JP2008283336A - 弾性表面波デバイス、及びその製造方法 - Google Patents
弾性表面波デバイス、及びその製造方法 Download PDFInfo
- Publication number
- JP2008283336A JP2008283336A JP2007124194A JP2007124194A JP2008283336A JP 2008283336 A JP2008283336 A JP 2008283336A JP 2007124194 A JP2007124194 A JP 2007124194A JP 2007124194 A JP2007124194 A JP 2007124194A JP 2008283336 A JP2008283336 A JP 2008283336A
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- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- piezoelectric substrate
- groove
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000000758 substrate Substances 0.000 claims abstract description 67
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 238000012935 Averaging Methods 0.000 claims description 2
- 230000001902 propagating effect Effects 0.000 abstract 1
- 239000011295 pitch Substances 0.000 description 38
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000013016 damping Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000010606 normalization Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007124194A JP2008283336A (ja) | 2007-05-09 | 2007-05-09 | 弾性表面波デバイス、及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007124194A JP2008283336A (ja) | 2007-05-09 | 2007-05-09 | 弾性表面波デバイス、及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008283336A true JP2008283336A (ja) | 2008-11-20 |
| JP2008283336A5 JP2008283336A5 (https=) | 2010-06-03 |
Family
ID=40143800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007124194A Withdrawn JP2008283336A (ja) | 2007-05-09 | 2007-05-09 | 弾性表面波デバイス、及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008283336A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161899A (ja) * | 2019-03-25 | 2020-10-01 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
| CN117097295A (zh) * | 2023-10-17 | 2023-11-21 | 深圳新声半导体有限公司 | 声表面波谐振器装置及其制造方法、滤波器 |
-
2007
- 2007-05-09 JP JP2007124194A patent/JP2008283336A/ja not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161899A (ja) * | 2019-03-25 | 2020-10-01 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
| JP7566455B2 (ja) | 2019-03-25 | 2024-10-15 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
| CN117097295A (zh) * | 2023-10-17 | 2023-11-21 | 深圳新声半导体有限公司 | 声表面波谐振器装置及其制造方法、滤波器 |
| CN117097295B (zh) * | 2023-10-17 | 2024-02-06 | 深圳新声半导体有限公司 | 声表面波谐振器装置及其制造方法、滤波器 |
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