JP2008277751A5 - - Google Patents

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Publication number
JP2008277751A5
JP2008277751A5 JP2008029858A JP2008029858A JP2008277751A5 JP 2008277751 A5 JP2008277751 A5 JP 2008277751A5 JP 2008029858 A JP2008029858 A JP 2008029858A JP 2008029858 A JP2008029858 A JP 2008029858A JP 2008277751 A5 JP2008277751 A5 JP 2008277751A5
Authority
JP
Japan
Prior art keywords
bonding
connection portion
ball
wedge
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008029858A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008277751A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008029858A priority Critical patent/JP2008277751A/ja
Priority claimed from JP2008029858A external-priority patent/JP2008277751A/ja
Priority to US12/060,484 priority patent/US20080246129A1/en
Publication of JP2008277751A publication Critical patent/JP2008277751A/ja
Priority to US12/929,160 priority patent/US20110151622A1/en
Publication of JP2008277751A5 publication Critical patent/JP2008277751A5/ja
Withdrawn legal-status Critical Current

Links

JP2008029858A 2007-04-04 2008-02-12 半導体装置の製造方法、および半導体装置 Withdrawn JP2008277751A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008029858A JP2008277751A (ja) 2007-04-04 2008-02-12 半導体装置の製造方法、および半導体装置
US12/060,484 US20080246129A1 (en) 2007-04-04 2008-04-01 Method of manufacturing semiconductor device and semiconductor device
US12/929,160 US20110151622A1 (en) 2007-04-04 2011-01-05 Method of manufacturing semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007097904 2007-04-04
JP2008029858A JP2008277751A (ja) 2007-04-04 2008-02-12 半導体装置の製造方法、および半導体装置

Publications (2)

Publication Number Publication Date
JP2008277751A JP2008277751A (ja) 2008-11-13
JP2008277751A5 true JP2008277751A5 (cg-RX-API-DMAC7.html) 2011-02-24

Family

ID=40014266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008029858A Withdrawn JP2008277751A (ja) 2007-04-04 2008-02-12 半導体装置の製造方法、および半導体装置

Country Status (2)

Country Link
JP (1) JP2008277751A (cg-RX-API-DMAC7.html)
CN (1) CN101281876A (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5411553B2 (ja) * 2009-03-31 2014-02-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
US8692370B2 (en) 2009-02-27 2014-04-08 Semiconductor Components Industries, Llc Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
US8008785B2 (en) * 2009-12-22 2011-08-30 Tessera Research Llc Microelectronic assembly with joined bond elements having lowered inductance
CN102339766A (zh) * 2010-07-22 2012-02-01 上海华虹Nec电子有限公司 线路修复中的超长距离连线方法
JP2012044034A (ja) * 2010-08-20 2012-03-01 Stanley Electric Co Ltd 半導体発光装置および半導体発光装置の製造方法
CN102820236B (zh) * 2011-06-08 2015-08-26 无锡华润安盛科技有限公司 一种预塑封引线框的引线键合方法
JP2014170801A (ja) * 2013-03-01 2014-09-18 Sumitomo Electric Ind Ltd 半導体装置
JP2015146393A (ja) * 2014-02-03 2015-08-13 カルソニックカンセイ株式会社 超音波ウェッジボンディング構造
DE112018007032T5 (de) * 2018-02-07 2020-10-29 Mitsubishi Electric Corporation Keilwerkzeug, Bondvorrichtung und Bondprüfverfahren

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