JP2008294467A - 光ポンピングされる垂直放出半導体レーザ - Google Patents
光ポンピングされる垂直放出半導体レーザ Download PDFInfo
- Publication number
- JP2008294467A JP2008294467A JP2008199652A JP2008199652A JP2008294467A JP 2008294467 A JP2008294467 A JP 2008294467A JP 2008199652 A JP2008199652 A JP 2008199652A JP 2008199652 A JP2008199652 A JP 2008199652A JP 2008294467 A JP2008294467 A JP 2008294467A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- heat sink
- active layer
- vertical
- layer sequence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02461—Structure or details of the laser chip to manipulate the heat flow, e.g. passive layers in the chip with a low heat conductivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
- H01S5/02484—Sapphire or diamond heat spreaders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/041—Optical pumping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4056—Edge-emitting structures emitting light in more than one direction
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】レーザ共振器内部に及び活性層列と熱的に接続して、放出されるビームに対して透過的な、ヒートシンクが設けられており、該ヒートシンクは活性層列の材料よりも高い熱伝導率を有する材料から形成されており、ヒートシンクが活性層列のリフレクタ層の側の反対側に配置されているか又はヒートシンクが活性層列とリフレクタ層との間に設けられ、かつ更に別のヒートシンクが活性層列のリフレクタ層の側の反対側に配置されていることを特徴とする、光ポンピングされる垂直放出半導体レーザ
【選択図】図2
Description
論文 M.Kuznetsov et al. , "Design and Characteristics of High-Power(>0.5 W CW) Diode-Pumped Vertical-External-Cavity Surface-Emitting Semiconductor Lasers with Circular TEM00 Beams", IEEE J. Selected Topics Quantum Electron., vol.5, no. 3, pp561-573, 1999
R={1−(n1/n2)m}/{1+(n1/n2)m}
によって与えられる。
Claims (14)
- 光ポンピングされる垂直放出半導体レーザであって、高反射性リフレクタ層(10)および該リフレクタ層上に配置されたビーム放出活性層列(14)を有し、動作中に前記高反射性リフレクタ層(10)が外部ミラー(20)と共にレーザ共振器を形成する、光ポンピングされる垂直放出半導体レーザにおいて、
レーザ共振器(10、20)内部に及び前記活性層列(14)と熱的に接続して、放出されるビームに対して透過的な、ヒートシンク(12)が設けられており、該ヒートシンク(12)は前記活性層列(14)の材料よりも高い熱伝導率を有する材料から形成されており、
ヒートシンク(12)が活性層列(14)のリフレクタ層(10)の側の反対側に配置されているか、又は
ヒートシンク(12)が活性層列(14)とリフレクタ層(10)との間に設けられ、かつ更に別のヒートシンク(12’、12")が活性層列(14)のリフレクタ層(10)の側の反対側に配置されていることを特徴とする、光ポンピングされる垂直放出半導体レーザ。 - ヒートシンク(12)は良好な熱伝導性の、赤色及び/又は近赤外線で透過する材料から形成されている、請求項1記載の垂直放出半導体レーザ。
- 前記材料はSiC、BN又はダイヤモンドである、請求項2記載の垂直放出半導体レーザ。
- ヒートシンク(12)は活性ゾーンの直径の少なくとも0.2倍の厚さの層によって形成されている、請求項1〜3のうちの1項記載の垂直放出半導体レーザ。
- ヒートシンク(12)は活性層列(14)と直接的に接触している、請求項4記載の垂直放出半導体レーザ。
- ヒートシンク(12)と活性層列(14)との間に部分反射型ブラッグ反射器(16)が配置されている、請求項1記載の垂直放出半導体レーザ。
- リフレクタ層(10)は分布型ブラッグ反射器(42、44)によって形成されている、請求項1記載の垂直放出半導体レーザ。
- リフレクタ層(10)は金属層によって形成されている、請求項6記載の垂直放出半導体レーザ。
- 光ポンピングされる垂直放出半導体レーザであって、ビーム放出性活性層列(34)及び2つの外部ミラー(36、38)を有し、該2つの外部ミラー(36、38)は垂直共振器を形成する、光ポンピングされる垂直放出半導体レーザにおいて、
垂直共振器(36、38)内部に及び前記活性層列(34)と熱的に接続して、放出されるビームに対して透過的な2つのヒートシンク(32、32’)が設けられており、該ヒートシンク(32、32’)は前記活性層列(34)の材料よりも高い熱伝導率を有する材料から形成されており、
前記ビーム放出性活性層列(34)は前記2つのヒートシンク(32、32’)の間に配置されていることを特徴とする、光ポンピングされる垂直放出半導体レーザ。 - ビーム放出活性層列(14;34)は、GaAs又はInPに基づく半導体材料、とりわけInGaAs、AlGaAs、InGaAlAs、InGaP、InGaAsP、InGaAlP、InAlP又はこれらの材料のうちの1つ又は複数から成る層の列から成る、請求項1〜9のうちの1項記載の垂直放出半導体レーザ。
- 1つのポンプ源(150)又は多数のポンプ源は、光ポンピングされる垂直放出半導体レーザ(140)の横に設けられており、これと共に共通の基板(100)上にモノリシックに集積されている、請求項1〜6及び9及び10のうちの1項記載の光ポンピングされる垂直放出半導体レーザ。
- 1つのポンプ源(150)又は多数のポンプ源は少なくとも1つのエッジ放出レーザ構造を有する、請求項11記載の垂直放出半導体レーザ。
- 前記ヒートシンク(12、32、32’)は、3〜50μmの間の厚さを有する層によって形成されている、請求項1から12までのいずれか1項記載の垂直放出半導体レーザ。
- 前記ヒートシンク(12、32、32’)は、5〜50μmの間の厚さを有する層によって形成されている、請求項1から13までのいずれか1項記載の垂直放出半導体レーザ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10147888A DE10147888A1 (de) | 2001-09-28 | 2001-09-28 | Optisch gepumpter vertikal emittierender Halbleiterlaser |
DE10147888.7 | 2001-09-28 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003533404A Division JP4511833B2 (ja) | 2001-09-28 | 2002-09-26 | 光ポンピングされる垂直放出半導体レーザ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008294467A true JP2008294467A (ja) | 2008-12-04 |
JP5108671B2 JP5108671B2 (ja) | 2012-12-26 |
Family
ID=7700638
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003533404A Expired - Fee Related JP4511833B2 (ja) | 2001-09-28 | 2002-09-26 | 光ポンピングされる垂直放出半導体レーザ |
JP2008199652A Expired - Fee Related JP5108671B2 (ja) | 2001-09-28 | 2008-08-01 | 光ポンピングされる垂直放出半導体レーザ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003533404A Expired - Fee Related JP4511833B2 (ja) | 2001-09-28 | 2002-09-26 | 光ポンピングされる垂直放出半導体レーザ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7083099B2 (ja) |
EP (1) | EP1430575B1 (ja) |
JP (2) | JP4511833B2 (ja) |
DE (2) | DE10147888A1 (ja) |
WO (1) | WO2003030316A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10541514B2 (en) | 2016-02-25 | 2020-01-21 | Ngk Insulators, Ltd. | Surface-emitting device, vertical external-cavity surface-emitting laser, and method for manufacturing surface-emitting device |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10147888A1 (de) * | 2001-09-28 | 2003-04-24 | Osram Opto Semiconductors Gmbh | Optisch gepumpter vertikal emittierender Halbleiterlaser |
DE10243545B4 (de) * | 2002-09-19 | 2008-05-21 | Osram Opto Semiconductors Gmbh | Optisch gepumpte Halbleiterlaservorrichtung |
GB2399942A (en) * | 2003-03-24 | 2004-09-29 | Univ Strathclyde | Vertical cavity semiconductor optical devices |
DE10339980B4 (de) * | 2003-08-29 | 2011-01-05 | Osram Opto Semiconductors Gmbh | Halbleiterlaser mit reduzierter Verlustwärme |
GB0328007D0 (en) * | 2003-12-04 | 2004-01-07 | Univ Strathclyde | Improved vertical external cavity surface emitting laser |
DE102004024156B4 (de) * | 2004-03-31 | 2011-01-13 | Osram Opto Semiconductors Gmbh | Kantenemittierender Diodenlaser |
DE102004040077A1 (de) * | 2004-05-28 | 2005-12-22 | Osram Opto Semiconductors Gmbh | Oberflächenemittierendes Halbleiterlaserbauelement mit einer vertikalen Emissionsrichtung |
US7372886B2 (en) * | 2004-06-07 | 2008-05-13 | Avago Technologies Fiber Ip Pte Ltd | High thermal conductivity vertical cavity surface emitting laser (VCSEL) |
JP2008513984A (ja) | 2004-09-22 | 2008-05-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 表面発光型半導体レーザ装置、および表面発光型半導体レーザ装置の製造方法 |
KR100718128B1 (ko) * | 2005-06-02 | 2007-05-14 | 삼성전자주식회사 | 단일한 히트싱크 위에 펌프 레이저와 함께 결합된 면발광레이저 |
KR100738527B1 (ko) * | 2005-07-13 | 2007-07-11 | 삼성전자주식회사 | 광펌핑 반도체 레이저 |
DE102005056949B4 (de) * | 2005-09-30 | 2013-08-22 | Osram Opto Semiconductors Gmbh | Optisch gepumpter oberflächenemittierender Halbleiterlaser und optische Projektionsvorrichtung mit solch einem Halbleiterlaser |
DE102005058237A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Oberflächenemittierendes Halbleiterlaser-Bauelement und optische Projektionsvorrichtung mit solch einem oberflächenemittierenden Halbleiterlaser-Bauelement |
KR20070052059A (ko) * | 2005-11-16 | 2007-05-21 | 삼성전자주식회사 | 펌프 빔의 재활용이 가능한 외부 공진기형 면발광 레이저 |
KR101100431B1 (ko) * | 2005-11-22 | 2011-12-30 | 삼성전자주식회사 | 고효율 2차 조화파 생성 외부 공진기형 면발광 레이저 |
KR20070076251A (ko) * | 2006-01-18 | 2007-07-24 | 삼성전자주식회사 | 외부 공진기형 면발광 레이저 |
DE102006002879B4 (de) * | 2006-01-20 | 2008-11-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbleiteranordnung für einen optisch gepumpten oberflächenemittierenden Halbleiterlaser |
DE102006024220A1 (de) * | 2006-04-13 | 2007-10-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
DE102008008595A1 (de) * | 2007-12-21 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Oberflächenemittierender Halbleiterlaser und Verfahren zu dessen Herstellung |
US8611383B2 (en) | 2011-04-25 | 2013-12-17 | Coherent, Inc. | Optically-pumped surface-emitting semiconductor laser with heat-spreading compound mirror-structure |
GB2514605B (en) | 2013-05-30 | 2016-09-14 | Solus Tech Ltd | Method and apparatus for mounting a semiconductor disk laser (SDL) |
EP3416251A1 (en) * | 2017-06-12 | 2018-12-19 | Universität Stuttgart | Radiation field amplifying system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5651023A (en) * | 1995-05-13 | 1997-07-22 | Uniphase Lasers Limited | Monolithic laser |
JPH10233558A (ja) * | 1997-02-19 | 1998-09-02 | Canon Inc | ダイヤモンド層を含む多層膜構造、それを有する光デバイス、およびその作製方法 |
WO2000025398A1 (en) * | 1998-10-26 | 2000-05-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor lasers |
WO2001059895A1 (en) * | 2000-02-11 | 2001-08-16 | Gigatera Ag | Passively mode-locked optically pumped semiconductor external-cavity surface-emitting laser |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US90016A (en) * | 1869-05-11 | Improved boot-chimp | ||
US5422901A (en) * | 1993-11-15 | 1995-06-06 | Motorola, Inc. | Semiconductor device with high heat conductivity |
US5596595A (en) | 1995-06-08 | 1997-01-21 | Hewlett-Packard Company | Current and heat spreading transparent layers for surface-emitting lasers |
US6101201A (en) * | 1996-10-21 | 2000-08-08 | Melles Griot, Inc. | Solid state laser with longitudinal cooling |
US5914973A (en) | 1997-02-10 | 1999-06-22 | Motorola, Inc. | Vertical cavity surface emitting laser for high power operation and method of fabrication |
JP3559680B2 (ja) * | 1997-04-25 | 2004-09-02 | キヤノン株式会社 | リング共振器型面発光半導体レーザ及びその製造法 |
US6285702B1 (en) * | 1999-03-05 | 2001-09-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor laser |
JP2001111160A (ja) * | 1999-04-19 | 2001-04-20 | Canon Inc | 半導体素子の製造方法及び半導体素子、リング共振器型半導体レーザ、ジャイロ |
AU2001286620A1 (en) | 2000-08-22 | 2002-03-04 | The Regents Of The University Of California | Aigaassb/inp distributed bragg reflector |
US20020105984A1 (en) * | 2000-12-15 | 2002-08-08 | The Furukawa Electric Co., Ltd. | Integrated laser beam synthesizing module for use in a semiconductor laser module and an optical amplifier |
DE10107349A1 (de) * | 2001-02-15 | 2002-08-29 | Markus-Christian Amann | Oberflächenemittierender Halbleiterlaser |
DE10147888A1 (de) * | 2001-09-28 | 2003-04-24 | Osram Opto Semiconductors Gmbh | Optisch gepumpter vertikal emittierender Halbleiterlaser |
US6836357B2 (en) * | 2001-10-04 | 2004-12-28 | Gazillion Bits, Inc. | Semiconductor optical amplifier using laser cavity energy to amplify signal and method of fabrication thereof |
-
2001
- 2001-09-28 DE DE10147888A patent/DE10147888A1/de not_active Withdrawn
-
2002
- 2002-09-26 US US10/491,201 patent/US7083099B2/en not_active Expired - Lifetime
- 2002-09-26 DE DE50214029T patent/DE50214029D1/de not_active Expired - Lifetime
- 2002-09-26 EP EP02776735A patent/EP1430575B1/de not_active Expired - Fee Related
- 2002-09-26 JP JP2003533404A patent/JP4511833B2/ja not_active Expired - Fee Related
- 2002-09-26 WO PCT/DE2002/003651 patent/WO2003030316A2/de active Application Filing
-
2008
- 2008-08-01 JP JP2008199652A patent/JP5108671B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5651023A (en) * | 1995-05-13 | 1997-07-22 | Uniphase Lasers Limited | Monolithic laser |
JPH10233558A (ja) * | 1997-02-19 | 1998-09-02 | Canon Inc | ダイヤモンド層を含む多層膜構造、それを有する光デバイス、およびその作製方法 |
WO2000025398A1 (en) * | 1998-10-26 | 2000-05-04 | Coherent, Inc. | High-power external-cavity optically-pumped semiconductor lasers |
WO2001059895A1 (en) * | 2000-02-11 | 2001-08-16 | Gigatera Ag | Passively mode-locked optically pumped semiconductor external-cavity surface-emitting laser |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10541514B2 (en) | 2016-02-25 | 2020-01-21 | Ngk Insulators, Ltd. | Surface-emitting device, vertical external-cavity surface-emitting laser, and method for manufacturing surface-emitting device |
Also Published As
Publication number | Publication date |
---|---|
DE10147888A1 (de) | 2003-04-24 |
JP5108671B2 (ja) | 2012-12-26 |
EP1430575A2 (de) | 2004-06-23 |
EP1430575B1 (de) | 2009-11-25 |
US20050036528A1 (en) | 2005-02-17 |
US7083099B2 (en) | 2006-08-01 |
WO2003030316A2 (de) | 2003-04-10 |
WO2003030316A3 (de) | 2004-02-05 |
JP2005505143A (ja) | 2005-02-17 |
JP4511833B2 (ja) | 2010-07-28 |
DE50214029D1 (de) | 2010-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5108671B2 (ja) | 光ポンピングされる垂直放出半導体レーザ | |
US7991034B2 (en) | Electrically-pumped semiconductor zigzag extended cavity surface emitting lasers and superluminescent LEDs | |
JP4352337B2 (ja) | 半導体レーザおよび半導体レーザ装置 | |
US8023547B2 (en) | Vertical extended cavity surface emission laser and method for manufacturing a light emitting component of the same | |
EP0571533B1 (en) | External cavity semiconductor laser system | |
US20050259700A1 (en) | Optically pumpable surface-emitting semiconductor laser device | |
US6594297B1 (en) | Laser apparatus in which surface-emitting semiconductor is excited with semiconduct laser element and high-order oscillation modes are suppressed | |
WO2018168430A1 (ja) | 半導体レーザ装置、半導体レーザモジュール及び溶接用レーザ光源システム | |
US20010012307A1 (en) | Laser apparatus including surface-emitting semiconductor excited with semiconductor laser element, and directly modulated | |
US6782019B2 (en) | VCSEL with heat-spreading layer | |
US6822988B1 (en) | Laser apparatus in which GaN-based compound surface-emitting semiconductor element is excited with GaN-based compound semiconductor laser element | |
JP2003086895A (ja) | 垂直共振器型半導体発光素子 | |
US7286584B2 (en) | Carrier bonded 1550 nm VCSEL with InP substrate removal | |
JP4246942B2 (ja) | 波長変換用光学サブアセンブリ | |
KR101100424B1 (ko) | 펌프 레이저가 일체로 결합된 수직 외부 공진기형 면발광레이저 | |
JP2001148536A (ja) | 半導体レーザ装置 | |
US20070147458A1 (en) | Cavity and packaging designs for arrays of vertical cavity surface emitting lasers with or without extended cavities | |
JP2001291924A (ja) | 半導体レーザ装置 | |
WO2007100341A2 (en) | Grazing incidence slab semiconductor laser system and method | |
Gerster | Semiconductor Disk Laser on Microchannel Cooler | |
Diehl et al. | High power semiconductor disk laser with monolithically integrated pump lasers | |
JP2002009382A (ja) | 半導体レーザ素子 | |
Waarts | Diode-Pumped Micro-Laser Arrays | |
Sebastian et al. | 808 nm TM-polarized GaAsP/AlGaAs high-power Al-free-active region laser diodes with high efficiency and small divergence |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101227 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101228 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111201 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120228 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120302 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120427 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120507 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120529 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120907 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121005 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5108671 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151012 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |