JP2008270671A - Printed wiring board unit and solder inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To confirm reproducibly the characteristics (composition, component, printed state, and wettability etc.) of a solder used actually when connecting various kinds of electronic components even if a printed wiring board is shipped, in a printed wiring board which has a land for mounting at least two kinds of electronic components among a surface mounting component, a flow connection component, or a manual connection component. <P>SOLUTION: The printed wiring board unit includes: a printed wiring board 2 which has an insulating board 3 and a wiring pattern 4 formed on the surface of the insulating board; an inspection insulating board 11 which is separably connected to the printed wiring board; and an inspection wiring board 10 which has an inspection land 12 formed on the surface of the inspection insulating board. The inspection land 12 has at least one land among a reflow connection land 13 for solder-connecting the surface mounting component, a flow connection land 14 for solder-connecting the flow connection component, and a manual connection land 15 for solder-connecting the manual connection component, and a manufacturing history is displayed on it. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides a component at a shipping source even after a printed wiring board having a wiring pattern structure for mounting at least one electronic component among a surface mounting component, a flow connecting component, and a manual connecting component is shipped. The present invention relates to a printed wiring board capable of confirming and grasping the composition, printing state, wettability, and the like of solder used for connection, and a method for inspecting solder in the printed wiring board.

The printed wiring board is provided with a wiring pattern made of a conductor film on one surface or both surfaces of the insulating substrate, and various electronic components are mounted on the lands constituting the wiring pattern by solder connection.
In recent years, there has been a demand for management of the composition of solder used when various electronic components are mounted on a printed wiring board, for example, lead-free solder due to a request from environmental regulations. However, after shipping a printed wiring board on which various electronic components have been mounted at the factory, confirmation of the composition of the solder used to connect the electronic components (including confirmation of whether or not a specific component such as lead is contained) ) Is often not possible because there is no actual printed wiring board.

Japanese Patent No. 2724933 discloses a configuration in which lands for confirming the printability of solder paste used for reflow connection are formed in blank portions other than wiring paths on a printed wiring board. There is no disclosure of confirming the composition of the solder using the solder. Further, in this conventional example, since the confirmation land is arranged on the substrate body, it is inevitable that the substrate body is enlarged. Further, since the blank portion in which the confirmation land is formed is shipped together with the board body having the wiring path and does not remain at the shipping source, there is a problem that it is impossible to inspect the solder composition after shipping.
Japanese Utility Model Laid-Open No. 58-77073 discloses a configuration in which a test pattern for solder state inspection is printed on a blank portion where a print pattern is not printed. This blank portion is cut and discarded. Therefore, the solder composition is discarded after being checked, so that the solder composition cannot be inspected after shipment. Even if the margin portion is stored, managing the margin portion becomes extremely complicated.
Japanese Patent No. 2724933 Japanese Utility Model Publication No. 58-77073

  As described above, in the conventional printed wiring board provided with a special land for confirming the printed state of the solder on the land and the wettability, the purpose is to confirm the connection state of the solder. Although a test pattern is provided, the test pattern is shipped as a product in Patent Document 1, and the blank portion is discarded in Patent Document 2, so the composition of the solder could not be confirmed after shipment. . In addition to surface mount components, when other types of electronic components that are flow-connected or manually connected coexist on the same board, the composition of each solder used to connect other electronic components is inspected after shipment. I couldn't. Further, even if the product shipped can be recovered, in the conventional example of Patent Document 2, the composition of the solder sampled from the printed wiring board as to whether or not a prohibited substance is contained in the solder used for connecting the electronic components. When trying to analyze and inspect the solder, it may be difficult to extract only the prohibited substances contained in the solder itself because the components of the terminals of the electronic components connected to the solder may elute to the solder side. Met.

  The present invention has been made in view of the above, and reproducibility of the characteristics (composition, component, printing state, wettability, etc.) of the solder actually used for connecting electronic components even after shipment of the printed wiring board. It is an object of the present invention to provide a printed wiring board unit that can be well confirmed and a solder inspection method.

To achieve the above object, the invention of claim 1 is directed to an insulating substrate, a printed wiring board having a wiring pattern formed on the surface of the insulating substrate, and an inspection that is separably connected to the printed wiring board. A printed wiring board unit comprising: an insulating substrate for inspection; and an inspection wiring substrate having an inspection land formed on the surface of the insulating substrate for inspection, wherein the inspection land is connected to a surface-mounted component by soldering Manufacturing at least one of a reflow connection land, a flow connection land for solder connection of flow connection parts, and a manual connection land for solder connection of manual connection parts. It is characterized by displaying a history including a date or a production lot number.
Since the same type of inspection land as the regular land formed on the printed wiring board is formed on the inspection wiring board, it is used for inspection when soldering electronic components on various lands on the printed wiring board. By attaching the same solder to the lands, the inspection wiring board can be separated and stored for inspection. Management can be facilitated by describing characters, symbols, etc. for specifying a printed wiring board such as a manufacturing date and a manufacturing lot number on the inspection wiring board itself.

The invention according to claim 2 is separably connected to any one of the printed wiring boards, and the printed wiring boards having a plurality of connected insulating boards and wiring patterns formed on the surfaces of the respective insulating boards. A printed wiring board unit comprising an inspection insulating substrate and a single inspection wiring substrate having an inspection land formed on the surface of the inspection insulating substrate, wherein the inspection land is surface-mounted. And at least one of a reflow connection land for solder connecting parts, a flow connection land for solder connecting flow connection parts, or a manual connection land for solder connecting manual connection parts, and the print A history including a manufacturing date of a wiring board or a manufacturing lot number is displayed.
By applying the inspection land of the present invention to a printed wiring board unit in which an inspection wiring board is connected to a single printed wiring board, the inspection wiring board is separated and stored for inspection. Can be used.

According to a third aspect of the present invention, in the first or second aspect, the inspection wiring board includes a plurality of types of the inspection lands.
A method for inspecting solder in a printed wiring board unit according to a fourth aspect of the invention is the method for inspecting solder in a printed wiring board unit according to claim 1, 2 or 3, and is included in the same production lot. The composition of the solder attached to the inspection land of the inspection wiring board separated from at least one of the plurality of printed wiring boards is inspected.

  In the present invention, in the printed wiring board unit including the inspection wiring board that is separably connected to the printed wiring board, the inspection wiring board is provided with the inspection land and the manufacturing history information is displayed. If the insulation board for inspection is stored, the characteristics (composition, composition, printing state, wettability, etc.) of the solder actually used for connecting the electronic components should be confirmed with good reproducibility even after the printed wiring board is shipped. Can do.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
FIG. 1 is a plan view showing a configuration of a printed wiring board unit according to an embodiment of the present invention, and FIG. 2 is a front view showing a main configuration of the printed wiring board unit. FIG. 4B is a plan view and a bottom view showing the configuration of the inspection wiring board cut and separated.
In the embodiment of FIG. 1, the printed wiring board unit shows a configuration example in which one inspection wiring board is connected to a plurality of printed wiring boards connected to each other.
The printed wiring board unit 1 includes a printed wiring board 2 having four insulating boards 3 connected to each other in a sheet form, and a wiring pattern 4 formed on the surface of each insulating board 3, and any printed wiring board 2 An inspection insulating substrate 11 detachably connected to (insulating substrate connector 5), and a single inspection wiring substrate 10 having inspection lands 12 formed on the surface of the inspection insulating substrate; I have.

After various electronic components are solder-connected to each insulating substrate 3 constituting one printed wiring board unit 1, individual printed wiring boards 2 are completed by cutting along boundary lines. In the present embodiment, the printed wiring board 2 is a flow composed of a reflow connection land (not shown) for mounting the surface mount component A and a through hole (not shown) for mounting a flow connection component B such as a pin terminal type component to be flow connected. A printed wiring board including all three types of lands for connection, or manual connection lands (not shown) on which manual mounting components C connected by hand are mounted will be described.
On the inspection wiring board 10 side, a type of inspection land 12 corresponding to the various lands arranged on the printed wiring board 2 side is arranged, and the history including the date of manufacture and the manufacturing lot number of the printed wiring board 2 is arranged. Is provided. The display unit is disposed at an appropriate position so as not to interfere with the inspection land 12.

The inspection land 12 according to the present embodiment includes a reflow connection land 13 for mounting the surface mount component A, a flow connection land 14 including a through hole for mounting the flow connection component B to be flow-connected, and manual operation. The manual connection land 15 for mounting the manual mounting component C to be connected is included.
In the present invention, when the operation of actually setting each electronic component on the wiring pattern 4 on the printed wiring board 2 and performing solder connection is performed, the corresponding inspection land 12 in the inspection insulating substrate 11 is simultaneously applied. Then, the same solder as that used for the printed wiring board 2 is applied. Then, after the printed wiring board unit 1 is completed, the inspection wiring board 10 is cut and separated. This cutting / separating operation is performed on all printed wiring board units 1 included in the same production lot, and at least one separated inspection wiring board 10 is stored. When it is necessary to inspect the solder characteristics such as the solder component, the solder application state, the solder wettability, etc. after all the printed wiring boards 2 are shipped, the stored wiring board for inspection 10 can be used. It becomes possible.

  The printed wiring board unit 1 of the present invention includes regular lands corresponding to the three types of electronic components A, B, and C shown in FIG. 2 in the wiring pattern 4 on the printed wiring board 2, and on each land. Each corresponding electronic component is soldered. On the other hand, on each inspection land 13, 14, 15 in the inspection wiring board 10, solder used for mounting each electronic component on each regular land on the printed wiring board 2 is attached. . A plurality of printed wiring board units 1 included in one production lot all have the same configuration, and the electronic component mounting process and solder application to the inspection lands 12 are performed in the same procedure. The solder is attached on the inspection lands 12 of all the printed wiring board units 1. The inspection wiring board 10 is cut and separated from all the printed wiring board units 1 manufactured in this way, and only the printed wiring board 2 is shipped, but at least one inspection wiring board 10 is a future inspection. Stored by the manufacturer for use.

  When the inspection land 12 is the reflow connection land 13, an inspection is performed when cream solder is printed on the regular reflow connection land included in the wiring pattern 4 on the printed wiring board 2 using a mask. The solder paste is also collectively printed on the reflow connection land 13 on the wiring board 10 using a part of the same mask. Actually, the surface mounting component A is not connected to the reflow connection land 13 for inspection, and the solder is cured by heating in the reflow furnace. The solder adhered to the reflow connection land 13 on the inspection wiring board 10 separated from the printed wiring board 2 can be used for inspection later.

  When the inspection land 12 is the flow connection land 14, a pin extending from the flow connection component B in a through hole constituting a regular flow connection land included in the wiring pattern 4 on the printed wiring board 2. The terminal is inserted, and the tip of the pin terminal protrudes to the other surface of the insulating substrate 3. In this state, the lower surface of the insulating substrate is immersed in molten solder in a dip tank (not shown) to solder-connect the pin terminal and the peripheral land including the through hole. Actually, the flow connection component B is not connected to the inspection flow connection land 14, and only the solder is attached. The inspection flow connection land 14 is formed on the lower surface side of the inspection wiring board 10 so as to contact the molten solder. Note that the inspection flow connection land 14 disposed on the lower surface of the inspection wiring substrate 10 only needs to have molten solder attached when the lower surface of the insulating substrate is immersed in the dip tank, and therefore has no through holes. It may be a conductor film. The solder attached to the flow connection land 14 can be used for later inspection.

  When the inspection land 12 is the manual connection land 15, the manually mounted component C is manually placed on the regular manual connection land included in the wiring pattern 4 on the printed wiring board 2 using a soldering iron. At the time of solder connection, solder is also attached to the manual connection land 15 on the inspection wiring board 10 by manual work. In fact, the manual mounting component C is not connected to the manual connection land 15 for inspection, and only the solder is adhered. The solder attached to the manual connection land 15 on the inspection wiring board 10 separated from the printed wiring board 2 can be used for inspection later.

In the above embodiment, a configuration example in which one inspection wiring board 10 is connected to a plurality of connected printed wiring boards 2 has been described. However, it is formed on a single insulating substrate 3 and an insulating substrate surface. Single printed wiring board 2 having wiring pattern 4, inspection insulating substrate 11 detachably connected to printed wiring board 2, and inspection land formed on the surface of the inspection insulating substrate The present invention may be applied to a printed wiring board unit including the inspection wiring board 10 having 12 (not shown).
That is, also in this case, by providing the inspection land and the display section as the inspection land, it is possible to perform the solder characteristic inspection using the inspection wiring board stored in the manufacturer.

  According to the printed wiring board having the above-described configuration, it adheres to the inspection land of the inspection wiring board separated from at least one of the plurality of printed wiring board units included in the same production lot. Since the solder was inspected, the characteristics (composition, composition, printing state, wettability, etc.) of the solder actually used when connecting different types of electronic components even after shipment of the printed wiring board were reproducible. Can be confirmed.

It is a top view which shows the structure of the printed wiring board which concerns on one Embodiment of this invention. It is a front view which shows the principal part structure of the printed wiring board of FIG. (A) And (b) is the top view and bottom view which show the structure of the wiring board for an inspection cut-separated.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Printed wiring board unit, 2 ... Printed wiring board, 3 ... Insulating board, 4 ... Wiring pattern, 5 ... Insulating board coupling body, 10 ... Inspection wiring board, 11 ... Inspection insulating board, 12 ... Inspection land, DESCRIPTION OF SYMBOLS 13 ... Land for reflow connection, 14 ... Land for flow connection, 15 ... Land for manual connection, 16 ... Display part, A, B, C ... Electronic component.

Claims (4)

An insulating substrate, a printed wiring board having a wiring pattern formed on the surface of the insulating substrate, an inspection insulating substrate connected to the printed wiring board in a separable manner, and the inspection insulating substrate surface A printed wiring board unit comprising an inspection wiring board having an inspection land,
The inspection land is at least one of a reflow connection land for solder-connecting surface mount components, a flow connection land for solder-connecting flow connection components, or a manual connection land for solder-connecting manual connection components. And a history including the manufacturing date of the printed wiring board or the manufacturing lot number is displayed. A plurality of coupled insulating substrates, a printed wiring board having a wiring pattern formed on each insulating substrate surface, an insulative insulating substrate connected separably to any one of the printed wiring boards, and the A printed wiring board unit comprising a single inspection wiring board having inspection lands formed on an inspection insulating substrate surface,
The inspection land is at least one of a reflow connection land for solder-connecting surface mount components, a flow connection land for solder-connecting flow connection components, or a manual connection land for solder-connecting manual connection components. And a history including the manufacturing date of the printed wiring board or the manufacturing lot number is displayed.   The printed wiring board unit according to claim 1, wherein the inspection wiring board includes a plurality of types of the inspection lands. A method for inspecting the solder in the printed wiring board unit according to claim 1, 2 or 3,
Printed wiring comprising: inspecting a composition of solder adhered to an inspection land of the inspection wiring board separated from at least one of the plurality of printed wiring boards included in the same production lot. A method for inspecting solder in a board unit.

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