JP2008282892A - Substrate supporting device, mounting method of backup pin in the same device, actual mounting apparatus, and backup plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate supporting device for easily mounting a backup pin to the accurate position, a mounting method of backup pin in the same device, an actual mounting apparatus, and a backup plate. <P>SOLUTION: The substrate supporting device 7 is provided with a supporting device body and a backup plate 75 to load and unload the backup pin 71 for supporting the substrate W. The backup plate 75 is constituted with a transparent material and is unloadably loaded to the supporting device body 73. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate support device having a backup plate to which a backup pin for supporting a substrate can be mounted, a method for attaching a backup pin in the device, a mounting machine, and a backup plate.

  In a conventional mounting machine, it is known that an electronic component is mounted in a state where a substrate is supported by a plurality of backup pins (Patent Document 1, etc.).

  In such a mounting machine, the backup pin is detachably mounted on the backup plate provided on the base, but the mounting position of the backup pin depends on the size and shape of the board and the back side of the board (support It is necessary to change according to the state of the surface.

For example, when mounting on the back side of the board on which the component is mounted, the back-up pin supports the mounted electronic component on the back side of the board and the part that avoids the solder protruding from this electronic component. Pins need to be attached to the backup plate.
Japanese Patent No. 2919486

  However, with conventional mounting machines, it is difficult to accurately grasp the positional relationship between the backup plate and the back of the board before attaching the backup pin, so it is easy to identify the appropriate mounting position of the backup pin. Therefore, there is a problem that the mounting work of the backup pin is difficult.

  The present invention has been made in view of the above problems, and provides a substrate support device that can easily attach a backup pin to an appropriate position, a method for attaching a backup pin in the device, a mounting machine, and a backup plate. Objective.

  The present invention provides the following means.

[1] A substrate support device comprising a support device main body, and a backup plate provided on the support device main body and capable of mounting a backup pin for supporting the substrate,
A substrate support device, wherein the backup plate is made of a transparent body and is detachable from the support device body.

  [2] The substrate support apparatus according to [1], wherein pin transfer means for picking up a backup pin arranged in the pin installation portion and automatically mounting it at a predetermined position of the backup plate is provided.

[3] A substrate support device comprising a support device main body and a backup plate provided on the support device main body and capable of mounting a backup pin for supporting the substrate,
The backup plate is composed of a transparent body,
An apparatus for supporting a substrate, comprising: an imaging unit capable of recognizing a backup pin mounting surface side through a backup plate on a side opposite to the backup pin mounting surface side of the back plate.

[4] A mounting machine in which a backup pin is detachably provided on a backup plate provided on a base, and a component is mounted on a substrate supported by the backup pin,
A mounting machine characterized in that the backup plate is constituted by a transparent body and is detachable from the base.

[5] A backup plate to which a backup pin for supporting a substrate can be attached,
A backup plate characterized by comprising a transparent body.

[6] A method of attaching a backup pin in a substrate support apparatus provided with a backup plate to which a backup pin for supporting a substrate can be attached and detached.
Prepare an independent transparent backup plate for the substrate support device,
The board was placed on a transparent backup plate, the support surface of the board was visible through the backup plate, the backup pin mounting position relative to the backup plate was specified, and the backup pin was attached to the specified position. A method for attaching a backup pin in a substrate supporting apparatus.

  According to the substrate support device of the above invention [1], the positional relationship between the backup plate and the substrate can be actually confirmed by superimposing the removed backup plate on the substrate. The position can be accurately identified, and the backup pin can be easily attached to the appropriate position.

  According to the substrate support apparatus of the above invention [2], the mounting operation of the backup pin to the backup plate can be automatically performed.

  According to the substrate support apparatus according to the invention [3], an image in a state indicating the positional relationship between the backup plate and the substrate placed thereon can be acquired. Can be easily attached to the proper position.

  According to the mounting machine according to the invention [4], the backup pin can be easily attached to the backup plate at an appropriate position as described above.

  According to the backup plate according to the invention [5], the backup pin can be easily attached to an appropriate position as described above.

  According to the mounting method of the backup pin in the substrate support apparatus according to the invention [6], the backup pin can be easily mounted at an appropriate position with respect to the backup plate, as described above.

<First Embodiment>
FIG. 1 is a plan view showing an example of a mounting machine M1 according to the first embodiment of the present invention, and FIG. 2 is a front view of the mounting machine M1. As shown in both figures, the mounting machine M1 is provided on the base 11 and is provided above the conveyor 20, the conveyor 20 that conveys the substrate W, the component supply units 30 that are provided on both sides of the conveyor 20, and the conveyor 20. The head unit 40 is provided.

  The component supply unit 30 is provided on the front side and the rear side with respect to the conveyor 20. In this embodiment, the component supply unit 30 is configured so that a plurality of tape feeders 31... On each reel of the tape feeder 31, a tape in which electronic components such as an IC, a transistor, and a capacitor are stored at predetermined intervals is wound and set, and the electronic components are picked up by sequentially feeding the tape. These are sequentially supplied to (supply position). In the present invention, a tray feeder configured to supply components from a component supply container such as a pallet can also be used as the component supply means of the component supply unit 30.

  The head unit 40 can move in a region extending between the component supply unit 30 and the mounting position on the printed circuit board W so that the component supplied from the component supply unit 30 can be picked up and mounted on the printed circuit board W. It has become. Specifically, the head unit 40 is supported by a head unit support member 42 extending in the X-axis direction (the substrate transport direction of the conveyor 20) so as to be movable in the X-axis direction. The head unit support member 42 is supported at both ends thereof by guide rails 43 and 43 extending in the Y-axis direction (a direction orthogonal to the X-axis in a horizontal plane) so as to be movable in the Y-axis direction. The head unit 40 is driven in the X axis direction by the X axis motor 44 via the ball screw 45, and the head unit support member 42 is driven in the Y axis direction by the Y axis motor 46 via the ball screw 47. To be done.

  In the head unit 40, a plurality of mounting heads 41 for mounting components are arranged side by side in the X-axis direction.

  Each head 41 is driven in the vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis motor as a drive source, and in the rotation direction (R-axis direction) by a rotation drive mechanism using an R-axis motor as a drive source. It is designed to be driven.

  Each head 41 is provided with a suction nozzle 411 for sucking and sucking the electronic component A and mounting it on the substrate W.

  The head unit 40 is provided with a substrate imaging camera 13 facing downward. The substrate imaging camera 13 is constituted by a CCD camera or the like, and the substrate imaging camera 13 can recognize the substrate and the like.

  A component imaging camera 12 is provided between the conveyor 20 and the rear-side component supply unit 30 in an upward direction. The component imaging camera 12 is configured by a line sensor camera or the like, and the component imaging camera 12 can recognize a component sucked by the head 41 of the head unit 40.

  The base 11 of the mounting machine M1 is provided with a substrate support device 7 for positioning the substrate W at a predetermined mounting position in a state in which bending is prevented by supporting the substrate W from the lower surface side (back surface side). It has been.

  The substrate support device 7 includes a backup plate 75 on which the backup pin 71 can be mounted in an upright state, and an elevating mechanism 73 that drives the backup plate 75 up and down and is configured as a support device body. The substrate W can be supported from the lower surface side by the backup pins 71.

  In the present embodiment, the backup plate 75 is made of a transparent body that transmits visible light. Therefore, the backup plate 75 can visually recognize the front side from the back side, that is, can visually recognize the front side from the back side.

  In the present invention, the transparent body is not only a translucent material, but also the backup plate 75 itself is opaque. Those that transmit visible light through the pores are also included.

  As shown in FIG. 4, the backup plate 75 is provided with a plurality of pin mounting holes 76 penetrating in the vertical direction (between the front and back) in a matrix at predetermined intervals in the XY axis direction. The backup pin 71 can be planted at an arbitrary position on the backup plate 75 by selectively attaching the backup pin 71 to 76.

  The backup plate 75 is fixed to a lifting mechanism 73 as a support device main body by a plurality of bolts 77, and is configured such that the backup plate 75 is lifted and lowered by driving the lifting mechanism 73.

  Further, the backup plate 75 can be removed from the lifting mechanism 73 by removing the bolts 77, whereby the backup plate 75 can be separated from other equipment such as the mounting machine M1 and handled independently. ing.

  FIG. 3 is a block diagram showing a control system of the mounting machine M1. As shown in the figure, the mounting machine M1 of this embodiment includes a control device (controller) 6 composed of a personal computer or the like, and the control device 6 controls various operations of the mounting machine M1.

  The control device 6 includes an arithmetic processing unit 60, a mounting program storage unit 63, a conveyance system data storage unit 64, a motor control unit 65, an external input / output unit 66 and an image processing unit 67.

  The arithmetic processing unit 60 comprehensively manages various operations of the mounting machine M1.

  The mounting program storage unit 63 stores a mounting program (production program) for mounting each electronic component on the substrate W. This production program includes data relating to the mounting position (coordinates) and orientation of each electronic component based on the circuit pattern of the substrate W, the position (coordinates) of the feeder 31 to which each electronic component is supplied, and the like.

  The transfer system data storage means 64 stores various data related to the transfer of the substrate W on the production line.

  Further, the motor control unit 65 controls the operation of the head 41 and the drive motors of the XYZR axes of the suction nozzle.

  The external input / output unit 66 inputs / outputs various information to / from various sensors provided in the mounting machine M1, a stopper for positioning and stopping the substrate on the conveyor 20, the lifting mechanism 73 of the substrate support mechanism 7, and the like. .

  The image processing unit 67 processes image data captured by the component photographing camera 12 and the board photographing camera 13.

  The control device 6 is connected to an input unit 61 such as a keyboard and a mouse for inputting various information. Furthermore, a display unit 62 such as a CRT display or a liquid crystal display for displaying various information is connected to the control device 6.

  In the mounting machine M1 of the present embodiment, the driving is controlled by the control device 6 and the mounting operation is automatically performed.

  In the mounting operation, the substrate W is first carried by the conveyor 20 to a predetermined position (predetermined mounting position) on the substrate support device 7. Thereafter, the backup plate 75 rises, the substrate W is supported by the plurality of backup pins 71 inserted into the backup plate 75, and the substrate by a substrate clamp member (not shown) that rises integrally with the backup plate 75 is supported. Both ends of W in the Y-axis direction are fixed and held at positions above the conveyor 20. In this state, the parts are mounted. That is, the head unit 40 moves to the component supply unit 30, the components supplied from the component supply unit 30 are picked up by the mounting head 41, and then the head unit 40 moves to the substrate position and is picked up by the head 41. The component is mounted at a predetermined position on the board. Further, in the same manner, predetermined components are mounted on the substrate by the head unit 40. After all of the parts thus planned are mounted on the substrate, the backup plate 75 is lowered, and the fixed holding of both ends in the Y-axis direction of the substrate W by the substrate clamp member (not shown) is released. Is transferred to the conveyor 20. Thereafter, the substrate W is unloaded from the mounting position by the conveyor 20.

  Next, in a model in which mounting is performed on both sides of the board, operation when attaching the backup pin 71 corresponding to the mounted surface at the start of mounting production on the other side of the board that has been mounted on one side Will be described.

  First, the bolt 77 fixing the backup plate 75 to the lifting mechanism 73 is removed, and the backup plate 75 is removed from the lifting mechanism 73 (the base 11 of the mounting machine M1). In addition, when the backup pin 71 is inserted in the backup plate 75, the backup pin 71 is removed.

  Next, as shown in FIG. 6, the substrate W that has already been mounted on one surface is turned upside down on a suitable work table.

  Subsequently, as shown in FIGS. 5 to 7, the backup plate 75 is turned over and placed on the substrate W placed upside down. At this time, the reference position of the substrate W and the reference position of the backup plate 75 are matched to position the substrate W with respect to the backup plate 75. That is, both members W and 75 are arranged so that the substrate W and the backup plate 75 are in a positional relationship in the rear view state when mounted.

  Here, since the backup plate 75 is transparent, the state of the back side of the substrate W can be visually observed through the backup plate 75. In other words, the operator has an area that is hindered when supported by the backup pin 71 on the back surface of the board (non-supportable area Wx), for example, an area where obstacles such as mounted electronic parts and solder that protrudes outside the electronic parts exist. And other regions, that is, regions that can be supported by the backup pin 71 (supportable region Wo) can be accurately identified.

  Therefore, the operator has a required number of pin insertion holes 76 suitable for supporting by the backup pins 71 from among the pin insertion holes 76 of the back-up plate 75 arranged corresponding to the supportable region Wo on the back surface of the substrate. Select and mark to indicate the pin mounting position. For example, a marker pen or the like is used, or a marking tape is attached. 5 to 7, the selected pin mounting hole 76 is hatched for easy understanding of the invention.

  Next, the operator sets the backup plate 75 with the pin attachment position mark on the board support device 7 of the mounting machine M1. Needless to say, the backup plate 75 is set in a normal state with its surface (pin mounting surface) side facing upward.

  And after fixing the backup plate 75 to the board | substrate support apparatus 7 with the volt | bolt 77, the backup pin 71 is inserted in the pin insertion hole 76 with the pin attachment position mark.

  Thereby, the mounting operation of the backup pin 71 is completed. Thereafter, the mounting process (mounting operation) as described above is performed on the other surface that is not mounted.

  As described above, according to the mounting machine M1 of the first embodiment, since the backup plate 75 is formed of a transparent body, the operator attaches the backup plate 75 to the back surface of the substrate before attaching the backup pins 71. By superimposing in a face-down manner and seeing the back surface of the substrate through the backup plate 75, the positional relationship between the supportable area Wo on the back surface of the substrate and the pin insertion hole 76 of the backup plate 75 is easily and accurately grasped. be able to. Therefore, the operator selects an appropriate pin insertion hole 76 from the pin insertion holes 76 located in the supportable region Wo, and inserts the backup pin 71 into the hole 76. The pins 71 are necessarily arranged in the supportable region Wo on the back surface of the substrate. For this reason, for example, the problem that the backup pin 71 is disposed in the unsupportable region Wx on the back surface of the substrate can be reliably prevented, and the backup pin 71 can be accurately disposed in the supportable region Wo as shown in FIG. The backup pin 71 can be easily and smoothly attached to the appropriate position of the backup plate 75, and workability can be improved.

  In the first embodiment, the pin insertion hole 76 is specified by using the backup plate 75 removed from the substrate support device 7. However, the present invention is not limited to this, and in the present invention, the substrate support device 7 is used. Alternatively, a backup plate corresponding to the backup plate 75 to be attached may be prepared separately, and the pin insertion hole may be specified using the backup plate in the same manner as described above. The pin specifying backup plate does not necessarily function in the same manner as the real backup plate 75, and may be a so-called dummy backup plate.

Second Embodiment
9 and 10 are views showing a mounting machine M2 according to the second embodiment of the present invention. As shown in both figures, in the mounting machine M2 of the second embodiment, a pin gripping chuck 81 is provided on one end surface of the head unit 40. The chuck 81 includes a pair of arms 82 and 82 that are opened and closed by driving means such as a cylinder (not shown), and the arm 82 is in a state where the backup pin 71 is disposed between the pair of arms 82 and 82 that are open. , 82 is closed, the backup pin 71 is gripped (clamped) by the pair of arms 82, 83, and when the pair of arms 82, 82 is opened from the gripped state, the backup pin 71 is released. It has come to be.

  Further, as shown in FIG. 9, a pin station 72 in which backup pins 71 are stored is disposed between the conveyor 20 and the front-side component supply unit 30. The pin station 72 is provided with a plurality of pin installation holes (not shown) into which the backup pins 71 can be inserted and arranged, and spare backup pins are inserted and arranged in the pin installation holes as necessary. .

  In this embodiment, the backup pin 71 of the pin station 72 is transferred to the backup plate 75 attached to the substrate support device 7, or conversely, the backup pin 71 of the backup plate 75 is transferred to the pin station 72. In the backup plate 75, the backup pin 71 can be transferred to another position.

  For example, when the backup pin 71 of the pin station 72 is transferred to the backup plate 75, the head unit 40 is moved to the pin station 72 (pin installation portion), and the backup pin 71 arranged in the pin station 72 is pinned. It is gripped by the gripping chuck 81. Further, the head unit 40 that has gripped the backup pin 71 is lifted to remove the backup pin 71 from the pin station 72 and then moved to a predetermined position of the backup plate 75. Then, the head unit 40 is lowered, and the backup pin 71 held by the head unit 40 is inserted into a predetermined pin insertion hole 76 of the backup plate 75. Thereafter, the chuck 71 is opened and the gripping to the backup pin 71 is released. Thereby, the backup pin 71 can be transferred from the pin station 72 to the backup plate 75.

  Conversely, when the backup pin 71 of the backup plate 75 is transferred to the pin station 72, the head unit 40 is moved to the backup plate 75, the backup pin 71 is gripped by the chuck 81, and then the head unit 40 is moved. The pin is moved to the pin station 72 to release the grip on the backup pin 71. As a result, the backup pin 71 can be transferred from the backup plate 75 to the pin station 72.

  When transferring the backup pin 71 in the backup plate 75, the head unit 40 is moved to the position of the backup pin 71 to be transferred (pin installation portion), and the backup pin 71 is gripped by the chuck 81. After holding, the head unit 40 is moved to the position of the transfer destination in the backup plate 75 to release the grip to the backup pin 71. As a result, the backup pin 71 can be transferred within the backup plate 75.

  In the second embodiment, the pin transfer means is configured by the chuck 81, the head unit 40, and the means for moving the head unit 40 in the XYZ axial directions.

  On the other hand, as shown in FIGS. 10 and 12, in the mounting machine M <b> 2 of this embodiment, a substrate back surface recognition camera 79 configured by an area sensor camera such as a CCD is provided below the backup plate 75 in the substrate support device 7. It is provided upwards.

  Also in the second embodiment, as in the first embodiment, the backup plate 75 is made of a transparent body, and the substrate W on the substrate W placed on the backup plate 75 by the substrate back surface recognition camera 79. The state on the back side can be recognized through the backup plate 75.

  Note that the substrate back surface recognition camera 79 as the image pickup means is not limited to an area sensor camera, and may be a line sensor camera. In the case of a line sensor camera, the camera 79 may be scanned while moving the camera 79 horizontally along the back surface of the substrate by moving means such as a servo moving device.

  FIG. 11 is a block diagram showing a control system in the mounting machine of the second embodiment. As shown in the figure, the mounting machine M2 of the second embodiment is provided with a control device 6 for controlling various operations.

  The control device 6 is provided with a pin attachment operation execution unit 68. The pin attachment operation execution unit 68 includes a program for performing an operation for inserting the backup pin 71 into the backup plate 75 in a desired arrangement. As described later, various information is stored in accordance with this program. By being processed by the arithmetic processing unit 70, the backup pin 71 is attached to the backup plate 75.

  The external input / output unit 66 inputs / outputs various information to / from a cylinder that opens and closes the pair of arms 82 and 82 in the pin gripping chuck 81.

  Further, the image processing unit 67 processes the image data captured by the substrate back surface recognition camera 79.

  In the second embodiment, the other configurations are the same as those in the first embodiment, and therefore, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

  In the mounting machine M2 having the above configuration, an operation when attaching the backup pin 71 in correspondence with the new substrate W will be described.

  First, as shown in FIG. 13, the backup pin 71 on the backup plate 75 is removed and the substrate is disposed on the pin station 72 so that the mounted surface faces the backup plate 75 on the backup plate 75. W is placed (step S1). At this time, similarly to the first embodiment, the substrate W is positioned with respect to the backup plate 75 so as to correspond to the positional relationship in the back-viewed state of mounting.

  When the substrate W is placed on the backup plate 75, as shown in FIG. 12, the substrate back surface recognition camera 79 captures and recognizes the back surface of the substrate through the backup plate 75 (step S2 in FIG. 13). ).

  Next, a supportable region Wo that can be supported by the backup pin 71 is specified from the recognized substrate back surface image data (step S3). As a method for automatically specifying the supportable region, for example, due to a difference in reflectance, the mounted electronic component, and the unsupportable region Wx in which an obstacle such as solder protruding outside the electronic component is formed, For example, a method of identifying the substrate back surface area (supportable area Wo) free from an obstacle can be employed.

  Next, an appropriate pin insertion hole 76 is selected / determined from the pin insertion holes 76 of the backup plate 75 disposed so as to overlap the supportable region Wo (step S4). As a method for automatically selecting the pin insertion holes 76, for example, the number of pin insertion holes 76 (the number of pins 71) is determined in advance from the substrate size, shape, etc., and the back surface of the substrate according to the number. For example, a method of selecting pin insertion holes 76 that are distributed without being biased can be employed. The position of the pin insertion hole 76 selected in this way is held in the control device 6 as plane coordinate data for the backup plate 75.

  Then, after removing the substrate W from the backup plate 75 (step S5), the backup pin 71 is automatically inserted into the required position of the backup plate 75 (step S6). That is, after the head unit 40 moves to the position of the pin station 72 and grips the backup pin 71, it moves to the coordinate position of the pin insertion hole 76 selected as described above, and the pin insertion at that position is inserted. A backup pin 71 is inserted into the hole 76.

  In this way, when the backup pins 71 are inserted into all the pin insertion holes 76 selected as the pin attachment positions, the pin attachment operation is completed.

  As described above, according to the mounting machine M2 of the second embodiment, the insertion position of the backup pin 71 is automatically specified, and the backup pin 71 is automatically inserted at that position. Can be reduced.

  Moreover, the substrate W and the backup plate 75 are actually overlapped to specify the supportable region Wo, and an appropriate pin insertion hole 76 in the region is selected and specified. The backup pin 71 inserted into the insertion hole 76 can be surely prevented from a malfunction such that it comes into contact with a region where the pin support is hindered on the back surface of the substrate (non-supportable region Wx). The substrate W can be disposed in the supportable region Wo, and the substrate W can be more reliably supported in a stable state, and the mounting process can be performed more accurately and smoothly.

  In the second embodiment, the unsupportable area on the back surface of the substrate and the pin insertion hole are automatically selected. However, the present invention is not limited to this. In the present invention, these processes are performed by the operator. May be performed manually. For example, the image data of the back side of the substrate is displayed on a display screen as the display unit 61 of the control device (computer 6), and the operator specifies an unsupportable region by referring to the display image, or an appropriate pin insertion hole. Should be selected and specified.

  In the present invention, the pin insertion hole is automatically selected and specified as in the second embodiment, and the operator manually inserts the backup pin 71 into the specified pin insertion hole. You may do it.

  Conversely, the pin insertion hole is manually selected and specified by the operator as in the first embodiment, and the backup pin is automatically inserted into the specified pin insertion hole as in the second embodiment. 71 may be inserted.

  Moreover, in the said embodiment, although the backup plate in which the pin insertion hole for inserting a backup pin was formed is used, it is not restricted to it, In this invention, a backup pin is attached detachably by magnetic adsorption | suction You may make it use the backup plate made like this.

  Further, in the above embodiment, in a model in which mounting is performed on both sides of the substrate, the backup pin 71 is made to correspond to the mounted surface at the start of mounting production of the other surface with respect to the substrate that has been mounted on one surface. However, there are projections, obstacles, etc. on the support surface by the backup pins 71 of the substrate W mounted only on one side or the substrate W mounted on one side first even on the substrate W mounted on both sides. It can also be used in some cases. Also in this case, the mounting position of the backup pin 71 can be specified by superimposing a support surface having a convex portion or an obstacle on the transparent backup plate 75, and the operator can specify the mounting position manually or automatically by a pin transfer device. Thus, the backup pin 71 can be attached to the backup plate 75.

  In the above embodiment, the present invention has been described by taking the case where the present invention is applied to a mounting machine as an example. However, the present invention is not limited thereto, and the present invention is not limited to a printing machine, a dispenser, or a substrate that applies a paste to a substrate. The present invention can also be applied to an inspection machine that inspects the surface state in the same manner as in the above embodiment.

It is a top view which shows the mounting machine concerning 1st Embodiment of this invention. It is a front view which shows the principal part of the mounting machine of 1st Embodiment. It is a block diagram which shows the control system of the mounting machine of 1st Embodiment. It is a top view which shows the backup plate in the mounting machine of 1st Embodiment. It is a perspective view which shows typically the state which piled up the backup plate on the board | substrate in 1st Embodiment. FIG. 6 is an exploded perspective view of FIG. 5. FIG. 6 is a plan view of FIG. 5. It is a perspective view which shows typically the support part periphery of a substrate in the mounting machine of a 1st embodiment. It is a top view which shows the mounting machine concerning 2nd Embodiment of this invention. It is a front view which shows the principal part of the mounting machine of 2nd Embodiment. It is a block diagram which shows the control system of the mounting machine of 2nd Embodiment. It is a perspective view which shows typically the support part periphery of a substrate in the mounting machine of a 2nd embodiment. It is a flowchart for demonstrating the attachment operation | movement of the backup pin in the mounting machine of 2nd Embodiment.

Explanation of symbols

7 Substrate Support Device 11 Base 71 Backup Pin 73 Elevating Mechanism (Support Device Body)
75 Backup plate 79 Substrate back surface recognition camera (imaging means)
M1, M2 mounting machine W substrate

Claims (6)

A substrate support device comprising a support device main body, and a backup plate provided in the support device main body and capable of mounting a backup pin for supporting the substrate,
A substrate support device, wherein the backup plate is made of a transparent body and is detachable from the support device body.   2. The substrate support apparatus according to claim 1, further comprising a pin transfer means for picking up a backup pin arranged in the pin installation portion and automatically mounting the backup pin at a predetermined position of the backup plate. A substrate support device comprising a support device main body, and a backup plate provided in the support device main body and capable of mounting a backup pin for supporting the substrate,
The backup plate is composed of a transparent body,
An apparatus for supporting a substrate, comprising: an imaging unit capable of recognizing a backup pin mounting surface side through a backup plate on a side opposite to the backup pin mounting surface side of the back plate. A mounting machine in which a backup pin is detachably provided on a backup plate provided on a base, and a component is mounted on a board supported by the backup pin,
A mounting machine characterized in that the backup plate is constituted by a transparent body and is detachable from the base. A backup plate to which a backup pin for supporting a substrate can be attached,
A backup plate characterized by comprising a transparent body. A backup pin mounting method in a substrate support device having a backup plate to which a backup pin for supporting a substrate is detachable,
Prepare an independent transparent backup plate for the substrate support device,
The board was placed on a transparent backup plate, the support surface of the board was visible through the backup plate, the backup pin mounting position relative to the backup plate was specified, and the backup pin was attached to the specified position. A method for attaching a backup pin in a substrate supporting apparatus.

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