ける段階を含み、該閉鎖容器は、第1の非導電性材料(72)内に配置された第1の複数の導電性要素(78)を持つ第1の材料と、第2の非導電性材料(74)内に配置された第2の複数の導電性要素(81)を持つ第2の材料とを含み、第1の複数の導電性要素が第2の複数の導電性要素に係合して導電路(80)を形成する。別の方法は、EMI遮蔽閉鎖容器(100)を設ける段階を含み、該閉鎖容器は、非導電性表面(101)を持つ第1の材料と、該第1の材料の非導電性表面上に配置された第2のEMI遮蔽材料(102)とを含む。
【選択図】図4C
Description
12 放射線源
14 水平アーム
16 対象
17 ベッド
18 支持柱
20 X線ユニット基台
22 円錐形放射線ビーム
24 可搬型X線検出器
26 リンク
30 保護ハウジング
40 サブシステム
42 撮像パネル
44 電子装置支持構造体
46 関連電子装置
47 追加の内部支持体
50 ハウジング
52 非導電性外面
54 導電性コア
56 座金
58 座金
59 反対側
60 継ぎ目
62 導電性テープ
70 ハウジング
72 複合材料
74 配合プラスチック
76 非導電性母材
78 導電性材料
80 結合部
81 導電性添加材
82 結合部
84 歯付き金属ファスナー
85 歯部
86 座金
90 ハウジング
92 複合材料
94 配合プラスチック
95 導電性添加材
96 非導電性母材
98 繊維コア
100 非金属ハウジング
101 非導電性表面
102 導電性の第2の層
Claims (10)
- 1つ以上の撮像用部品を電磁干渉から遮蔽するように構成されている電磁干渉(EMI)シールド(50)を有する撮像システム(10)であって、
前記EMIシールドが、第1の非導電性材料(52)内に一体に形成された第1の複数の導電性要素(54)を持つ第1の材料(52)を有し、前記第1の材料が第1の一般に非導電性の外面(52)を持っていること、を特徴とする撮像システム(10)。 - 前記EMIシールド(50)は少なくとも実質的にパネル形状の可搬型ハウジング(50)を画成している、請求項1記載の撮像システム(10)。
- 撮像用部品(42)が前記EMIシールド(50)によって遮蔽されている、請求項1記載の撮像システム(10)。
- 前記撮像用部品(42)はX線部品を有している、請求項3記載の撮像システム(10)。
- 第1の複数の導電性要素(54)は繊維、粒子、又はそれらの組合せを有する、請求項1記載の撮像システム(10)。
- 前記第1の材料(52)は、複合材料、配合プラスチック、又はそれらの組合せを有する、請求項1記載の撮像システム(10)。
- 撮像システム(10)において電磁干渉を遮蔽するための方法であって、
電磁干渉(EMI)を遮蔽する閉鎖容器(70)を設ける段階を含み、該閉鎖容器(70)が、第1の非導電性材料(72)内に配置された本質的に第1の複数の導電性要素(78)で構成されている第1の材料(72)と、第2の非導電性材料(74)内に配置された本質的に第2の複数の導電性要素(81)で構成されている第2の材料(74)とを有し、前記第1の複数の導電性要素(78)が前記第2の複数の導電性要素(81)に係合して導電路(80)を形成していること、を特徴とする方法。 - 導電性インターフェース構造(84)を前記第1の材料(72)の中まで延在させること、又は前記第2の材料(74)の中まで延在させること、又はそれらを組合せることによって、前記第1の材料(72)を前記第2の材料(74)と導電結合する段階を含んでいる、請求項7記載の方法。
- 撮像システム(10)であって、
画像検出回路(42)と、
前記画像検出回路(42)の周りに配置され且つ少なくとも実質的に第1及び第2の電磁干渉(EMI)遮蔽材料で作られた可搬型閉鎖容器(90)と、を有し、
前記第1のEMI遮蔽材料(92)が第1の非導電性材料(96)内に配置された第1の複数の導電性要素(98)を有し、また前記第2のEMI遮蔽材料(94)が第2の非導電性材料(94)内に配置された第2の複数の導電性要素(95)を有し、更に、前記第1及び第2の複数の導電性要素が、前記第1及び第2のEMI遮蔽材料の非導電性表面を通り抜ける導電路(100)を介して導電結合されていること、を特徴とする撮像システム(10)。 - 撮像システム(10)において電磁干渉を遮蔽するための方法であって、
電磁干渉(EMI)を遮蔽する閉鎖容器(100)を設ける段階を含み、該閉鎖容器(100)が、非導電性表面(101)を持つ第1の材料を有し、該第1の材料の前記非導電性表面(101)上に第2のEMI遮蔽材料(102)が配置されていること、を特徴とする方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/759,829 | 2007-06-07 | ||
US11/759,829 US7687790B2 (en) | 2007-06-07 | 2007-06-07 | EMI shielding of digital x-ray detectors with non-metallic enclosures |
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JP2008304460A true JP2008304460A (ja) | 2008-12-18 |
JP5580971B2 JP5580971B2 (ja) | 2014-08-27 |
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JP2008147518A Expired - Fee Related JP5580971B2 (ja) | 2007-06-07 | 2008-06-05 | 電磁干渉シールドを有する撮像システムおよび撮像システムにおいて電磁干渉を遮蔽する方法 |
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US (1) | US7687790B2 (ja) |
JP (1) | JP5580971B2 (ja) |
FR (1) | FR2916953B1 (ja) |
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Also Published As
Publication number | Publication date |
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US7687790B2 (en) | 2010-03-30 |
FR2916953B1 (fr) | 2013-01-04 |
US20080304246A1 (en) | 2008-12-11 |
FR2916953A1 (fr) | 2008-12-12 |
JP5580971B2 (ja) | 2014-08-27 |
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