JP2008294248A - 基板搬送システム - Google Patents

基板搬送システム Download PDF

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Publication number
JP2008294248A
JP2008294248A JP2007138564A JP2007138564A JP2008294248A JP 2008294248 A JP2008294248 A JP 2008294248A JP 2007138564 A JP2007138564 A JP 2007138564A JP 2007138564 A JP2007138564 A JP 2007138564A JP 2008294248 A JP2008294248 A JP 2008294248A
Authority
JP
Japan
Prior art keywords
substrate
side wall
processing apparatus
atmosphere
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007138564A
Other languages
English (en)
Japanese (ja)
Inventor
Teruo Asakawa
輝雄 浅川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2007138564A priority Critical patent/JP2008294248A/ja
Priority to PCT/JP2008/059538 priority patent/WO2008146738A1/fr
Publication of JP2008294248A publication Critical patent/JP2008294248A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2007138564A 2007-05-25 2007-05-25 基板搬送システム Pending JP2008294248A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007138564A JP2008294248A (ja) 2007-05-25 2007-05-25 基板搬送システム
PCT/JP2008/059538 WO2008146738A1 (fr) 2007-05-25 2008-05-23 Système de transfert de substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007138564A JP2008294248A (ja) 2007-05-25 2007-05-25 基板搬送システム

Publications (1)

Publication Number Publication Date
JP2008294248A true JP2008294248A (ja) 2008-12-04

Family

ID=40074988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007138564A Pending JP2008294248A (ja) 2007-05-25 2007-05-25 基板搬送システム

Country Status (2)

Country Link
JP (1) JP2008294248A (fr)
WO (1) WO2008146738A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050464A1 (fr) * 2012-09-27 2014-04-03 株式会社日立国際電気 Dispositif ainsi que procédé de traitement de substrat, et procédé de fabrication de dispositif à semi-conducteurs

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5370785B2 (ja) * 2011-07-08 2013-12-18 Ｔｄｋ株式会社 ロードポート装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116876A (ja) * 1996-07-12 1998-05-06 Fusion Syst Corp 制御された環境の間で物品を転送するシステム
JP2001102426A (ja) * 1999-10-01 2001-04-13 Hirata Corp 物品容器開閉・転送装置および物品容器開閉・転送方法
JP2002329661A (ja) * 2001-04-27 2002-11-15 Yoshitake Ito 基板処理装置及び基板処理方法及び基板の製造方法
JP2004273603A (ja) * 2003-03-06 2004-09-30 Tdk Corp シール部材およびシール構造
JP2006352010A (ja) * 2005-06-20 2006-12-28 Nissin Ion Equipment Co Ltd 真空処理装置およびその運転方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080236487A1 (en) * 2004-09-15 2008-10-02 Hitachi Kokusai Electric Inc., Semiconductor Manufacturing Apparatus And Semiconductor Device Manufacturing Method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10116876A (ja) * 1996-07-12 1998-05-06 Fusion Syst Corp 制御された環境の間で物品を転送するシステム
JP2001102426A (ja) * 1999-10-01 2001-04-13 Hirata Corp 物品容器開閉・転送装置および物品容器開閉・転送方法
JP2002329661A (ja) * 2001-04-27 2002-11-15 Yoshitake Ito 基板処理装置及び基板処理方法及び基板の製造方法
JP2004273603A (ja) * 2003-03-06 2004-09-30 Tdk Corp シール部材およびシール構造
JP2006352010A (ja) * 2005-06-20 2006-12-28 Nissin Ion Equipment Co Ltd 真空処理装置およびその運転方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014050464A1 (fr) * 2012-09-27 2014-04-03 株式会社日立国際電気 Dispositif ainsi que procédé de traitement de substrat, et procédé de fabrication de dispositif à semi-conducteurs
US9548229B2 (en) 2012-09-27 2017-01-17 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
WO2008146738A1 (fr) 2008-12-04

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